JPS6012319Y2 - Heat dissipation structure of electronic equipment - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to a heat dissipation structure for an electronic device.

With the development of integrated circuits, electronic components built into electronic devices (
At present, as the packaging density of electronic devices (elements) is increasing significantly, the heat density per unit volume generated from the electronic components is also increasing proportionately.

Conventional electronic devices consist of electronic circuit blocks in which multiple electronic circuit packages each having a plurality of electronic components mounted on a printed circuit board are arranged horizontally and vertically at two regular intervals. The heat generated from the electronic components is absorbed by the air flow passing through the space provided between the electronic circuit packages, and the air flow is directed to the upper part of the electronic device or It is discharged from an opening formed in the middle part.

In a conventional electronic device having such a configuration, air flows in through an opening provided at the bottom of the electronic device and flows upward while absorbing heat generated from the electronic components. The temperature of the air rises.

The temperature of the air at this time must be below the maximum allowable temperature for electronic components.

For this reason, in conventional devices, a dummy space is provided between the electronic circuit blocks, the electronic device is divided into a plurality of blocks, the heat accumulation from the lower stage is alleviated, and a convection guide plate is inserted into the dummy space. As a result, a structure is adopted in which cold air is taken in from the back of the device and exhausted from the front of the device for each electronic circuit block to reduce the temperature.

However, generally, a cable duct is provided on the back side of an electronic device to accommodate the wiring connecting each electronic circuit block and the external wire (wiring connecting the electronic devices).
When the amount of cables housed in this duct is large, a sufficient amount of cold air cannot be sucked in to maintain the temperature inside the device below the specified temperature.

On the other hand, the amount of cables between electronic circuit blocks and the amount of external cables are increasing as electronic components are integrated at a higher density, and as a result, conventional device structures pose a major obstacle to promoting higher density.

In addition, in order to make effective use of the floor space in the room where electronic devices are installed, when devices of the same or different types are installed with their backs facing each other, or when they are installed close to a wall in the room, cool air from the back can be used. cannot be expected to be inhaled, the temperature inside the device increases, and thermal reliability decreases.

An object of the present invention is to provide a heat dissipation structure that eliminates the above-mentioned cutout.

The heat dissipation structure of the present invention includes an air intake duct provided on both sides of an electronic circuit block and having a plurality of air intake holes on each front surface, a shelf section separating the electronic circuit blocks, and a front upper part to a rear lower part of the shelf part. a side plate provided on the side surface of the lower space of the shelf separated into two upper and lower spaces by the inclined plate; and a side plate provided on the front surface of the shelf. The front cover has a plurality of heat dissipation holes, and an air intake/exhaust separator.

Next, the present invention will be explained in detail with reference to the drawings.

FIG. 1 and FIG. 2 are a perspective view and a sectional view, respectively, showing a conventional electronic device.

In the figure, the reference number 1 is an electronic circuit package on which an electronic component 7 is mounted, and the reference number 2 is the electronic circuit package 1.
is a plurality of electronic circuit blocks mounted horizontally and vertically, and the same number 3 is a shelf part provided between each electronic circuit block 2 where no electronic circuit package 1 is mounted, and has a heat dissipation hole 9 in the front cover. There is a shelf 3 inside the shelf 3.
A convection guide plate 8 is provided that slopes downward from the front to the rear.

Further, reference numerals 4 and 5 are cable ducts in which cables 6 for interconnection between the electronic circuit blocks 2 and external line connections are accommodated, and numeral 10 is a back cover having an air intake hole 11.

Reference numeral 12 is a wiring board that connects the electronic circuit packages 1, and the plug 13 that connects each electronic circuit package 1 and the plug 14 that connects each two electronic circuit blocks and external lines are mounted on both sides. Implemented separately.

In such a conventional structure, the heat generated from the electronic circuit block 2 is absorbed through the air intake hole 1 provided in the back cover 10 of the device.
The heat is transmitted from the cable duct 1 to the cold air 15 led to the shelf 3 at the bottom of the electronic circuit block 2, and is radiated from the heat radiation hole 9 of the shelf 3 at the top of the electronic circuit block 2. air intake is obstructed.

Further, as shown in FIG. 3, when devices of the same type or different types are installed on the back side, it is not expected that cold air will be drawn directly from the back side of the device.

Therefore, the air 15 can be sucked in slowly from the opening at the bottom of the rear cable duct 4, but the air 15 absorbs the heat generated from the electronic circuit block 2 on the way while rising, so it heads toward the upper stage. As the temperature of the air 15 increases, efficient heat dissipation cannot be obtained.

FIG. 4 is a perspective view showing an embodiment of the present invention.

In the figures, parts corresponding to those in FIGS. 1 and 3 are denoted by the same numerals.

In this embodiment, reference numeral 16 denotes an inclined plate 16' provided in the shelf 3 that slopes from the front upper part to the rear lower part of the shelf 3.
and a side plate 16'' provided on the side surface of the lower space of the shelf section 3 separated into two upper and lower spaces by the inclined plate 16'.
It is an intake/exhaust separator consisting of a plurality of heat dissipation holes 9 provided on the front surface of the shelf section 3 and a front cover 16'', and an intake section 19 is formed on the side surface of the space above the shelf section 3. .

Reference numeral 17 is an air intake duct which has an air intake hole 18 on the front surface and is disposed close to both sides of the electronic circuit block 2 over the top and bottom of the rack, and is configured to be continuous with the air intake section 19.

In this structure, heat dissipation is performed as follows.

That is, cold air 15 is taken in from the intake holes 18 of the intake ducts 17 on both sides, and this cold air 15 passes through the intake part 19 and is sent to the electronic circuit package 2, absorbs the heat generated by the electronic circuit package 2, and Front cover 1 of separator 16
6 '' is exhausted from the heat radiation hole 3.

In this way, in the structure of this embodiment, the air flow 15 is not obstructed by the cables inside the device and the installation conditions of the device, so that sufficient cold air can be taken in and the temperature inside the electronic circuit package 2 can be controlled extremely efficiently. increase can be suppressed.

As described above, the present invention has the effect of improving heat dissipation efficiency and reliability of the device, and reducing the installation floor area of the device.

Note that the intake duct 17 may be divided into electronic circuit blocks.

[Brief explanation of the drawing]

1 and 2 are a perspective view and a sectional view showing a conventional example, respectively, FIG. 3 is a sectional view showing a state in which two conventional devices are installed, and FIG. 4 is a perspective view showing an embodiment of the present invention. It is a diagram. In the figure, 1...electronic circuit package, 2...
...Electronic circuit block, 3...Shelf section, 4
, 5...Cable duct, 6...Cable, 8...Convection guide plate, 9...Radiation hole, 10...Back side Cuckoo, 11...
Intake hole, 12... Wiring board, 13.14...
...Connection, 15... Air flow, 16...
Shelf section, 16'... Inclined plate, 16''...
Side plate, 16"...Front panel, 17.
...Intake duct, 18...Intake hole, 19
...Intake part.

Claims (1)

[Scope of utility model registration request] In an electronic device having a rack structure in which a plurality of electronic circuit blocks are arranged vertically in the vertical direction, each of which has a plurality of electronic circuit packages in which electronic components, which are heating elements, are mounted in a high-density manner. , an air intake duct provided on both sides of the electronic circuit block and each having a plurality of air intake holes on the front surface; a shelf separating the electronic circuit blocks; an inclined plate provided, a side plate provided on a side surface of a lower space of the shelf portion separated into two upper and lower spaces by the inclined plate, and a plurality of heat radiation holes provided in the front surface of the shelf portion; 1. A heat dissipation structure for an electronic device, comprising: a front cover having an intake/exhaust separator;