JPS63188952U - - Google Patents

Info

Publication number
JPS63188952U
JPS63188952U JP1987080359U JP8035987U JPS63188952U JP S63188952 U JPS63188952 U JP S63188952U JP 1987080359 U JP1987080359 U JP 1987080359U JP 8035987 U JP8035987 U JP 8035987U JP S63188952 U JPS63188952 U JP S63188952U
Authority
JP
Japan
Prior art keywords
semiconductor chip
metal heat
heat sink
mechanical stress
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987080359U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987080359U priority Critical patent/JPS63188952U/ja
Publication of JPS63188952U publication Critical patent/JPS63188952U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4905—Shape
    • H01L2224/49051—Connectors having different shapes
    • H01L2224/49052—Different loop heights
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1987080359U 1987-05-27 1987-05-27 Pending JPS63188952U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987080359U JPS63188952U (enrdf_load_stackoverflow) 1987-05-27 1987-05-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987080359U JPS63188952U (enrdf_load_stackoverflow) 1987-05-27 1987-05-27

Publications (1)

Publication Number Publication Date
JPS63188952U true JPS63188952U (enrdf_load_stackoverflow) 1988-12-05

Family

ID=30931095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987080359U Pending JPS63188952U (enrdf_load_stackoverflow) 1987-05-27 1987-05-27

Country Status (1)

Country Link
JP (1) JPS63188952U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004880A (ja) * 2011-06-21 2013-01-07 Mitsubishi Electric Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004880A (ja) * 2011-06-21 2013-01-07 Mitsubishi Electric Corp 半導体装置

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