JPS62285569A - Reader - Google Patents

Reader

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Publication number
JPS62285569A
JPS62285569A JP61129829A JP12982986A JPS62285569A JP S62285569 A JPS62285569 A JP S62285569A JP 61129829 A JP61129829 A JP 61129829A JP 12982986 A JP12982986 A JP 12982986A JP S62285569 A JPS62285569 A JP S62285569A
Authority
JP
Japan
Prior art keywords
recess
light
light source
reading device
original
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61129829A
Other languages
Japanese (ja)
Other versions
JPH0728366B2 (en
Inventor
Chiaki Matsuyama
松山 千秋
Yoshinori Morita
啓徳 森田
Yasuo Nishiguchi
泰夫 西口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP61129829A priority Critical patent/JPH0728366B2/en
Publication of JPS62285569A publication Critical patent/JPS62285569A/en
Publication of JPH0728366B2 publication Critical patent/JPH0728366B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)

Abstract

PURPOSE:To contrive miniaturization and low cost by providing a light source support member having a long recess to the 2nd plate face side of a base and arranging a light source in the recess. CONSTITUTION:A long recess 18 is formed to a base support 17 in parallel with a photodetector array substantially, and plural LED chips 19 are arranged at the bottom face of the recess 18 at a prescribed interval in the direction of main scanning. A printed board 20 is provided to the base support 17 and a wiring pattern to drive the LED chip 19 is formed to the printed board 20. In selecting the interval between th LD chip 19 and the original 1 to nearly 6mm, since the original 1 can be irradiated by a sufficient lightness, the thickness of the entire reader is made to nearly 10mm or below even if the thickness of the printed board 20 and a metal plate for radiation 21 is taken into account.

Description

【発明の詳細な説明】 3、発明の詳細な説明 〔産業上の利用分野〕 本発明は、例えばファクシミリ装置の小型化を目指した
もので、実質上原稿と寸法的に1=1に対応させた光電
変換素子アレイを配置して成る密着型イメージセンサな
どの読取り装置に関するものである。
[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] The present invention aims at downsizing, for example, a facsimile machine, and the present invention is aimed at miniaturizing a facsimile machine, for example, by making the facsimile machine substantially correspond to a document in dimensionally 1=1. The present invention relates to a reading device, such as a contact type image sensor, in which a photoelectric conversion element array is arranged.

〔先行技術及びその問題点〕[Prior art and its problems]

近時、密着型イメージセンサの開発が活発化しており、
このセンサは原稿からの反射光を集束性ロッド・レンズ
・アレイを介して検知する型式や、このアレイを用いな
いでも優れた光量伝達率、小型化を達成した型式なども
開発されている。
Recently, the development of contact image sensors has become more active.
Other types of this sensor have been developed, including a type that detects the reflected light from the document via a focusing rod lens array, and a type that achieves excellent light transmission rate and miniaturization without using this array.

第4図は集束性ロッド・レンズ・アレイを用いない密着
型読取り系を示した概略図であり、原稿lと寸法的に実
質上1:1に対応させた光検知部2が原稿1に密着し、
発光ダイオード3が原稿1を投光し、その反射光を光検
知部2で受光する。
FIG. 4 is a schematic diagram showing a close-contact reading system that does not use a focusing rod lens array, in which a light detection section 2 that corresponds to the document 1 in a substantially 1:1 dimension is brought into close contact with the document 1. death,
The light emitting diode 3 emits light onto the original 1, and the light detecting section 2 receives the reflected light.

第5図及び第6図は光検知部2に相当する読取り装置で
あり、第6図は第5図中切断面線X−Xから見た断面図
である。
5 and 6 show a reading device corresponding to the photodetector 2, and FIG. 6 is a sectional view taken along the section line XX in FIG.

即ち、ガラスなどから成る透光性基板4が金属フレーム
などで構成された基板支持体5に付設されており、基板
4上にはCr、Affなどを蒸着して共通電極6a、6
b・・・が形成され、共通電極6a、6b上にはアモル
ファスシリコンなどから成る光電変換部7が形成され、
そして、この先電変換部7上にはITOなどの透明材料
から成る透明電極8がスパッタリングまたは蒸着によっ
て各々の光電変換部7に形成される。更に、この透明電
極8の一部を覆うようにCr % A 42などを蒸着
させて引出し電極9が個別的に接続され、最上部にはガ
ラスなどから成る透明な保護層lOが形成され、また、
共通電極6a、6b、光電変換部7及び透明電極8には
光通過孔11が形成される。基板支持体5の背後には発
光ダイオード3が配置される。そして、保jIJiIO
の上方には原稿1が配置され、発光ダイオード3から投
光される光は基板4、光通過孔11及び保護層10を介
して原稿lを照射し、その反射光は光通過孔ll付近の
透明電極8を透過し、光電変換部7によって受光される
。また、光通過孔11は原稿1の幅方向(主走査方向)
、即ち、発光ダイオード3の軸線方向に沿って間隔をあ
けて配置され、基板4上にはシフトレジスタなどの駆動
回路12が搭載される。
That is, a transparent substrate 4 made of glass or the like is attached to a substrate support 5 made of a metal frame or the like, and common electrodes 6a, 6 are formed by vapor-depositing Cr, Aff, etc. on the substrate 4.
b... are formed, and a photoelectric conversion section 7 made of amorphous silicon or the like is formed on the common electrodes 6a and 6b.
Then, a transparent electrode 8 made of a transparent material such as ITO is formed on each photoelectric conversion section 7 by sputtering or vapor deposition. Further, extraction electrodes 9 are individually connected by vapor depositing Cr%A42 or the like so as to cover a part of the transparent electrode 8, and a transparent protective layer IO made of glass or the like is formed on the top. ,
Light passing holes 11 are formed in the common electrodes 6a and 6b, the photoelectric conversion section 7, and the transparent electrode 8. A light emitting diode 3 is arranged behind the substrate support 5 . And, HojIJiIO
An original 1 is arranged above, and the light emitted from the light emitting diode 3 illuminates the original l through the substrate 4, the light passage hole 11, and the protective layer 10, and the reflected light is reflected near the light passage hole ll. The light passes through the transparent electrode 8 and is received by the photoelectric conversion section 7. In addition, the light passage hole 11 is arranged in the width direction of the original 1 (main scanning direction).
That is, the light emitting diodes 3 are arranged at intervals along the axial direction, and a drive circuit 12 such as a shift register is mounted on the substrate 4.

また、第7図は前記発光ダイオード3を示す。Further, FIG. 7 shows the light emitting diode 3. As shown in FIG.

即ち、LED搭載用基板13上に複数のLEDチップ1
4が所定の間隔をとりながらライン状に配列されており
、このLEDチップアレイの上には円柱形状の棒状レン
ズ15がその円柱の中心軸がLEDチップアレイと平行
に成るようにレンズ支持部材16によって設置される。
That is, a plurality of LED chips 1 are mounted on the LED mounting board 13.
4 are arranged in a line at a predetermined interval, and on top of this LED chip array, a cylindrical rod lens 15 is mounted with a lens support member 16 such that the central axis of the cylinder is parallel to the LED chip array. installed by.

この棒状レンズ15はLEDチップ14の照射光を集光
させることができるので、原稿1をその焦点距離付近に
位置させると原稿1に対する照度を著しく高めることが
できる。
Since this rod-shaped lens 15 can condense the light irradiated by the LED chip 14, when the original 1 is positioned near its focal length, the illuminance to the original 1 can be significantly increased.

しかしながら、この読取り装置によれば、原稿lと棒状
レンズ15の間隔を棒状レンズ15のもつ焦点距離(通
常約6mm)の大きさにする必要があり、また、発光ダ
イオード3の高さは約10mmあり、これにより、光検
知部2及び発光ダイオード3により構成された読取り装
置の厚みを最低約16mmの大きさにする必要があり、
その結果、読取り装置を更に一層小型化することが難し
くなっている。
However, according to this reading device, the distance between the original l and the rod-shaped lens 15 needs to be equal to the focal length of the rod-shaped lens 15 (usually about 6 mm), and the height of the light emitting diode 3 is about 10 mm. As a result, the thickness of the reading device composed of the photodetector 2 and the light emitting diode 3 must be at least about 16 mm.
As a result, it has become difficult to further reduce the size of reading devices.

〔発明の目的〕[Purpose of the invention]

従って本発明の目的は、LED光源の集光用レンズを用
いないことによって小型化を達成した読取り装置を提供
することにある。
Accordingly, an object of the present invention is to provide a reading device that achieves miniaturization by not using a condensing lens for an LED light source.

本発明の他の目的はLED光源の集光用レンズを不要と
したことによって低コスト化を達成した読取り装置を提
供することにある。
Another object of the present invention is to provide a reading device that achieves cost reduction by eliminating the need for a condensing lens for an LED light source.

〔問題点を解決するための手段〕[Means for solving problems]

本発明によれば、基板の第1板面上に光電変換素子アレ
イを形成し、該基板の第2板面側の該素子アレイと対応
する部位に光源を備え、この光源が第1板面側の被検知
体を投光し、その反射光を光電変換素子アレイが受光し
、この素子アレイから順次時系列に読取り信号が得られ
るようにした読取り装置において、基板の第2板面側に
長尺状凹部を有する光源支持部材を備えてこの凹部内に
前記光源を配置したことを特徴とする読取り装置が提供
さる。
According to the present invention, a photoelectric conversion element array is formed on a first plate surface of a substrate, a light source is provided at a portion corresponding to the element array on the second plate side of the substrate, and the light source is provided on the first plate surface. In a reading device in which light is emitted from the object to be detected on the side, the reflected light is received by a photoelectric conversion element array, and read signals are sequentially obtained from this element array in chronological order. A reading device is provided, comprising a light source support member having an elongated recess, and the light source is disposed within the recess.

〔実施例〕〔Example〕

次に本発明の実施例を第1図により説明す゛る。 Next, an embodiment of the present invention will be explained with reference to FIG.

第1図は第4図にて示した光検知部に相当する読取り装
置であるが、第5図の切断面線X−Xから見た第6図に
代わる断面図である。尚、第6図と同一箇所には同一符
号が付しである。
FIG. 1 shows a reading device corresponding to the photodetector shown in FIG. 4, but is a sectional view taken along the section line XX in FIG. 5 in place of FIG. 6. Note that the same parts as in FIG. 6 are given the same reference numerals.

即ち、透光性基板4が金属フレームなどで構成された基
板支持体17に付設されており、基板4上には共通電極
6a、6b・・・、光電変換部7、透明電極8、引出し
電極9及び保護層10が順次形成される。基板支持体1
7には長尺状の凹部18が受光素子アレイと実質上平行
に形成されており、この凹部18の底面に複数のLED
チップ19が所定の間隔(ピッチ)をとりながら主走査
方向に配列されている。基板支持体17にはプリント基
板20が付設されており、これが凹部18の底面を成し
ており、このプリント基板20にLEDチップ19を駆
動するための配線パターンが形成される。また、プリン
ト基板20にはLEDチップ19が駆動するのに伴って
発生する熱を放出するための放熱用金属板21が付設さ
れる。
That is, a transparent substrate 4 is attached to a substrate support 17 composed of a metal frame or the like, and on the substrate 4 are provided common electrodes 6a, 6b, . 9 and a protective layer 10 are sequentially formed. Substrate support 1
7 has an elongated recess 18 formed substantially parallel to the light-receiving element array, and a plurality of LEDs are arranged on the bottom surface of this recess 18.
Chips 19 are arranged in the main scanning direction at predetermined intervals (pitch). A printed circuit board 20 is attached to the substrate support 17 and forms the bottom surface of the recess 18, and a wiring pattern for driving the LED chip 19 is formed on this printed circuit board 20. Furthermore, a heat dissipation metal plate 21 is attached to the printed circuit board 20 to dissipate heat generated as the LED chip 19 is driven.

この読取り装置によれば、第4図にて示した光検知部2
及び発光ダイオード3が一体化しており、本発明者等の
実験によれば、LEDチップ19と原稿1との間隔を約
6mm位に設定すれば原稿1を十分な明るさで投光する
ことができるのでプリント基板20や放熱用金属板21
の厚みを考慮してもこの読取り装置の全体の厚みを約1
0mm以下に設定することが可能となる。
According to this reading device, the light detection section 2 shown in FIG.
and a light emitting diode 3 are integrated, and according to experiments by the inventors, if the distance between the LED chip 19 and the document 1 is set to about 6 mm, the document 1 can be illuminated with sufficient brightness. Printed circuit board 20 and heat dissipation metal plate 21
Even considering the thickness of the reader, the overall thickness of this reader is approximately 1
It becomes possible to set it to 0 mm or less.

また、この実施例に用いられた読取り装置を2〜16d
ot/mmの解像能力に設定した場合、上記凹部の大き
さ及びLEDチップのピッチを次の範囲内に設定すれば
よいことが本発明者等が行った実験により判明した。
In addition, the reading device used in this example was
It has been found through experiments conducted by the inventors that when the resolution capability is set to ot/mm, the size of the recess and the pitch of the LED chips should be set within the following ranges.

即ち、第1図にて示した凹部の幅Wは0.5〜3開、好
適には1〜2fflIl+の範囲内に設定するのがよく
、この幅Wが0.5mm未満であればLEDチップの実
装が困難になり、3開を越えると共通電極6a、6b・
・・が完全に遮光できなくなり、迷光が生じる。
That is, the width W of the recess shown in FIG. 1 is preferably set within the range of 0.5 to 3 mm, preferably 1 to 2 fflIl+, and if this width W is less than 0.5 mm, the LED chip It becomes difficult to implement the common electrodes 6a, 6b and
... cannot completely block light, causing stray light.

また、凹部の深さdは第2図から明らかな通り、その大
きさにより照度に顕著な差が生じる。つまり、図中A、
B及びCはそれぞれdを2.0mm 。
Further, as is clear from FIG. 2, the depth d of the recessed portion has a significant difference in illuminance depending on its size. In other words, A in the figure,
B and C each have d of 2.0 mm.

3.0mm及び5.0mmに設定した場合についてLE
Dチップからの距離に対する照度を示しており、d =
2.0mm(A)の場合にはLEDチップの設置付近で
最高の照度を示しているが、LEDチフブから離れるに
つれて照度が著しく低減する。これに対して、d =3
.0mm(B)、さらにd = 5.0mm (C)と
dが大きくなるのに伴ってLEDチップの設置付近の照
度は小さくなるが、その反面、LEDチップがら離れて
も比較的若干の照度が維持されている。
LE when set to 3.0mm and 5.0mm
It shows the illuminance relative to the distance from the D chip, where d =
In the case of 2.0 mm (A), the highest illuminance is shown near the installation of the LED chip, but the illuminance decreases significantly as the distance from the LED chip increases. On the other hand, d = 3
.. 0 mm (B) and then d = 5.0 mm (C), and as d increases, the illuminance near the LED chip installation decreases, but on the other hand, even if the LED chip is far away, the illuminance remains relatively small. Maintained.

そこで、本発明者等はLEDチップのピッチPを5mm
に設定して上記の通りdを3通りに設定した場合の主走
査方向の照度分布を測定したところ、第3図に示す通り
の結果が得られた。
Therefore, the present inventors set the pitch P of the LED chips to 5 mm.
When the illuminance distribution in the main scanning direction was measured when d was set in three ways as described above, the results shown in FIG. 3 were obtained.

第3図中a、b、cはそれぞれdを2.0mm、3 、
0mm及び5.0mmに設定した場合の照度分布であり
、図から明らかな通り、dが大きくなるのに伴って照度
は小さくなるが主走査方向に亘ってムラのない照度分布
となる。
In Fig. 3, a, b, and c each have d of 2.0 mm, 3,
This is the illuminance distribution when set to 0 mm and 5.0 mm, and as is clear from the figure, as d increases, the illuminance decreases, but the illuminance distribution becomes uniform over the main scanning direction.

従って、本発明者等は上述した実験結果に基いて、凹部
の深さdとLEDチップのピッチPをそれぞれ3〜8m
m、8mm以下、好適には深さdを4〜5mm5ピツチ
Pを2〜5mmに設定すればよいことを見出した。深さ
dが3mm未満では照度分布のバラツキが大きくなって
受光素子毎に均等な出力信号強度が得られなくなり、8
mmを越えると照度が小さくなるため受光素子の出力信
号強度が小さくなる。また、LEDチップのピッチPが
8mmを越えるとチップアレイ自体が有する照度分布の
バラツキが顕著になって受光素子毎に均等な出力信号強
度が得られなくなる。
Therefore, based on the above-mentioned experimental results, the inventors set the depth d of the recess and the pitch P of the LED chips from 3 to 8 m, respectively.
It has been found that it is sufficient to set the depth d to 4 to 5 mm and the pitch P to 2 to 5 mm. If the depth d is less than 3 mm, the variation in illuminance distribution will increase, making it impossible to obtain uniform output signal strength for each light receiving element.
If it exceeds mm, the illumination intensity will become small and the output signal intensity of the light receiving element will become small. Furthermore, if the pitch P of the LED chips exceeds 8 mm, the variation in the illuminance distribution of the chip array itself becomes significant, making it impossible to obtain uniform output signal strength for each light receiving element.

〔発明の効果〕〔Effect of the invention〕

以上の通り、本発明の読取り装置によれば、LEDアレ
イがもつ棒状レンズ(集光用レンズ)を不要とし、且つ
LEDチップのピンチをある程度の大きさに維持してチ
ップの使用量を少なくし、これにより、従来よりも一層
小型化且つ低コスト化が達成された。
As described above, according to the reading device of the present invention, the rod-shaped lens (condensing lens) of the LED array is not required, and the amount of chips used can be reduced by maintaining the pinch size of the LED chip to a certain degree. As a result, further miniaturization and lower cost than before have been achieved.

また、棒状レンズを備えたLEDアレイを読取り装置に
備えた場合、LEDチフプアレイを直線状に正確に配置
してそのチップのすべてを棒状レンズの焦点に設定する
ことは現在の量産製造技術上不可能であり、これにより
、主走査方向に対して均等な照度分布が得られない。こ
れに対して、本発明の読取り装置によれば、棒状レンズ
を用いないので正確な焦点合わせが不要となるのでLE
Dチップアレイの製造が筒略化され、これにより、高品
質且つ高信頼性の読取り装置が提供される。
Furthermore, when a reading device is equipped with an LED array equipped with a rod-shaped lens, it is impossible due to current mass production technology to accurately arrange the LED chip array in a straight line and set all of the chips to the focal point of the rod-shaped lens. As a result, an even illuminance distribution cannot be obtained in the main scanning direction. On the other hand, according to the reading device of the present invention, since no rod-shaped lens is used, accurate focusing is not required, so the LE
The manufacturing of the D-chip array is simplified, thereby providing a high quality and reliable reader.

尚、本発明は上記の実施例に限定されるものではなく、
本発明の要旨を逸脱しない範囲において種々の変更、改
良等は何等差支えない。
Note that the present invention is not limited to the above embodiments,
Various changes, improvements, etc. may be made without departing from the gist of the present invention.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の読取り装置を示す断面図、第2図は本
実施例に示した凹部の深さに対してLEDチップからの
距離と照度の関係を示す線図、第3図は第2図に示した
結果に基いてLEDチップのチップと照度分布を示す線
図、第4図は4寺読取り装置に係る読取り系を示す概略
図、第5図は従来の読取り装置の斜視図、第6図は第5
図中切断面線X−Xから見た断面図、第7図は従来の読
取り装置に用いられた発光ダイオードを示す概略図であ
る。 1・・・原稿  2・・・光検知部 3・・・発光ダイオード 5.17・・・基板支持体 14.19・・・LEDチップ 15・・・棒状レンズ  18・・・凹部特許出願人(
663)京セラ株式会社 第1図 第2図 LED士ツデカ゛らjデ「嵩良
FIG. 1 is a cross-sectional view showing the reading device of the present invention, FIG. 2 is a diagram showing the relationship between the depth of the recess shown in this embodiment, the distance from the LED chip, and the illuminance, and FIG. A diagram showing the LED chip and illumination distribution based on the results shown in Figure 2, Figure 4 is a schematic diagram showing a reading system related to a four-temple reading device, and Figure 5 is a perspective view of a conventional reading device. Figure 6 is the 5th
FIG. 7, a cross-sectional view taken along the section line XX in the figure, is a schematic diagram showing a light emitting diode used in a conventional reading device. 1... Original document 2... Light detection unit 3... Light emitting diode 5.17... Substrate support 14.19... LED chip 15... Rod-shaped lens 18... Concave portion Patent applicant (
663) Kyocera Corporation Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims]  基板の第1板面上に光電変換素子アレイを形成し、該
基板の第2板面側の該素子アレイと対応する部位に光源
を備え、この光源が第1板面側の被検知体を投光し、そ
の反射光を光電変換素子アレイが受光し、この素子アレ
イから順次時系列に読取り信号が得られるようにした読
取り装置において、基板の第2板面側に長尺状凹部を有
する光源支持部材を備えてこの凹部内に前記光源を配置
したことを特徴とする読取り装置。
A photoelectric conversion element array is formed on the first plate surface of the substrate, and a light source is provided at a portion corresponding to the element array on the second plate side of the substrate, and this light source detects the object to be detected on the first plate side. A reading device in which light is emitted, the reflected light is received by a photoelectric conversion element array, and read signals are sequentially obtained from this element array in chronological order, and the reader has an elongated recess on the second plate surface side of the substrate. A reading device comprising a light source support member and the light source disposed within the recess.
JP61129829A 1986-06-03 1986-06-03 Reader Expired - Lifetime JPH0728366B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61129829A JPH0728366B2 (en) 1986-06-03 1986-06-03 Reader

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61129829A JPH0728366B2 (en) 1986-06-03 1986-06-03 Reader

Publications (2)

Publication Number Publication Date
JPS62285569A true JPS62285569A (en) 1987-12-11
JPH0728366B2 JPH0728366B2 (en) 1995-03-29

Family

ID=15019254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61129829A Expired - Lifetime JPH0728366B2 (en) 1986-06-03 1986-06-03 Reader

Country Status (1)

Country Link
JP (1) JPH0728366B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328761U (en) * 1989-07-29 1991-03-22
JPH0444759U (en) * 1990-08-22 1992-04-16

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328761U (en) * 1989-07-29 1991-03-22
JPH0444759U (en) * 1990-08-22 1992-04-16

Also Published As

Publication number Publication date
JPH0728366B2 (en) 1995-03-29

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