JPS63188952U - - Google Patents
Info
- Publication number
- JPS63188952U JPS63188952U JP1987080359U JP8035987U JPS63188952U JP S63188952 U JPS63188952 U JP S63188952U JP 1987080359 U JP1987080359 U JP 1987080359U JP 8035987 U JP8035987 U JP 8035987U JP S63188952 U JPS63188952 U JP S63188952U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- metal heat
- heat sink
- mechanical stress
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/07553—
-
- H10W72/537—
-
- H10W72/884—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987080359U JPS63188952U (enExample) | 1987-05-27 | 1987-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987080359U JPS63188952U (enExample) | 1987-05-27 | 1987-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63188952U true JPS63188952U (enExample) | 1988-12-05 |
Family
ID=30931095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987080359U Pending JPS63188952U (enExample) | 1987-05-27 | 1987-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63188952U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013004880A (ja) * | 2011-06-21 | 2013-01-07 | Mitsubishi Electric Corp | 半導体装置 |
-
1987
- 1987-05-27 JP JP1987080359U patent/JPS63188952U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013004880A (ja) * | 2011-06-21 | 2013-01-07 | Mitsubishi Electric Corp | 半導体装置 |
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