JPS6319341B2 - - Google Patents
Info
- Publication number
- JPS6319341B2 JPS6319341B2 JP56075275A JP7527581A JPS6319341B2 JP S6319341 B2 JPS6319341 B2 JP S6319341B2 JP 56075275 A JP56075275 A JP 56075275A JP 7527581 A JP7527581 A JP 7527581A JP S6319341 B2 JPS6319341 B2 JP S6319341B2
- Authority
- JP
- Japan
- Prior art keywords
- paper
- decorative
- board
- particle board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002245 particle Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 7
- 239000011241 protective layer Substances 0.000 claims 2
- 238000003786 synthesis reaction Methods 0.000 claims 1
- 238000005520 cutting process Methods 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 238000012805 post-processing Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7527581A JPS57189847A (en) | 1981-05-19 | 1981-05-19 | Decorative particle board and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7527581A JPS57189847A (en) | 1981-05-19 | 1981-05-19 | Decorative particle board and its manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57189847A JPS57189847A (en) | 1982-11-22 |
JPS6319341B2 true JPS6319341B2 (US20020051482A1-20020502-M00012.png) | 1988-04-22 |
Family
ID=13571509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7527581A Granted JPS57189847A (en) | 1981-05-19 | 1981-05-19 | Decorative particle board and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57189847A (US20020051482A1-20020502-M00012.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5045073U (US20020051482A1-20020502-M00012.png) * | 1973-08-24 | 1975-05-07 | ||
JPS5230188A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Process for producing smiconductor device |
-
1981
- 1981-05-19 JP JP7527581A patent/JPS57189847A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5045073U (US20020051482A1-20020502-M00012.png) * | 1973-08-24 | 1975-05-07 | ||
JPS5230188A (en) * | 1975-09-03 | 1977-03-07 | Hitachi Ltd | Process for producing smiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS57189847A (en) | 1982-11-22 |