JPS63193847U - - Google Patents
Info
- Publication number
- JPS63193847U JPS63193847U JP8640087U JP8640087U JPS63193847U JP S63193847 U JPS63193847 U JP S63193847U JP 8640087 U JP8640087 U JP 8640087U JP 8640087 U JP8640087 U JP 8640087U JP S63193847 U JPS63193847 U JP S63193847U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- sealing resin
- molded semiconductor
- side surfaces
- led out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 3
- 239000002344 surface layer Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8640087U JPS63193847U (xx) | 1987-06-02 | 1987-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8640087U JPS63193847U (xx) | 1987-06-02 | 1987-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193847U true JPS63193847U (xx) | 1988-12-14 |
Family
ID=30942671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8640087U Pending JPS63193847U (xx) | 1987-06-02 | 1987-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193847U (xx) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596844B2 (ja) * | 1973-06-22 | 1984-02-15 | バイエル アクチエンゲゼルシヤフト | 駆虫剤液体組成物 |
| JPS6025258A (ja) * | 1983-07-21 | 1985-02-08 | Nec Corp | 樹脂封止型半導体装置 |
| JPS6027444B2 (ja) * | 1977-08-30 | 1985-06-28 | 日本電気株式会社 | 空中線サイドロ−ブ受信信号抑圧装置 |
-
1987
- 1987-06-02 JP JP8640087U patent/JPS63193847U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596844B2 (ja) * | 1973-06-22 | 1984-02-15 | バイエル アクチエンゲゼルシヤフト | 駆虫剤液体組成物 |
| JPS6027444B2 (ja) * | 1977-08-30 | 1985-06-28 | 日本電気株式会社 | 空中線サイドロ−ブ受信信号抑圧装置 |
| JPS6025258A (ja) * | 1983-07-21 | 1985-02-08 | Nec Corp | 樹脂封止型半導体装置 |