JPS63194398A - Air-cooled electronic equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in cooling means for component mounting boards housed in parallel in a housing of an electronic device.

[Conventional technology]

FIG. 3 is a perspective view showing a conventional air-cooled electronic device of this type. In FIG.
3: is the U-shaped receiver formed on this lower bottom plate.

(4) Each of these receivers is an intake port opened between the parts, (5)
(61d) is a U-shaped receiver formed on the lower surface of the top plate, (7) is an exhaust port opened between each of these receivers, (811-j: Cooling fan installed opposite the mouth, (9) is the left side plate forming part of the housing (110 peripheral wall), +1 (I is also the right side plate, cIυ and a are the front opening and rear opening between these two side plates) C3 is a front plate and a rear plate that close the front plate and the rear plate, which together with the above-mentioned side plates form a part of the peripheral wall of the casing (110). A plurality of component mounting boards are attached to the housing, and both upper and lower ends of each of the above-mentioned receivers are engaged with the housing +1.
1 and are housed in a parallel state.

In other words, FIG. 4 shows each of the above component mounting boards a inside the housing
3 is a sectional view showing a state in which the air inlet (4) is stored, air is taken in through the intake port (4), flows along each component mounting board I as shown by the arrows, and is discharged from the exhaust port (7) to the outside by the cooling fan (8). It is designed to be discharged.

[Problem that the invention seeks to solve]

Conventional air-cooled electronic devices are configured as described above, but recently, the density of component mounting boards housed inside the housing has increased, and the amount of heat generated within the housing has increased, so cooling fans have become more expensive. wind t
need to be increased. However, on the other hand, the miniaturization of equipment,
There is also a demand for lower noise, so there is a limit to how large the cooling fan can be.

This invention solves the above problems and uses a cooling fan! - The purpose is to enhance the cooling effect of circuit components on each component mounting board of the interior without increasing the temperature.

[Means for solving problems]

In the case of this invention, the middle part of the casing is narrowed inward over a predetermined length range depending on the arrangement length of the circuit components on the internal component mounting board to increase the flow velocity of cooling air passing through the core part. I'm letting you do it.

[Effect]

In the case of this invention, since a part of the peripheral wall of the casing is constricted inward, the flow velocity of cooling air passing through the core increases,
This increases the cooling effect of the circuit components.

〔Example〕

An embodiment of this invention will be described below. That is, in FIGS. 1 and 2, parts that are the same as those in the conventional system are denoted by the same reference numerals, and redundant explanation thereof will be omitted. As shown in the figure, the left side plate (9) and the right side plate (I ), which narrows the flow path of the cooling air, and with this configuration, the flow velocity of the cooling air through the core is lower than that of the conventional case. This is something that is gradually increasing.

In the above embodiment, the air passage inside the housing (1+) is connected to the left side plate (9).
) and the right side plate αG, but the deformation for this narrowing may be done only on one side plate, and the state of deformation is not necessarily specified as shown in the figure, but may be triangular or Of course, it may also be shaped into a semi-circular shape.

〔Effect of the invention〕

Since the air-cooled electronic device of the present invention is configured as described above, it is possible to enhance the cooling effect of the circuit components on each component mounting board without increasing the air volume of the cooling fan used. This has the effect that the device can be made smaller and have lower noise.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an embodiment of the air-cooled electronic device of the present invention with the front panel removed, Fig. 2 is a vertical sectional view thereof, and Fig. 3 is a conventional example equivalent to Fig. 1. The perspective view and FIG. 4 are vertical sectional views of a conventional example corresponding to FIG. 2. In addition, in the figure (11 is the housing, (13 is the component mounting board, (
13m) is a circuit component. In other figures, the same reference numerals indicate the same parts.

Claims (1)

[Claims] Equipped with a housing in which a plurality of component mounting boards on which a plurality of circuit components are mounted along the longitudinal direction are housed in a parallel state,
In this case, cooling air is passed through the housing along each of the component mounting boards, and the middle of the housing surrounding the circuit components on each of the component mounting boards is arranged according to the arrangement length of the circuit components. 1. An air-cooled electronic device characterized in that the cooling air is narrowed inward over a predetermined length range to increase the flow velocity of cooling air passing through the portion.