JPS63188952U - - Google Patents

Info

Publication number
JPS63188952U
JPS63188952U JP1987080359U JP8035987U JPS63188952U JP S63188952 U JPS63188952 U JP S63188952U JP 1987080359 U JP1987080359 U JP 1987080359U JP 8035987 U JP8035987 U JP 8035987U JP S63188952 U JPS63188952 U JP S63188952U
Authority
JP
Japan
Prior art keywords
semiconductor chip
metal heat
heat sink
mechanical stress
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987080359U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987080359U priority Critical patent/JPS63188952U/ja
Publication of JPS63188952U publication Critical patent/JPS63188952U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/07553
    • H10W72/537
    • H10W72/884
JP1987080359U 1987-05-27 1987-05-27 Pending JPS63188952U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987080359U JPS63188952U (enExample) 1987-05-27 1987-05-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987080359U JPS63188952U (enExample) 1987-05-27 1987-05-27

Publications (1)

Publication Number Publication Date
JPS63188952U true JPS63188952U (enExample) 1988-12-05

Family

ID=30931095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987080359U Pending JPS63188952U (enExample) 1987-05-27 1987-05-27

Country Status (1)

Country Link
JP (1) JPS63188952U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004880A (ja) * 2011-06-21 2013-01-07 Mitsubishi Electric Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004880A (ja) * 2011-06-21 2013-01-07 Mitsubishi Electric Corp 半導体装置

Similar Documents

Publication Publication Date Title
JPS63188952U (enExample)
JPH0183331U (enExample)
JPS61207038U (enExample)
JPH0336137U (enExample)
JPS61171247U (enExample)
JPS60163738U (ja) 半導体装置
JPS6246272Y2 (enExample)
JPS6130252U (ja) 半導体装置
JPS61205145U (enExample)
JPS6146745U (ja) 集積回路装置の集中放熱機構
JPS6249249U (enExample)
JPS587337U (ja) 混成集積回路装置
JPS6022841U (ja) 放熱器
JPH0235449U (enExample)
JPS63100893U (enExample)
JPS61149354U (enExample)
JPH0260288U (enExample)
JPS6318851U (enExample)
JPS60146349U (ja) 半導体装置の放熱板半田付け構造
JPS6163847U (enExample)
JPS60137442U (ja) 半導体素子の固定装置
JPS6192067U (enExample)
JPS62192650U (enExample)
JPS62140751U (enExample)
JPS6138996U (ja) プリント基板の放熱構造