JPS63194310A - Glass sealed thermistor - Google Patents
Glass sealed thermistorInfo
- Publication number
- JPS63194310A JPS63194310A JP2794087A JP2794087A JPS63194310A JP S63194310 A JPS63194310 A JP S63194310A JP 2794087 A JP2794087 A JP 2794087A JP 2794087 A JP2794087 A JP 2794087A JP S63194310 A JPS63194310 A JP S63194310A
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- electrode
- glass
- paste
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 11
- 239000002003 electrode paste Substances 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 229910018054 Ni-Cu Inorganic materials 0.000 description 2
- 229910018481 Ni—Cu Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910018651 Mn—Ni Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
皮椎公里
本発明は、サーミスタ素体表面に電極を設けると共にこ
の電極にリード線を接続してガラスで被覆したガラス封
入型サーミスタに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a glass-encapsulated thermistor in which an electrode is provided on the surface of the thermistor body, a lead wire is connected to the electrode, and the electrode is covered with glass.
従来 とその間 懺
一般に、温度センサとしては、サーミスタ素体表面に電
極を焼付形成し、この電極にリード線を接続してガラス
で被覆したサーミスタを用いている。この様なサーミス
タは、従来、１１００〜１４００℃程度の温度で焼結し
たサーミスタ素体の表面にペースト状のＡｇ 、 Ｐｔ
、 Ａｇ−Ｐｄ 、 Ａｕ等の電極素材を塗布し８０
０〜１１００℃の温度で焼付けて電極を形成し、この様
に形成した電極にジュメット線（Ｎｉ−Ｃｕ合金）等の
リード線をＡｕペースト等を接着剤として７００〜９０
０℃程度の温度で焼付けることによって接着し、さらに
ガラスで被覆して製造されていた。Conventional and Interval In general, as a temperature sensor, a thermistor is used in which an electrode is baked onto the surface of the thermistor body, a lead wire is connected to the electrode, and the thermistor is covered with glass. Conventionally, such thermistors are made by applying paste-like Ag or Pt to the surface of the thermistor body, which is sintered at a temperature of about 1100 to 1400°C.
, Ag-Pd, Au, etc. are coated with 80
An electrode is formed by baking at a temperature of 0 to 1100°C, and a lead wire such as Dumet wire (Ni-Cu alloy) is attached to the electrode formed in this way using Au paste or the like as an adhesive.
It was manufactured by bonding by baking at a temperature of about 0°C and then covering it with glass.
しかしながら、以上のサーミスタでは、焼結済みのサー
ミスタ素体表面に電極を焼付形成するため、サーミスタ
素体と電極との結合が密になりに＜＜、サーミスタ素体
の特性が安定しなくなる問題点を有し、この問題点はガ
ラス封入を行なう場合には顕著であった。また、サーミ
スタ素体の焼結時と電極の焼付時との二度に分けて数１
００°Ｃ以上の高温を加えなければならず、製造工程が
面倒になると共にコスト高となる問題点をも有していた
。However, in the thermistor described above, since the electrodes are baked onto the surface of the sintered thermistor element, the bond between the thermistor element and the electrode becomes tight, resulting in the problem that the characteristics of the thermistor element become unstable. This problem was noticeable when glass encapsulation was performed. In addition, it is divided into two parts: when sintering the thermistor body and when baking the electrodes.
It is necessary to apply a high temperature of 00°C or more, which has the problem of making the manufacturing process complicated and increasing costs.
そこで、本発明の目的は、サーミスタ素体と電極との結
合を密にしてサーミスタの特性を安定させると共に、製
造工程数を省き製造コストを安価にすることのできるガ
ラス封入型サーミスタを提供することにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a glass-encapsulated thermistor that can tightly bond the thermistor body and electrodes to stabilize the characteristics of the thermistor, as well as reduce the number of manufacturing steps and reduce manufacturing costs. It is in.
５１点を 決するための手段
前記目的を達成するため、本発明に係るガラス封入型サ
ーミスタは、焼結によってサーミスタ素体となるグリー
ンシートの表面に電極ペーストを塗布後焼結して電極を
形成すると共に、この電極にガラス封入ができるリード
線の先端をペーストの熱処理にて接続し、サーミスタ素
体をリード線の先端と共にガラスで被覆したことを特徴
とする。Means for Determining 51 Points In order to achieve the above object, the glass-encapsulated thermistor according to the present invention applies an electrode paste to the surface of a green sheet that becomes the thermistor body by sintering, and then sintering it to form electrodes. Additionally, the tip of a lead wire that can be sealed with glass is connected to this electrode by heat treatment of paste, and the thermistor body is covered with glass together with the tip of the lead wire.
正−月
即ち、表面に電極ペーストを塗布したグリーンシートを
焼結することから、電極ペーストがグリーンシートの内
部にくい込んだ形で焼き締まり、焼結後のサーミスタ素
体と電極との結合が密になり、６００〜７００℃の高温
でガラス封入処理を行なっても、サーミスタ素体の特性
がそのまま確実に電極に現れ、サーミスタとしての特性
が安定する。In other words, since the green sheet whose surface is coated with electrode paste is sintered, the electrode paste is embedded inside the green sheet and sintered, creating a tight bond between the thermistor element and the electrode after sintering. Therefore, even if the glass encapsulation treatment is performed at a high temperature of 600 to 700° C., the characteristics of the thermistor body will surely appear in the electrode as they are, and the characteristics as a thermistor will be stabilized.
同様に、グリーンシートと電極ペーストとを同時に焼結
することから、焼結工程の一部が省略される。Similarly, since the green sheet and the electrode paste are sintered at the same time, part of the sintering process is omitted.
衷１刻
第１図は本発明に係るガラス封入型サーミスタの一実施
例を示し、１はグリーンシートから焼結されたサーミス
タ素体、２は同時に焼結された電極である。４はリード
線で、その先端は電極２にペースト５を介して接続され
ている。６はガラスで、サーミスタ素体１をリード線４
の先端と共に被覆している。FIG. 1 shows an embodiment of a glass-encapsulated thermistor according to the present invention, in which 1 is a thermistor body sintered from a green sheet, and 2 is an electrode sintered at the same time. 4 is a lead wire, the tip of which is connected to the electrode 2 via a paste 5. 6 is glass, and the thermistor element 1 is connected to the lead wire 4.
It is covered along with the tip of.
次に、以上の構成からなるガラス封入型サーミスタの製
造工程について説明する。Next, the manufacturing process of the glass-encapsulated thermistor having the above structure will be explained.
まず、サーミスタ素体として、例えば、金属酸化物系材
料（Ｍｎ−ＮｉやＭｎ−Ｎｉ−Ｃｏ系等）を秤量、混合
しく第１工程）、原料によっては仮焼・粉砕を行なう（
第２工程）０次に、前記原料にバインダを混合しく第３
工程）、シート状に形成する（第４工程）、第１図（Ａ
）はこの様にして形成きれたグリーンシート１゛の形状
を示す。このグリーンシート１゛は厚さ０．２〜０．３
ｍｍ程度のシート状に形成きれている。First, for the thermistor element, for example, a metal oxide material (Mn-Ni, Mn-Ni-Co, etc.) is weighed and mixed (first step), and depending on the raw material, calcined and pulverized (
2nd step) 0 Next, the third step is to mix a binder into the raw materials.
Step), Forming into a sheet (4th step), Figure 1 (A
) shows the shape of the green sheet 1'' formed in this manner. This green sheet 1゛ has a thickness of 0.2 to 0.3
It is formed into a sheet shape of about mm.
次に、前記グリーンシート１゛の表裏面にＰｔ 、 Ａ
ｇ−ｐｔ 、 ７ｋｕ等をペースト状にした電極ペース
トを塗布する（第５工程）、この電極ペーストを塗布し
たグリーンシート１″を１１００〜１４００℃程度の温
度で焼結する（第６エ程）、第１図（Ｂ）はこの様に焼
結されたサーミスタ素体１を示し、サーミスタ素体１の
表裏面には電極２が焼付られている。この様にして形成
されたサーミスタ素体１を各チップが所定の抵抗値とな
る様にカッティングライン３の位置を調整し、このライ
ン３に沿ってダイシングマシン、レーザカット等を用い
カッティングする（第７エ程）。Next, Pt and A were applied to the front and back surfaces of the green sheet 1.
Apply an electrode paste made of g-pt, 7ku, etc. in paste form (5th step), and sinter the green sheet 1'' coated with this electrode paste at a temperature of about 1100 to 1400°C (6th step) , FIG. 1(B) shows the thermistor element 1 sintered in this way, and electrodes 2 are baked on the front and back surfaces of the thermistor element 1.The thermistor element 1 formed in this way The position of the cutting line 3 is adjusted so that each chip has a predetermined resistance value, and cutting is performed along this line 3 using a dicing machine, laser cutting, etc. (seventh step).
次に、電極ｚ上にＡｕ 、 Ａｇ等の接着ペースト５で
ジュメット線（Ｎｉ−Ｃｕ合金）等のり−ド１１１４を
、１５０〜３００℃程度の温度で接着ペースト５を乾燥
許せて取り付けると共に、７００〜９００℃で焼付ける
（第８工程）、第１図（Ｃ）はこの様にしてリード［４
が接続されたサーミスタ１１を示し、サーミスタ素体１
の電極２にはリード線４の先端が接着ペースト５によっ
て接続されている。Next, a glue 1114 such as a Dumet wire (Ni-Cu alloy) is attached onto the electrode z using an adhesive paste 5 such as Au or Ag, while allowing the adhesive paste 5 to dry at a temperature of about 150 to 300°C. Baking at ~900℃ (8th step), Figure 1 (C) shows the lead [4
indicates the thermistor 11 connected, and the thermistor body 1
The tip of a lead wire 4 is connected to the electrode 2 by an adhesive paste 5.
続いて、以上の様にして形成されたサーミスタ１１をガ
ラスコーティングする（第９工程）、第１図（Ｄ）はこ
のガラスコーティングの方法を示し、サーミスタ１１に
ガラスキャップ６を被せた後、６００〜７００°Ｃ程度
の温度でガラスキャップ６を軟化させてサーミスタ１１
の表面に密着させる。第１図（Ｅ）はこの様にして製造
されたガラス封入型サーミスタを示し、サーミスタ素体
１の周囲はり一部Ｉ！４の先端と共にガラス６でコーテ
ィングされている。Next, the thermistor 11 formed as described above is coated with glass (9th step). FIG. 1(D) shows this glass coating method. The thermistor 11 is made by softening the glass cap 6 at a temperature of ~700°C.
adhere to the surface of the FIG. 1(E) shows a glass-encapsulated thermistor manufactured in this manner, in which a portion of the periphery of the thermistor body 1 is I! It is coated with glass 6 along with the tip of 4.
なお、本発明に係るガラス封入型サーミスタは前記実施
例に限定するものではなく、その要旨の範囲内で種々に
変形することができる。例えば、サーミスタ素体１のカ
ッティング（第７エ程）は焼結工程（第６エ程）の前に
行なってもよい。Note that the glass-encapsulated thermistor according to the present invention is not limited to the embodiments described above, and can be modified in various ways within the scope of the gist. For example, the cutting of the thermistor body 1 (seventh process) may be performed before the sintering process (sixth process).
λ里五力１
以上の説明で明らかな様に、本発明によれば、グリーン
シートと電極ペーストとを同時に焼結したため、焼結時
に電極ペーストがグリーンシ一トの空間部に侵入して焼
き締まり、焼結後のサーミスタ素体と電極との結合が密
になり、例え、その後高温でガラス封入処理を行なって
も、サーミスタ素体の特性をそのまま電極に伝えること
ができ、サーミスタとしての特性が安定化する。また、
従来の如くグリーンシートと電極ペーストとの焼結を別
工程で行なう必要はなく、焼結工程の一部が省略され、
製造コストも安価となる。As is clear from the above explanation, according to the present invention, since the green sheet and the electrode paste are sintered at the same time, the electrode paste invades the space of the green sheet during sintering and is burned. After tightening and sintering, the bond between the thermistor element and the electrode becomes tighter, and even if the thermistor element is subsequently sealed with glass at high temperatures, the characteristics of the thermistor element can be transferred to the electrode as is, maintaining the characteristics of the thermistor. is stabilized. Also,
There is no need to sinter the green sheet and electrode paste in a separate process as in the past, and part of the sintering process is omitted.
Manufacturing costs are also low.
第１８０は本発明に係るガラス封入型サーミスタの一実
施例を製造工程順に示す斜視図、第２図はその工程図で
ある。
１゛・・・グリーンシート、１・・・サーミスタ素体、
２・・・電極、４・・・リード線、５・・・接着ペース
ト、６・・・ガラスキャップ、１１・・・サーミスタ。180 is a perspective view showing an embodiment of the glass-encapsulated thermistor according to the present invention in the order of manufacturing steps, and FIG. 2 is a process diagram thereof. 1゛...Green sheet, 1...Thermistor element,
2... Electrode, 4... Lead wire, 5... Adhesive paste, 6... Glass cap, 11... Thermistor.
Claims (1)
トの表面に電極ペーストを塗布後焼結して電極を形成す
ると共に、この電極にガラス封入ができるリード線の先
端をペーストの熱処理にて接続し、サーミスタ素体をリ
ード線の先端と共にガラスで被覆したことを特徴とする
ガラス封入型サーミスタ。(1) Electrode paste is applied to the surface of the green sheet, which becomes the thermistor element by sintering, and then sintered to form an electrode, and the tip of the lead wire, which can be sealed with glass, is connected to this electrode by heat treatment of the paste. , a glass-encapsulated thermistor characterized in that the thermistor body and the tip of the lead wire are covered with glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2794087A JPS63194310A (en) | 1987-02-09 | 1987-02-09 | Glass sealed thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2794087A JPS63194310A (en) | 1987-02-09 | 1987-02-09 | Glass sealed thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63194310A true JPS63194310A (en) | 1988-08-11 |
Family
ID=12234894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2794087A Pending JPS63194310A (en) | 1987-02-09 | 1987-02-09 | Glass sealed thermistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63194310A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010153665A (en) * | 2008-12-25 | 2010-07-08 | Mitsubishi Materials Corp | Thermistor element and method of manufacturing the same |
| JP2010161334A (en) * | 2008-12-11 | 2010-07-22 | Mitsubishi Materials Corp | Method of manufacturing thermistor element, and thermistor element |
-
1987
- 1987-02-09 JP JP2794087A patent/JPS63194310A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010161334A (en) * | 2008-12-11 | 2010-07-22 | Mitsubishi Materials Corp | Method of manufacturing thermistor element, and thermistor element |
| JP2010153665A (en) * | 2008-12-25 | 2010-07-08 | Mitsubishi Materials Corp | Thermistor element and method of manufacturing the same |
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