JPS63188490A - Laser beam machining head - Google Patents
Laser beam machining headInfo
- Publication number
- JPS63188490A JPS63188490A JP62019010A JP1901087A JPS63188490A JP S63188490 A JPS63188490 A JP S63188490A JP 62019010 A JP62019010 A JP 62019010A JP 1901087 A JP1901087 A JP 1901087A JP S63188490 A JPS63188490 A JP S63188490A
- Authority
- JP
- Japan
- Prior art keywords
- machining
- outside
- laser beam
- work
- reflected light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 title abstract 7
- 238000003466 welding Methods 0.000 claims abstract description 6
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、銅、アルミ材等の00m レーザビームに
対し反射率の高い材料の切断および溶接に用いるレーザ
加工ヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laser processing head used for cutting and welding materials such as copper and aluminum materials that have a high reflectance to a 00 m laser beam.
第8(2)は従来のこの種のレーザ加工ヘッドを示す断
面図であり、図において、1は集束レンズでこの集束レ
ンズlを保持するものとしてレンズ押え2およびレンズ
受け3が構成さnている。4は上記1〜3を収納するホ
ルダーナースであり、側周に加工ガス5の径路を有Tる
。6は先端にノズルチップ7を有するノズルで、加工ガ
ス5を大気から遮断し、ノズルチップ7へ導く。なオ、
ノズルチップ7は、加工ガス5を集束させるとともに、
集束レンズ1により絞らnたレーザビーム8を通Tため
の丸穴7aを有し、さらに加工ガス5がノズル6とノズ
ルチップ7の接合部から洩nないように、0リング9を
有している。IOはホルダー押えで、ホルダーケース4
とノズル6とを組付けるものである□11は被加工物を
示し、ムは加工中に発生するレーザビームの反射光、1
2bは被加工物11を貫通したレーザビームを示す。ま
た氏は加工中に発生するアウトガスである。No. 8 (2) is a sectional view showing a conventional laser processing head of this type. In the figure, 1 is a focusing lens, and a lens holder 2 and a lens receiver 3 are configured to hold this focusing lens l. There is. Reference numeral 4 denotes a holder nurse that accommodates the above 1 to 3, and has a path for processing gas 5 on the side periphery. A nozzle 6 has a nozzle tip 7 at its tip, which blocks the processing gas 5 from the atmosphere and guides it to the nozzle tip 7. Nao,
The nozzle tip 7 focuses the processing gas 5 and
It has a round hole 7a for passing the laser beam 8 focused by the focusing lens 1, and also has an O-ring 9 to prevent the processing gas 5 from leaking from the joint between the nozzle 6 and the nozzle tip 7. There is. IO is a holder presser, and the holder case 4
and the nozzle 6. □11 indicates the workpiece, 1 indicates the reflected light of the laser beam generated during processing, and 1
2b shows a laser beam that has passed through the workpiece 11. Another factor is outgas generated during processing.
次に動作について説明Tる。レーザビーム8を集束レン
ズ1で絞り、こnを焦点位、!近傍にセットさnた被加
工物11に照射する。同時にレーザピ−ム8の照射位置
に加工ガス5を吹付け、加工ヘッド全体もしくは被加工
物11を移動させながら加工を行う。ところでこの加工
中には、被加工物11の土面周囲に反射するレーザ光1
2aと、被加工物11を貫通したレーザビーム12bが
存在し、同時にアウトガス13が発生する。Next, the operation will be explained. The laser beam 8 is focused by the focusing lens 1, and the focal point is n, ! A workpiece 11 set nearby is irradiated. At the same time, processing gas 5 is blown onto the irradiation position of the laser beam 8, and processing is performed while moving the entire processing head or the workpiece 11. By the way, during this processing, the laser beam 1 reflected around the soil surface of the workpiece 11
2a and a laser beam 12b that has penetrated the workpiece 11, and at the same time outgas 13 is generated.
従来の加工ヘッドは以上のように構成されており、銅や
アルミ材の切断および溶接時に発生する反射光のうち、
加工ヘッド周囲に散乱する反射光は遮蔽出来ず、人的、
物的に危害を及ぼす危険性があった。Conventional processing heads are configured as described above, and among the reflected light generated when cutting and welding copper and aluminum materials,
The reflected light scattered around the processing head cannot be blocked, causing human and
There was a risk of physical harm.
この発明は上記のような問題点を解消するためになさn
たもので、加工中の反射光1jlaが周囲に散乱するの
を防ぐことができる装置を得ることを目的とする。This invention was made to solve the above problems.
It is an object of the present invention to provide an apparatus that can prevent reflected light 1jla during processing from being scattered around.
この発明に係る加工ヘッドは、ノズルチップUノ外周部
に凹い枠を設けるとともに、この外周枠に貫通穴を設け
たものである。The processing head according to the present invention is provided with a concave frame on the outer periphery of the nozzle tip U, and a through hole is provided in this outer periphery.
この発明におけるノズルチップは、外周の囲い枠によっ
て、加工中に発生する被加工物からの反射光、スパッタ
が外部に散乱することを防ぎ、周囲の人および物への危
険性が解消され、レーザ加工機の安全性を高める。The nozzle chip of this invention prevents reflected light from the workpiece and spatter generated during processing from scattering outside, eliminating the danger to surrounding people and objects, and eliminating laser radiation. Improve the safety of processing machines.
以下この発明の一実施例を(2)について説明する。 An embodiment of the present invention will be described below regarding (2).
第1図、第2図において、14はノズルチップで、ノズ
ル6にネジ止めにより組合わされており、0リング9を
装着することにより外部への加工ガスの洩nを防止して
いる。またこのノズルチップ14は、外周に囲い枠14
aを有し、銅、アルミ等の加工中に発生する反射光ムの
外部への散乱を遮蔽するとともに、加工中に発生するア
ウトガス13を外部へ逃がすための2個の貫通穴141
)を有する0なお・その他の構成は上記第8図のものと
同様につき説明を省略する。In FIGS. 1 and 2, a nozzle tip 14 is screwed together with the nozzle 6, and an O-ring 9 is attached thereto to prevent processing gas from leaking to the outside. Further, this nozzle chip 14 has a surrounding frame 14 on its outer periphery.
a, and two through holes 141 for blocking the scattering of reflected light beams generated during processing of copper, aluminum, etc. to the outside, and for allowing outgas 13 generated during processing to escape to the outside.
) and the other configurations are the same as those shown in FIG. 8 above, so explanations will be omitted.
この発明は以上のように構成さnているので、銅、アル
ミ等の反射率の高い材料の加工中に発生する反射光、ス
パッタを遮蔽するとともに、加工中のアウトガス13を
加工ヘッド外部へ逃がしながら、加工を実施する。Since the present invention is constructed as described above, it blocks reflected light and spatter generated during processing of materials with high reflectivity such as copper and aluminum, and also allows outgas 13 during processing to escape to the outside of the processing head. Processing is carried out while
なお上記実施例では、ノズルチップ14の円周上の2か
所の穴14bは切断および溶接中に発生するアウトガス
13の逃げ用に設けたものであるが、溶接施行時のシー
ルドガスの供給用としても活用し得る。なお、この穴は
2個に限らないことはいうまでもない。In the above embodiment, the two holes 14b on the circumference of the nozzle tip 14 are provided for escape of outgas 13 generated during cutting and welding, but they are also provided for supplying shielding gas during welding. It can also be used as It goes without saying that the number of holes is not limited to two.
以上のようにこの発明によれば・加工中に発生する被加
工物からの反射光を外部に散乱しないようなノズルチッ
プの構造にしたので・人的、物的な安全性を増丁ことが
できる効果がある。As described above, according to the present invention, the structure of the nozzle tip is such that the reflected light from the workpiece that occurs during processing is not scattered to the outside, so that human and material safety can be increased. There is an effect that can be achieved.
第1図はこの発明の一実施例によるレーザ加工ヘッドの
断面図、第2図は第1図の外観斜視図、第8図は従来の
レーザ加工ヘッドを示す断面図であるO
図中、1は集束レンズ、5は加工ガス、6はノズル、8
はレーザビーム、11は被加工物、ムは反射光、13は
アウトガス、14はノズルチップ、14aは囲い枠、1
4bは貫通穴である。
図中、同一符号は同一または相当部分を示す。FIG. 1 is a sectional view of a laser processing head according to an embodiment of the present invention, FIG. 2 is an external perspective view of FIG. 1, and FIG. 8 is a sectional view of a conventional laser processing head. is a focusing lens, 5 is a processing gas, 6 is a nozzle, 8
1 is a laser beam, 11 is a workpiece, MU is reflected light, 13 is an outgas, 14 is a nozzle tip, 14a is a surrounding frame, 1
4b is a through hole. In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (2)
ズを通してノズルチップに導き、これを被加工物に照射
して、切断、溶接を行う装置において、上記ノズルチッ
プの外周に、貫通穴を有する囲い枠を設け、加工中の反
射光が外部に散乱するのを防ぐようにしたことを特徴と
するレーザ加工ヘッド。(1) In a device that conducts cutting and welding by guiding laser light emitted from a laser oscillator through a focusing lens to a nozzle tip and irradiating it onto a workpiece, an enclosure having a through hole on the outer periphery of the nozzle tip. A laser processing head characterized in that a frame is provided to prevent reflected light during processing from being scattered outside.
1項記載のレーザ加工ヘッド。(2) The laser processing head according to claim 1, wherein a plurality of through holes are provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62019010A JPS63188490A (en) | 1987-01-28 | 1987-01-28 | Laser beam machining head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62019010A JPS63188490A (en) | 1987-01-28 | 1987-01-28 | Laser beam machining head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63188490A true JPS63188490A (en) | 1988-08-04 |
Family
ID=11987531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62019010A Pending JPS63188490A (en) | 1987-01-28 | 1987-01-28 | Laser beam machining head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63188490A (en) |
-
1987
- 1987-01-28 JP JP62019010A patent/JPS63188490A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6968294B2 (en) | Laser processing machine and laser processing method | |
JPWO2017115406A1 (en) | Additional processing head, processing machine and processing method | |
CA1265206A (en) | Laser apparatus with a focus control unit | |
KR940003659A (en) | Torch for laser processing | |
KR20120004794A (en) | Laser cutting apparatus and method capable of cutting workpiece having multi layer | |
JP3752112B2 (en) | Laser processing apparatus and laser processing head | |
JPS63188490A (en) | Laser beam machining head | |
KR20210042398A (en) | Gas shielding device for use with laser processing heads | |
JPS6044192A (en) | Device and method for laser working | |
WO2014203489A1 (en) | Outer can sealing method and outer can sealing device | |
JP3245027B2 (en) | Composite welding head | |
WO1999059758A2 (en) | Device for the laser processing of materials | |
JP3469969B2 (en) | Handy torch for YAG laser | |
JPS6037182Y2 (en) | Laser processing equipment | |
WO2023058504A1 (en) | Beamforming device | |
JPH0230393A (en) | Safety device for absorbing irradiated laser beams | |
KR101684485B1 (en) | Laser Welding Device and Welding Method of Thin Plate Using Laser Welding Device | |
JP2005161404A (en) | Condensing head for laser welding | |
JPH0332482A (en) | Laser beam machine | |
JPS6343791A (en) | Laser beam joining device | |
JP3073317B2 (en) | Laser processing equipment | |
JPH03258482A (en) | Laser processing method | |
JPS63104794A (en) | Laser beam machine | |
JPH04238687A (en) | Laser beam machine | |
JPS63303691A (en) | Laser beam machining head incorporating led |