JPS63187964A - Reader - Google Patents
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- Publication number
- JPS63187964A JPS63187964A JP62020781A JP2078187A JPS63187964A JP S63187964 A JPS63187964 A JP S63187964A JP 62020781 A JP62020781 A JP 62020781A JP 2078187 A JP2078187 A JP 2078187A JP S63187964 A JPS63187964 A JP S63187964A
- Authority
- JP
- Japan
- Prior art keywords
- elements
- light
- same
- photoelectric conversion
- dummy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011148 porous material Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、例えばファクシミリ装置の小型化を自損した
もので実質上被検知体と寸法的に1:1に対応させた光
電変換素子アレイを配置して成る密着型イメージセンサ
などの読取り装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention is a photoelectric conversion element array that is designed to reduce the size of, for example, a facsimile machine, and has a dimensionally 1:1 correspondence with an object to be detected. The present invention relates to a reading device such as a contact type image sensor, which is equipped with a contact type image sensor.
近時、密着型イメージセンサの開発が活発化しており、
第3図はそのセンサの一例であり、原稿1と寸法的に実
質上l:1に対応させた光検知部2が原稿lに密着し、
発光ダイオード3が原稿1を投光し、その反射光を光検
知部2で受光する。尚、図中矢印A及びBはそれぞれ主
走査方向及び副走査方向を表す。Recently, the development of contact image sensors has become more active.
FIG. 3 shows an example of such a sensor, in which a light detection section 2, which corresponds dimensionally to the original 1 at a ratio of 1:1, is brought into close contact with the original 1.
The light emitting diode 3 emits light onto the original 1, and the light detecting section 2 receives the reflected light. Note that arrows A and B in the figure represent the main scanning direction and the sub-scanning direction, respectively.
第4図はこの光検知部2の副走査方向の断面図であり、
本願出願人が既に提案した読取り装置である。FIG. 4 is a cross-sectional view of this photodetector 2 in the sub-scanning direction.
This is a reading device already proposed by the applicant.
即ち、ガラス製の透光性基板4が金属フレームで構成さ
れた基板支持体5に付設されており、この基板4上には
Crが蒸着して成る共通電極6が形成され、この共通電
極6の上にはアモルファスシリコンから成る光電変換部
7が形成されており、そして、この光電変換部7の上に
はITOから成る透明電極8が個々の光電変換部7に対
応して形成される。更にこの透明電極8の一部を覆うよ
うにCrを蒸着させ、次いでフォトエツチングを行い、
これによってCrから成る引出し電極9を各素子に対し
て個別的に接続し、然る後、共通電極6、光電変換部7
及び透明電極8に共通した光通過孔10をフォトエツチ
ングによって個別的に形成する。That is, a transparent substrate 4 made of glass is attached to a substrate support 5 made of a metal frame, and a common electrode 6 made of vapor-deposited Cr is formed on this substrate 4. A photoelectric conversion section 7 made of amorphous silicon is formed on the photoelectric conversion section 7, and a transparent electrode 8 made of ITO is formed on the photoelectric conversion section 7 in correspondence with each photoelectric conversion section 7. Furthermore, Cr was vapor-deposited to cover a part of this transparent electrode 8, and then photo-etched.
As a result, the extraction electrode 9 made of Cr is individually connected to each element, and then the common electrode 6 and the photoelectric conversion section 7 are connected.
A light passage hole 10 common to the transparent electrode 8 is individually formed by photoetching.
そして、最上部にはシリコンオキサイド、シリコンナイ
トライド又はシリコンオキシナイトライドなどから成る
透明な保護層11が形成される。また、基板支持体5に
は主走査方向に亘って長尺状の凹部12が形成されてお
り、この凹部12の底部には複数のLEDチップ13が
所定の間隔をとって配列されている。A transparent protective layer 11 made of silicon oxide, silicon nitride, silicon oxynitride, or the like is formed on the top. Further, a long recess 12 is formed in the substrate support 5 in the main scanning direction, and a plurality of LED chips 13 are arranged at a predetermined interval at the bottom of the recess 12.
上記の如き構成の読取り装置によれば、LEDチップ1
3が基板4、光通過孔10及び保護層11を介して原稿
1を投光し、その反射光が光通過孔IO近傍の透明電極
8を通過して光電変換部7に受光される。According to the reading device configured as described above, the LED chip 1
3 projects light onto the original 1 through the substrate 4, the light passage hole 10, and the protective layer 11, and the reflected light passes through the transparent electrode 8 near the light passage hole IO and is received by the photoelectric conversion section 7.
第5図は第4図を矢印C方向から見た光電変換素子アレ
イであり1、この光電変換素子アレイ14には光通過孔
10のアレイが表されており、更に各々の素子には引出
し電極9が個別的に接続され、その電極9はリード15
として基板上に配線パターン化されている。そして、上
記の受光システムは各素子共通であって各々の素子が受
光されるのに伴って素子毎に個別読取り信号が一次元的
に順次リード15を介して導出される。FIG. 5 shows a photoelectric conversion element array 1 seen from the direction of arrow C in FIG. 9 are individually connected, and the electrode 9 is connected to the lead 15.
A wiring pattern is formed on the board. The light receiving system described above is common to each element, and as each element receives light, an individual read signal is one-dimensionally and sequentially derived from each element via the lead 15.
このような構成の読取り装置によれば、各、々の素子の
受光量はLEDチップ13のアレイより投光されて個々
の光通過孔10を通過する光量によって依存するもので
あり、その通過光量はLEDチップ13のアレイの照度
分布によって決められるのでアレイ状の光通過孔10に
対して均等な照度分布となるようにLEDチップアレイ
が設定されている。その上、読取り装置を駆動させた場
合、各々の素子にはその素子と隣接する素子に位置する
光通過孔を通して入射した光のうち原稿1による反射光
も一部投光されており、それが各々の素子に亘って同じ
条件で投光されており、これにより、同じ色調の被検知
体に対しては各々の素子が同一受光量となる。According to the reading device having such a configuration, the amount of light received by each element depends on the amount of light emitted from the array of LED chips 13 and passing through each light passage hole 10, is determined by the illuminance distribution of the array of LED chips 13, so the LED chip array is set so that the illuminance distribution is uniform with respect to the array of light passing holes 10. Furthermore, when the reading device is driven, part of the light reflected by the document 1 is also projected onto each element through the light passing hole located in the element adjacent to that element. Light is projected to each element under the same conditions, and as a result, each element receives the same amount of light for an object to be detected of the same color tone.
しかし乍ら、上記光電変換素子アレイ14の両端
′の素子14aは、それに隣接する素子がそれぞれ片側
で欠けており、これにより、その素子14aで受光する
量が他の素子に比べて少なくなり、その結果、その素子
の読取り信号が小さくなるという問題がある。However, both ends of the photoelectric conversion element array 14
In the element 14a of ', each of the adjacent elements is missing on one side, and as a result, the amount of light received by that element 14a is smaller than that of the other elements, and as a result, the read signal of that element becomes smaller. There's a problem.
また、上述した両端の素子14aに接続したり一部15
aは、他のリードに比べてその片側に同じリードが配線
されておらず、これによってそのリードより表面リーク
が生じて暗状態で導出される信号のレベルが他の素子に
比べて異なるという問題がある。Also, some parts 15 may be connected to the elements 14a at both ends described above.
A is the problem that the same lead is not wired on one side compared to the other leads, and this causes surface leakage from that lead, resulting in the level of the signal derived in the dark state being different compared to other elements. There is.
即ち、この問題を第4図中矢印り方向より見た第6図に
よって説明するならば、両端の素子14aを除く他の素
子においては暗状態(素子に全く光が照射されない状B
)でも個別電極と共通電極の間には非常に小さな電流(
これは暗電流と呼ばれており、通常1p^以下である)
が流れており、これに対して両端の素子14aにおいて
は矢印Sで示すようにアモルファスシリコン光電変換部
7の表面で電流が流れ易くなっており、この電流は数p
A〜数十p^位であって上記暗電流に比べて著しく大き
い。そのために両端の素子の暗状態で導出される信号の
レベルがその他の素子から導出される信号のレベルと比
べて異なり、正確な読取り信号が得られないという問題
が生じる。That is, to explain this problem with reference to FIG. 6 viewed from the direction of the arrow in FIG.
), but there is a very small current (
This is called dark current and is usually less than 1p^)
On the other hand, in the elements 14a at both ends, as shown by the arrow S, the current flows easily on the surface of the amorphous silicon photoelectric conversion section 7, and this current is several p.
A ~ several tens of p^, which is significantly larger than the above-mentioned dark current. Therefore, the level of the signal derived in the dark state of the elements at both ends is different from the level of the signal derived from the other elements, resulting in a problem that accurate read signals cannot be obtained.
従って本発明は、畝上に鑑みて完成されたものであり、
その目的は光電変換素子アレイの両端に位置する素子の
受光量を他の素子と同程度とし、これによって各素子の
すべてに亘って同一読取り条件のもとて同レベルの読取
り信号が得られるようにした読取り装置を提供すること
にある。 本発明の他の目的は暗状態で導出される信号
のレベルをすべての素子に亘って同じにした読取り装置
を提供することにある。Therefore, the present invention was completed in view of the ridges,
The purpose of this is to make the amount of light received by the elements located at both ends of the photoelectric conversion element array about the same as that of other elements, so that read signals of the same level can be obtained from all elements under the same reading conditions. The object of the present invention is to provide a reading device that has the following characteristics. Another object of the present invention is to provide a reading device in which the level of the signal derived in the dark state is the same across all elements.
本発明によれば、基板上に光電変換素子アレイを形成し
、該素子アレイと対応する部位に光源を備え、この光源
が被検知体を投光し、その反射光を光電変換素子アレイ
が受光し、この素子アレイから順次時系列に読取り信号
が得られるようにした読取り装置において、前記光電変
換素子アレイの端部の光電変換素子に隣接してダミー用
素子を形成したことを特徴とする読取り装置が提供され
る。According to the present invention, a photoelectric conversion element array is formed on a substrate, a light source is provided at a portion corresponding to the element array, the light source projects light onto a detected object, and the photoelectric conversion element array receives the reflected light. and a reading device capable of sequentially obtaining read signals from the element array in time series, characterized in that a dummy element is formed adjacent to the photoelectric conversion element at an end of the photoelectric conversion element array. Equipment is provided.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明によれば、例えば第4図に示した読取り装置の光
電変換素子アレイにおいて、その端部の素子に隣接して
ダミー用素子16を形成することを特徴とするものであ
り、このダミー用素子16は他の素子と同じような光通
過孔が形成されていることが重要である。これによって
ダミー用素子16にある光通過孔を通して原稿lを投光
し、その反射光の一部が端部の素子14aを投光し、そ
の結果、端部の素子14aを含めたすべての光電変換素
子が同じ色調の被検知体に対して同一受光量と成り得る
。According to the present invention, for example, in the photoelectric conversion element array of the reading device shown in FIG. 4, the dummy element 16 is formed adjacent to the element at the end thereof. It is important that the element 16 has light passage holes similar to those of the other elements. As a result, light is emitted from the original l through the light passing hole in the dummy element 16, and a portion of the reflected light is emitted to the end element 14a, and as a result, all the photoelectrons including the end element 14a are illuminated. The conversion element can receive the same amount of light for objects of the same color tone.
また本発明によれば、暗状態においてダミー用素子16
を読取り用素子14と実質上同電位となるように設定す
るのがよく、そのためには例えば両者の素子14.16
を接地すればよく、これにより、暗状態において両端の
素子14aに接続されたり一ド15a近傍のアモルファ
スシリコン光電変換部7表面で生じる電流の表面リーク
(第6図中矢印S)がなくなり、その結果、両端の素子
14aの暗状態で導出される信号のレベルがその他の素
子から導出される信号のレベルと同程度になる。Further, according to the present invention, in the dark state, the dummy element 16
is preferably set to have substantially the same potential as the reading element 14, for example, both elements 14 and 16.
This eliminates the surface leakage of the current (arrow S in FIG. 6) that occurs on the surface of the amorphous silicon photoelectric conversion section 7 connected to the elements 14a at both ends or near the gate 15a in the dark state. As a result, the level of the signal derived from the dark state of the elements 14a at both ends becomes comparable to the level of the signal derived from the other elements.
更に本発明によれば、ダミー用素子16を形成するにあ
たって、その光通過孔の光通過面積を読取り用素子14
のものに比べて大きくなるように設定するとよい。Further, according to the present invention, when forming the dummy element 16, the light passage area of the light passage hole is determined by the reading element 14.
It is best to set it so that it is larger than that of .
即ち、その理由を詳述するならば、明状態(受光状B)
においては、その受光によって読取り用素子の電位が変
化するが、これに対してダミー用素子16が接地されて
いる場合にはその素子16の電位が変化せず、これによ
り、端部の素子14aとダミー用素子16の間で電位差
が生じ、読取り用素子の電位変化分に相当してそれが小
さくなる方向に電流リークが生じ、その結果、端部の素
子14aの読取り信号が若干小さくなる。この問題に対
して、ダミー用素子の光通過孔の面積を光電変換素子ア
レイ14の光通過孔の面積よりも大きくして端部の素子
14aの受光量を多くすれば、端部の素子の読取り信号
の減少分を補完することができる。That is, to explain the reason in detail, the bright state (light receiving state B)
, the potential of the reading element changes due to the reception of light, but on the other hand, if the dummy element 16 is grounded, the potential of that element 16 does not change, and as a result, the potential of the element 14a at the end portion changes. A potential difference is generated between the dummy element 16 and the dummy element 16, and a current leak occurs in a direction corresponding to the change in the potential of the read element and decreases, and as a result, the read signal of the end element 14a becomes slightly smaller. To solve this problem, if the area of the light passing hole of the dummy element is made larger than the area of the light passing hole of the photoelectric conversion element array 14 and the amount of light received by the end element 14a is increased, the amount of light received by the end element 14a can be increased. It is possible to compensate for the decrease in the read signal.
また本発明の他の実施例として、第2図に示すように素
子アレイの両端にそれぞれ複数個形成してもよく、これ
によって端部の素子14aの暗状態及び明状態のそれぞ
れの条件がその他の読取り用素子の条件と更に一層同一
化するという点で望ましい。As another embodiment of the present invention, a plurality of elements may be formed at both ends of the element array as shown in FIG. This is desirable in that the conditions are even more identical to those of the reading element.
以上の通り、本発明の読取り装置によれば、すべての光
電変換素子が均等な受光条件となり、更に暗状態及び明
状態のいずれにおいても同一条件のもとて同等の出力信
号を得ることができ、これにより、正確且つ高信頼性の
読取り装置が提供できる。As described above, according to the reading device of the present invention, all the photoelectric conversion elements have equal light receiving conditions, and furthermore, it is possible to obtain very similar output signals under the same conditions in both the dark state and the bright state. , Thereby, an accurate and highly reliable reading device can be provided.
尚、本発明の読取り装置は上記実施例に限定されるもの
ではなく、本発明の要旨を逸脱しない範囲において種々
の変更、改良等は何等差支えない。Note that the reading device of the present invention is not limited to the above-mentioned embodiments, and various modifications and improvements may be made without departing from the gist of the present invention.
第1図は本発明に係る読取り装置の光電変換素子アレイ
及びそれの信号導出リードパターンを示す説明図、第2
図は本発明に係る読取り装置の他の例を示す光電変換素
子アレイ及びそれの信号導出リードパターンの説明図、
第3図は本発明に係る読取り装置の被検知体との配置を
示す概略図、第4図は読取り装置の副走査方向の断面図
、第5図は従来の読取り装置における光電変換素子アレ
イ及びそれの信号導出リードパターンを示す説明図、第
6図は読取り装置の主走査方向の断面図である。
6・・・共通電極 7・・・光電変換部8・・・透明
電極 9・・・引出し電極10・・・光通過孔 1
4・・・光電変換素子アレイ15・・・リード 1
6・・・ダミー用素子特許出願人(663>京セラ株式
会社
代表者 安城 欽寿
↓0
図FIG. 1 is an explanatory diagram showing a photoelectric conversion element array and its signal deriving lead pattern of a reading device according to the present invention, and FIG.
The figure is an explanatory diagram of a photoelectric conversion element array and its signal derivation lead pattern showing another example of the reading device according to the present invention,
FIG. 3 is a schematic diagram showing the arrangement of a reading device according to the present invention with a detected object, FIG. 4 is a sectional view of the reading device in the sub-scanning direction, and FIG. 5 is a photoelectric conversion element array and a conventional reading device. FIG. 6 is an explanatory diagram showing the signal deriving lead pattern thereof, and FIG. 6 is a sectional view of the reading device in the main scanning direction. 6... Common electrode 7... Photoelectric conversion section 8... Transparent electrode 9... Extracting electrode 10... Light passing hole 1
4... Photoelectric conversion element array 15... Lead 1
6... Dummy element patent applicant (663> Kyocera Corporation Representative Kinju Anjo ↓0 Figure
Claims (1)
対応する部位に光源を備え、この光源が被検知体を投光
し、その反射光を光電変換素子アレイが受光し、この素
子アレイから順次時系列に読取り信号が得られるように
した読取り装置において、前記光電変換素子アレイの端
部の光電変換素子に隣接してダミー用素子を形成したこ
とを特徴とする読取り装置。A photoelectric conversion element array is formed on a substrate, and a light source is provided at a portion corresponding to the element array.The light source emits light onto the object to be detected, and the photoelectric conversion element array receives the reflected light. 1. A reading device capable of sequentially obtaining read signals in time series, characterized in that a dummy element is formed adjacent to a photoelectric conversion element at an end of the photoelectric conversion element array.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62020781A JPH0828790B2 (en) | 1987-01-30 | 1987-01-30 | Reader |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62020781A JPH0828790B2 (en) | 1987-01-30 | 1987-01-30 | Reader |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63187964A true JPS63187964A (en) | 1988-08-03 |
JPH0828790B2 JPH0828790B2 (en) | 1996-03-21 |
Family
ID=12036671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62020781A Expired - Lifetime JPH0828790B2 (en) | 1987-01-30 | 1987-01-30 | Reader |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0828790B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH021166A (en) * | 1988-03-24 | 1990-01-05 | Ricoh Co Ltd | Contact-type image sensor |
JPH0766930A (en) * | 1993-08-27 | 1995-03-10 | Nec Corp | Facsimile equipment |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5387619A (en) * | 1977-01-13 | 1978-08-02 | Toshiba Corp | Solid pickup unit |
JPS56102168A (en) * | 1980-01-19 | 1981-08-15 | Fujitsu Ltd | Video signal processing |
-
1987
- 1987-01-30 JP JP62020781A patent/JPH0828790B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5387619A (en) * | 1977-01-13 | 1978-08-02 | Toshiba Corp | Solid pickup unit |
JPS56102168A (en) * | 1980-01-19 | 1981-08-15 | Fujitsu Ltd | Video signal processing |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH021166A (en) * | 1988-03-24 | 1990-01-05 | Ricoh Co Ltd | Contact-type image sensor |
JPH0766930A (en) * | 1993-08-27 | 1995-03-10 | Nec Corp | Facsimile equipment |
Also Published As
Publication number | Publication date |
---|---|
JPH0828790B2 (en) | 1996-03-21 |
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