JPS63104794A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPS63104794A
JPS63104794A JP61250147A JP25014786A JPS63104794A JP S63104794 A JPS63104794 A JP S63104794A JP 61250147 A JP61250147 A JP 61250147A JP 25014786 A JP25014786 A JP 25014786A JP S63104794 A JPS63104794 A JP S63104794A
Authority
JP
Japan
Prior art keywords
bellows
laser light
laser beam
annular plate
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61250147A
Other languages
Japanese (ja)
Other versions
JPH0435276B2 (en
Inventor
Ken Tanaka
憲 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61250147A priority Critical patent/JPS63104794A/en
Publication of JPS63104794A publication Critical patent/JPS63104794A/en
Publication of JPH0435276B2 publication Critical patent/JPH0435276B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To extend the life of bellows by disposing an annular plate to the large-diameter part of the bellows and forming the bore thereof to the size which does not interfere with laser light and is smaller than the small-diameter part of the bellows. CONSTITUTION:Plural pieces of annular plates 9 are disposed at about every other one to the large-diameter part of the bellows 2. The bore size D1 of the plates 9 to be formed is determined larger than the outside edge size D0 of the laser light 8 and smaller than the size D2 in the small-diameter part of the bellows 2. The surface of the plates 9 is formed of Al, etc., and is subjected to a processing to absorb the laser light 8. The laser light 8 falls onto the plates 8 and the bellows 2 is protected even if the laser light 8 is deviated from the optical axis according to the above-mentioned mechanism. The laser light reflected from a work 7 falls similarly to the plates 9 and, therefore, the generation of a damage on the bellows 2 is prevented. The life of the bellows 2 is thereby extended.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレーザ加工機に関し、特にレーザ光の光路に配
設され加工ヘッドの動作を便ならしめるる。同図は、特
にレーザ加工機の加工ヘッドをワークに対して伸縮させ
る蛇腹を示したものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a laser processing machine, and particularly to a laser processing machine that is disposed in the optical path of a laser beam and facilitates the operation of a processing head. This figure particularly shows a bellows that allows the processing head of a laser processing machine to expand and contract with respect to a workpiece.

同図において、加工ヘッド(1)は、蛇腹(2)を介し
て光路ダクト(3)に対して伸縮目在に取付けられてい
る。加工ヘッド(1)及び光路ダクト(3)の蛇腹(2
)との各接合面には軸芯に直交する方向にそれぞれアー
ム部(la)、(3a)が形成されており、該アーム部
(la)、(3a)間に長袖の送りねじ(4)が螺装さ
れ、光路ダクト側のアーム部(3a)において送りねじ
(4)に結合したモータ(5)の駆動によって、送りね
じ(4)が回転して加工ヘッド(1)を光路ダクト(3
)に対して離隔距離をyJ整するようにする。尚、加工
ヘッド(1)には集光レンズ(6)が取付けられており
、集光レーザ光によってワーク(7)に所定の加工を施
すようにしている。
In the figure, a processing head (1) is attached to an optical path duct (3) via a bellows (2) in a telescoping manner. The bellows (2) of the processing head (1) and the optical path duct (3)
) are formed with arm portions (la) and (3a) in the direction perpendicular to the axis, respectively, and a long-sleeved feed screw (4) is formed between the arm portions (la) and (3a). The feed screw (4) is rotated by the drive of the motor (5) coupled to the feed screw (4) at the arm portion (3a) on the optical path duct side, and the machining head (1) is moved into the optical path duct (3).
), the separation distance should be adjusted by yJ. Note that a condensing lens (6) is attached to the processing head (1), and a predetermined process is performed on the workpiece (7) using a condensed laser beam.

然して、レーザ加工機を始動すると光路ダクト(3)を
経由してレーザ光(8)が加工ヘッド(1)に到達し、
集光レンズ(6)に集光されて高エネルギ化したレーザ
光(8)によってワーク(7)を加工する。
However, when the laser processing machine is started, the laser beam (8) reaches the processing head (1) via the optical path duct (3),
A workpiece (7) is processed by a laser beam (8) which is focused by a condensing lens (6) and made high in energy.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記構成によれば、ワーク(7)にレーザ光(8)を照
射して加工すると、レーザ光(8)の一部がワーク(7
)表面から反射されて再び集光レンズ(6)を通過して
同図示のごとく光軸から傾斜した反射レーザ光(8′)
として蛇腹(2)に到達する。
According to the above configuration, when the workpiece (7) is processed by irradiating the laser beam (8), a part of the laser beam (8) is emitted from the workpiece (7).
) The reflected laser beam (8') is reflected from the surface and passes through the condensing lens (6) again, tilting from the optical axis as shown in the figure.
As a result, the bellows (2) is reached.

然して蛇腹(2)は、一般に可撓性樹脂などから成るこ
とが多く、反射レーザ光(8′)のエネルギによって該
樹脂は劣化し、時には燃焼するに至ることすらある。あ
るいは、加工ヘッド(1)の動作によって蛇111(2
)がレーザ光(8)に干渉して同様の損傷をもたらすこ
とがある。後者の問題は加工ヘッド(1)以外の蛇腹(
図示せず)にとって重要なことである。
However, the bellows (2) is generally made of flexible resin, and the energy of the reflected laser beam (8') causes the resin to deteriorate and sometimes even burn. Alternatively, the snake 111 (2) may be
) may interfere with the laser beam (8) and cause similar damage. The latter problem is due to the bellows (
(not shown).

本発明は叙上の問題点を解決するためになされたもので
、レーザ光(8)、(8’ )が直接蛇腹に干渉するこ
とのないレーザ加工機を提供することを目的とする。
The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a laser processing machine in which the laser beams (8) and (8') do not directly interfere with the bellows.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、レーザ光の光路に配設された蛇腹の大径部に
環状板を挾持させるとともに、該原状板の内径をレーザ
光と干渉せず、かつ該蛇腹の小径部よりも小さい寸法に
形成したものである。
The present invention has an annular plate sandwiched between the large diameter part of the bellows disposed in the optical path of the laser beam, and the inner diameter of the original plate is set to a size that does not interfere with the laser beam and is smaller than the small diameter part of the bellows. It was formed.

〔作用〕[Effect]

本発明によれば、蛇腹とレーザ光は干渉することがなく
、しかも加工ヘッドの動作時にレーザ光が蛇腹に直接当
たろうとしても、その前に環状板に当たって蛇腹に対す
る直接照射を防止することができ蛇腹を有効に保護する
ことができる。
According to the present invention, there is no interference between the bellows and the laser beam, and even if the laser light tries to directly hit the bellows during operation of the processing head, it hits the annular plate before that and prevents direct irradiation of the bellows. The bellows can be effectively protected.

〔実施例〕〔Example〕

以下第1図に示す実施例に基づいて本発明を説明する。 The present invention will be explained below based on the embodiment shown in FIG.

尚、説明の都合上、従来と同−又は相当部分には同一符
号を付し、本発明の特徴を中心に説明する。
For convenience of explanation, the same or equivalent parts as in the conventional art are given the same reference numerals, and the features of the present invention will be mainly explained.

同図からも明らかなように蛇腹(2)を除き従来と同様
に構成されている。蛇1!!(2)は、図示のごとく大
径部と小径部とで伸縮するのであるが1本実施例では該
大径部の1つ置きに環状板(9)が挾持されている。該
環状板(9)の内径は寸法D1に形成され、該寸法D1
はレーザ光(8)の通路経路の外縁寸法DOよりも大き
く、しかも蛇fi (2)の小径部寸法D2よりも小さ
く形成されている。該環状板(8)はアルミニウム等か
ら形成され、表面にはレーザ光(8)を吸収する処理を
施し、上記保護をより有効にすることができる。
As is clear from the figure, the structure is the same as the conventional one except for the bellows (2). Snake 1! ! (2) expands and contracts between the large diameter portion and the small diameter portion as shown in the figure, and in this embodiment, an annular plate (9) is held between every other large diameter portion. The inner diameter of the annular plate (9) is formed to have a dimension D1;
is larger than the outer edge dimension DO of the passage path of the laser beam (8), and smaller than the small diameter portion dimension D2 of the snake fi (2). The annular plate (8) is made of aluminum or the like, and its surface is treated to absorb the laser beam (8), thereby making the above protection more effective.

従って、加工ヘッド(1)が動作してレーザ光(8)の
通路経路が光軸から偏位するようなことがあっても、レ
ーザ光は先ず環状板(9)に当たり蛇腹(2)、特に小
径部に当たることはなく、充分にレーザ光(8)から保
護される。
Therefore, even if the processing head (1) operates and the path of the laser beam (8) deviates from the optical axis, the laser beam first hits the annular plate (9) and the bellows (2), especially It does not hit the small diameter portion and is sufficiently protected from the laser beam (8).

一方、ワーク(7)から反射レーザ光(図示せず)が集
光レンズ(6)を通過して入射しても、該反射レーザ光
はやはり先ず環状板(9)に照射されるため蛇IIS!
 (2)は有効に保護される。従って蛇腹(2)の気密
性を十分に保有することができる。
On the other hand, even if reflected laser light (not shown) from the workpiece (7) passes through the condensing lens (6) and enters, the reflected laser light is first irradiated onto the annular plate (9), so the snake IIS !
(2) is effectively protected. Therefore, the bellows (2) can maintain sufficient airtightness.

尚、環状板(9)を蛇腹(2)に挾持させる手段として
は蛇FI!(2)の大径部に挾み、接着剤で接着する手
段もあれば、縁部を縫合する手段もある。
Incidentally, as a means for holding the annular plate (9) between the bellows (2), the snake FI! There is a method of sandwiching the large diameter part of (2) and gluing it with adhesive, and there is also a method of sewing the edges.

また第2図は加工ヘッドの変形例を示すもので、本実施
例では1.E記実施例におけるアーム部(1a)を加工
ヘッド(1)から分離し、加工ヘッド(1)を光路ダク
ト(3)の軸芯に対して直交させ、アーム部(1a)と
加工ヘッド(1)間に反射ミラー(10)を傾斜させて
配置し、光路ダクト(3)からのレーザ光(8)を90
@折曲させたものである。この実施例に適用する蛇In
!(2)にも上記実施例同様環状板が挾持されているこ
とは言うまでもない。かかる構成であっても上記実施例
と同効を奏する。
Moreover, FIG. 2 shows a modification of the processing head, and in this embodiment, 1. The arm part (1a) in Example E is separated from the processing head (1), the processing head (1) is made orthogonal to the axis of the optical path duct (3), and the arm part (1a) and the processing head (1) are separated. ), a reflective mirror (10) is arranged at an angle between
@It is bent. Snake In applied to this example
! It goes without saying that the annular plate (2) is also clamped in the same way as in the above embodiment. Even with such a configuration, the same effect as the above embodiment can be achieved.

〔発明の効果〕〔Effect of the invention〕

以上本発明によれば、レーザ加工機のレーザ光の光路に
配設された蛇腹の大径部に所定の環状板を挾持させたこ
とから蛇腹をレーザ光の照射から有効に保護し、長寿命
化を図ることができるとともに、蛇腹の気密保持をする
ことができる。
As described above, according to the present invention, since a predetermined annular plate is sandwiched between the large diameter part of the bellows disposed in the optical path of the laser beam of the laser processing machine, the bellows is effectively protected from laser beam irradiation and has a long service life. It is possible to maintain the airtightness of the bellows.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係るレーザ加工機の一実施例を示す要
部拡大図、第2図は他の実施例を示す第1図相当図、第
3図は従来装置を示す第1図相当図である。 図において、 (1)は加工ヘッド、    (2)は蛇腹、(3)は
光路ダクト (光路) 、 (8)はレーザ光、(9)
は環状板である。 なお、各図中同一符号は同−又は相当部分を示す。 代理人  大  岩  増  雄 第1図
FIG. 1 is an enlarged view of main parts showing one embodiment of a laser processing machine according to the present invention, FIG. 2 is a view equivalent to FIG. 1 showing another embodiment, and FIG. 3 is a view equivalent to FIG. 1 showing a conventional device. It is a diagram. In the figure, (1) is the processing head, (2) is the bellows, (3) is the optical path duct (optical path), (8) is the laser beam, (9) is
is an annular plate. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa Figure 1

Claims (3)

【特許請求の範囲】[Claims] (1)レーザ光の光路に沿って配設され、加工ヘッドの
動作を許容すべく伸縮自在に形成された蛇腹を備えたレ
ーザ加工機において、上記蛇腹の大径部に環状板を挾持
させるとともに、該環状板内径をレーザ光に干渉せずか
つ該蛇腹の小径部より小さい寸法に形成したことを特徴
とするレーザ加工機。
(1) In a laser processing machine equipped with a bellows arranged along the optical path of the laser beam and formed to be extendable and retractable to allow movement of the processing head, an annular plate is held between the large diameter part of the bellows, and A laser processing machine characterized in that the annular plate has an inner diameter that does not interfere with laser light and is smaller than a small diameter portion of the bellows.
(2)上記環状板表面にレーザ光を吸収する表面処理を
施したことを特徴とする特許請求の範囲第1項記載のレ
ーザ加工機。
(2) The laser processing machine according to claim 1, wherein the annular plate surface is subjected to a surface treatment to absorb laser light.
(3)上記環状板がアルミニウムであることを特徴とす
る特許請求の範囲第1項又は第2項に記載のレーザ加工
機。
(3) The laser processing machine according to claim 1 or 2, wherein the annular plate is made of aluminum.
JP61250147A 1986-10-21 1986-10-21 Laser beam machine Granted JPS63104794A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61250147A JPS63104794A (en) 1986-10-21 1986-10-21 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61250147A JPS63104794A (en) 1986-10-21 1986-10-21 Laser beam machine

Publications (2)

Publication Number Publication Date
JPS63104794A true JPS63104794A (en) 1988-05-10
JPH0435276B2 JPH0435276B2 (en) 1992-06-10

Family

ID=17203514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61250147A Granted JPS63104794A (en) 1986-10-21 1986-10-21 Laser beam machine

Country Status (1)

Country Link
JP (1) JPS63104794A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508490A (en) * 1992-10-22 1996-04-16 Aclas Lasertechnik & Maschinenbau Gmbh Laser machining head and auxiliary equipment for a numerically controlled machine tool
JP2003071584A (en) * 2001-08-30 2003-03-11 Amada Co Ltd Optical path protective bellows for laser beam machine
WO2011102478A1 (en) * 2010-02-19 2011-08-25 株式会社ナベル Beam guiding bellows for laser cutting machine, and manufacturing method for beam guiding bellows for laser cutting machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508490A (en) * 1992-10-22 1996-04-16 Aclas Lasertechnik & Maschinenbau Gmbh Laser machining head and auxiliary equipment for a numerically controlled machine tool
JP2003071584A (en) * 2001-08-30 2003-03-11 Amada Co Ltd Optical path protective bellows for laser beam machine
WO2011102478A1 (en) * 2010-02-19 2011-08-25 株式会社ナベル Beam guiding bellows for laser cutting machine, and manufacturing method for beam guiding bellows for laser cutting machine
JP2011167727A (en) * 2010-02-19 2011-09-01 Naberu:Kk Bellows for optical path of laser cutting machine and method for manufacturing the bellows for optical path of laser cutting machine

Also Published As

Publication number Publication date
JPH0435276B2 (en) 1992-06-10

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