JPS63195731U - - Google Patents
Info
- Publication number
- JPS63195731U JPS63195731U JP1987087048U JP8704887U JPS63195731U JP S63195731 U JPS63195731 U JP S63195731U JP 1987087048 U JP1987087048 U JP 1987087048U JP 8704887 U JP8704887 U JP 8704887U JP S63195731 U JPS63195731 U JP S63195731U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- pattern
- bonding
- lead frame
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087048U JPS63195731U (enExample) | 1987-06-04 | 1987-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087048U JPS63195731U (enExample) | 1987-06-04 | 1987-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195731U true JPS63195731U (enExample) | 1988-12-16 |
Family
ID=30943914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987087048U Pending JPS63195731U (enExample) | 1987-06-04 | 1987-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195731U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02193555A (ja) * | 1989-01-19 | 1990-07-31 | Matsushita Electric Ind Co Ltd | 制御回路付フラットモータ |
| JPH03229439A (ja) * | 1990-02-05 | 1991-10-11 | Marine Instr Co Ltd | ワイヤリング検査可能なワイヤボンディング装置及びその方法並びにワイヤリング自動検査装置 |
| JPH03229440A (ja) * | 1990-02-05 | 1991-10-11 | Marine Instr Co Ltd | ワイヤリング検査可能なワイヤボンディング装置 |
-
1987
- 1987-06-04 JP JP1987087048U patent/JPS63195731U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02193555A (ja) * | 1989-01-19 | 1990-07-31 | Matsushita Electric Ind Co Ltd | 制御回路付フラットモータ |
| JPH03229439A (ja) * | 1990-02-05 | 1991-10-11 | Marine Instr Co Ltd | ワイヤリング検査可能なワイヤボンディング装置及びその方法並びにワイヤリング自動検査装置 |
| JPH03229440A (ja) * | 1990-02-05 | 1991-10-11 | Marine Instr Co Ltd | ワイヤリング検査可能なワイヤボンディング装置 |