JPS63193850U - - Google Patents
Info
- Publication number
- JPS63193850U JPS63193850U JP8648387U JP8648387U JPS63193850U JP S63193850 U JPS63193850 U JP S63193850U JP 8648387 U JP8648387 U JP 8648387U JP 8648387 U JP8648387 U JP 8648387U JP S63193850 U JPS63193850 U JP S63193850U
- Authority
- JP
- Japan
- Prior art keywords
- silicon chip
- brazing material
- metal electrodes
- electrode
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第1図a,b,cはこの考案の一実施例を示す
半導体装置の正面図、要部の拡大斜視図および断
面側面図、第2図a,b,cは従来の半導体装置
の正面図、要部の拡大斜視図および断面側面図で
ある。 図において、1,2,3は金属電極、1RはR
部、4はシリコンチツプ、5,7はろう材、6は
放熱板である。なお、各図中の同一符号は同一ま
たは相当部分を示す。
半導体装置の正面図、要部の拡大斜視図および断
面側面図、第2図a,b,cは従来の半導体装置
の正面図、要部の拡大斜視図および断面側面図で
ある。 図において、1,2,3は金属電極、1RはR
部、4はシリコンチツプ、5,7はろう材、6は
放熱板である。なお、各図中の同一符号は同一ま
たは相当部分を示す。
Claims (1)
- 互いに離されて配置された3つの金属電極のう
ち1つの金属電極の先端部分の一主面にシリコン
チツプがろう材を介して固着され、前記シリコン
チツプ上部の電極と他の2つの金属電極との間を
電気的に接続し、樹脂により封止した構造の半導
体装置において、前記シリコンチツプを固着する
金属電極のろう材が残留する角部をR部に形成し
たことを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8648387U JPS63193850U (ja) | 1987-06-03 | 1987-06-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8648387U JPS63193850U (ja) | 1987-06-03 | 1987-06-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63193850U true JPS63193850U (ja) | 1988-12-14 |
Family
ID=30942824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8648387U Pending JPS63193850U (ja) | 1987-06-03 | 1987-06-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63193850U (ja) |
-
1987
- 1987-06-03 JP JP8648387U patent/JPS63193850U/ja active Pending