JPS63197336U - - Google Patents
Info
- Publication number
- JPS63197336U JPS63197336U JP1987088148U JP8814887U JPS63197336U JP S63197336 U JPS63197336 U JP S63197336U JP 1987088148 U JP1987088148 U JP 1987088148U JP 8814887 U JP8814887 U JP 8814887U JP S63197336 U JPS63197336 U JP S63197336U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chips
- semiconductor
- bonding wires
- sealed
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088148U JPS63197336U (enExample) | 1987-06-08 | 1987-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088148U JPS63197336U (enExample) | 1987-06-08 | 1987-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197336U true JPS63197336U (enExample) | 1988-12-19 |
Family
ID=30945996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987088148U Pending JPS63197336U (enExample) | 1987-06-08 | 1987-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197336U (enExample) |
-
1987
- 1987-06-08 JP JP1987088148U patent/JPS63197336U/ja active Pending