JPS63186725A - Epoxy resin composition for semiconductor device - Google Patents
Epoxy resin composition for semiconductor deviceInfo
- Publication number
- JPS63186725A JPS63186725A JP1793287A JP1793287A JPS63186725A JP S63186725 A JPS63186725 A JP S63186725A JP 1793287 A JP1793287 A JP 1793287A JP 1793287 A JP1793287 A JP 1793287A JP S63186725 A JPS63186725 A JP S63186725A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- resin composition
- weight
- moisture resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 50
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 50
- 239000000203 mixture Substances 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 239000005011 phenolic resin Substances 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- 229920003986 novolac Polymers 0.000 claims abstract description 15
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 15
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 14
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229930003836 cresol Natural products 0.000 claims abstract description 11
- 239000003960 organic solvent Substances 0.000 claims abstract description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- 238000007789 sealing Methods 0.000 abstract description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 7
- 238000002156 mixing Methods 0.000 abstract description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 6
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011342 resin composition Substances 0.000 abstract description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 abstract 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- 238000000034 method Methods 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- AJHFBIPDUISYDU-UHFFFAOYSA-N 2-(2-ethyl-5-methyl-1h-imidazol-4-yl)propanenitrile Chemical compound CCC1=NC(C(C)C#N)=C(C)N1 AJHFBIPDUISYDU-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- -1 chlorine ions Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は半導体装置用エポキシ樹脂組成物に関し、さら
に詳しくは薄型で、耐湿性に優れた、信頼性の高い半導
体装置用エポキシ樹脂組成物に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to an epoxy resin composition for semiconductor devices, and more particularly to an epoxy resin composition for semiconductor devices that is thin, has excellent moisture resistance, and is highly reliable. .
（従来の技術）
エポキシ樹脂は接着性および耐湿性に優れ、しかも良好
な電気特性と機械特性とを有するため、電気および電子
部品の絶縁封止用材料として広く利用されている。(Prior Art) Epoxy resins have excellent adhesiveness and moisture resistance, as well as good electrical and mechanical properties, and are therefore widely used as insulation sealing materials for electrical and electronic components.
電子産業分野においては近年、一層の小型軽量化や高密
度化が進み、これに対応してハイブリッドＩＣの採用が
増加して半導体素子またはチップ部品の基板への直接実
装が広く行なわれている。BACKGROUND ART In recent years, in the field of electronic industry, there has been progress toward further reduction in size and weight and density, and in response to this, the adoption of hybrid ICs has increased, and direct mounting of semiconductor elements or chip components on substrates has become widespread.
このパイプリフトＩＣを外部からの湿気および塵から保
護するいわゆるパッケージ方法としては、従来気密封止
法と樹脂封止法とが知られている。As so-called packaging methods for protecting the pipe lift IC from external moisture and dust, the hermetic sealing method and the resin sealing method are conventionally known.
気密封止法は耐湿性および耐冷熱サイクル性に優れてお
り、信頼性の高いハイブリッドＩＣが得られる反面、コ
ストが高いという欠点があった。一方樹脂封止法はコス
トが安いものの、樹脂封止法に用いられる樹脂はエピ−
ビス型エポキシ樹脂とノボラック型および／またはレゾ
ール型フェノール樹脂硬化剤とを配合してなる樹脂組成
物が主流であり、この樹脂組成物は、耐ヒートサイクル
性が優れているものの耐湿性に劣るという欠点があり、
通用範囲が限られていた。そこで信頼性、特に耐湿性に
優れた封止用樹脂の開発が要望されている現状である。Although the hermetic sealing method has excellent moisture resistance and cold/heat cycle resistance and can provide a highly reliable hybrid IC, it has the drawback of high cost. On the other hand, although the cost of the resin encapsulation method is low, the resin used in the resin encapsulation method is epitaxial.
The mainstream is a resin composition made by blending a bis-type epoxy resin with a novolac-type and/or resol-type phenolic resin curing agent, and although this resin composition has excellent heat cycle resistance, it is said that it has poor moisture resistance. There are drawbacks,
The range of application was limited. Therefore, there is a current demand for the development of a sealing resin that has excellent reliability, especially moisture resistance.
また樹脂封止法の信頼性を向上させるためＩＣチップを
スポットシールした後、冷熱衝撃時の応力を軽減するた
めに可とう性のある樹脂をモールドし、その後エポキシ
樹脂系粉体塗料で外装する方法も提案されている（電子
材料編集部用「ハイブリッドＩＣ技術」）。しかしなが
らこの方法にも耐湿性および耐冷熱衝撃性を著しく向上
させることはできるが、製造工程が複雑であり、しかも
部品の薄型化のためには不向きであるという欠点があっ
た。In addition, to improve the reliability of the resin sealing method, after spot-sealing the IC chip, a flexible resin is molded to reduce stress during thermal shock, and then the exterior is coated with an epoxy resin powder coating. A method has also been proposed ("Hybrid IC Technology" for the Electronic Materials Editorial Department). However, although this method can significantly improve moisture resistance and cold shock resistance, it has the disadvantage that the manufacturing process is complicated and it is not suitable for thinning parts.
（発明が解決しようとする問題点）
本発明の目的は、前記従来技術の欠点を除去し、薄型で
、耐湿性に優れた信頼性の高い半導体装置を提供するこ
とができる半導体装置用エポキシ樹脂組成物を提供する
ことにある。(Problems to be Solved by the Invention) An object of the present invention is to provide an epoxy resin for semiconductor devices that can eliminate the drawbacks of the prior art and provide a thin, highly reliable semiconductor device with excellent moisture resistance. An object of the present invention is to provide a composition.
（問題点を解決するための手段）
本発明はエピ−ビス型エポキシ樹脂、クレゾール・ノボ
ラック型エポキシ樹脂、フェノール樹脂硬化剤、硬化促
進剤および有機溶剤を含有してなる半導体装置用エポキ
シ樹脂組成物に関する。(Means for Solving the Problems) The present invention provides an epoxy resin composition for semiconductor devices containing an epi-bis type epoxy resin, a cresol novolac type epoxy resin, a phenolic resin curing agent, a curing accelerator, and an organic solvent. Regarding.
本発明に使用されるエピ−ビス型エポキシ樹脂としては
、例えばビスフェノールＡまたはビスフェノールＦとエ
ピクロルヒドリンとから誘導されるエホー１−シ４ＡＪ
ＪＩＬ １． １−ビス（４−ヒドロキシフェニル）エ
タンとエピクロルヒドリンとかう誘導されるエポキシ樹
脂等が挙げられ、そのエポキシ当量には特に制限はない
が、耐湿性の点から４５０以上であることが好ましい。The epi-bis type epoxy resin used in the present invention includes, for example, epi-bis 4AJ derived from bisphenol A or bisphenol F and epichlorohydrin.
JIL 1. Examples include epoxy resins derived from 1-bis(4-hydroxyphenyl)ethane and epichlorohydrin, and the epoxy equivalent thereof is not particularly limited, but is preferably 450 or more from the viewpoint of moisture resistance.
本発明に使用されるクレゾール・ノボラック型エポキシ
樹脂としては、例えば０−クレゾール・ノボラック樹脂
、ｐ−クレゾール・ノボラック樹脂等が挙げられ、その
分子量やエポキシ当量には特に制限はない。Examples of the cresol/novolac type epoxy resin used in the present invention include 0-cresol/novolac resin, p-cresol/novolac resin, etc., and there are no particular limitations on the molecular weight or epoxy equivalent.
本発明に使用されるエピ−ビス型エポキシ樹脂とクレゾ
ール・ノボラック型エポキシ樹脂との配合割合は、耐湿
性、成膜性、耐冷熱衝撃性の点からエピ−ビス型エポキ
シ樹脂／クレゾール・ノボラック型エポキシ樹脂の重量
比が、７／３〜２／８の範囲が好ましい。The mixing ratio of the Epi-Bis type epoxy resin and the Cresol/Novolac type epoxy resin used in the present invention is determined from the viewpoints of moisture resistance, film forming properties, and cold/thermal shock resistance. The weight ratio of the epoxy resin is preferably in the range of 7/3 to 2/8.
本発明に使用されるフェノール樹脂硬化剤としては、例
えばビスフェノールＡ１フエノールとホルムアルデヒド
とから誘導されるフェノール樹脂等が挙げられる。成膜
性や耐湿性の点から、フェノール樹脂硬化剤の水酸基当
量は１０５〜１１０ｇ ／ ｅ ｑ ％軟化点は６５℃
以上であることが好ましい。またこのフェノール樹脂に
含有される塩素イオンとナトリウムイオンとの量が５ｐ
ｐｍ以下の場合にはさらに耐湿性の向上が図られる。Examples of the phenolic resin curing agent used in the present invention include phenolic resins derived from bisphenol A1 phenol and formaldehyde. From the point of view of film forming properties and moisture resistance, the hydroxyl equivalent of the phenolic resin curing agent is 105 to 110 g/eq%, and the softening point is 65°C.
It is preferable that it is above. In addition, the amount of chlorine ions and sodium ions contained in this phenolic resin is 5p.
When it is below pm, the moisture resistance is further improved.
フェノール樹脂硬化剤は耐湿性の点からエポキシ基１個
に対し水酸基０．８〜１．２個の割合で配合することが
好ましい。From the viewpoint of moisture resistance, the phenol resin curing agent is preferably blended in a ratio of 0.8 to 1.2 hydroxyl groups to one epoxy group.
本発明に使用される硬化促進剤としては、例えば１−シ
アノエチル−２−エチル−４−メチルイミダゾール等の
イミダゾール化合物、ベンジルジメチルアミン等の第三
級アミン類などの塩基性化合物が挙げられる。これらの
硬化促進剤の配合割合は、硬化性と貯蔵安定性とのバラ
ンスの点からフェノール樹脂硬化剤１００重量部に対し
て０．１〜３重量部が好ましい。Examples of the curing accelerator used in the present invention include basic compounds such as imidazole compounds such as 1-cyanoethyl-2-ethyl-4-methylimidazole and tertiary amines such as benzyldimethylamine. The blending ratio of these curing accelerators is preferably 0.1 to 3 parts by weight based on 100 parts by weight of the phenolic resin curing agent from the viewpoint of the balance between curability and storage stability.
本発明に使用される有機溶剤としては、例えばベンゼン
、トルエン、キシレン等の芳香族系炭化水素、アセトン
、メチルエチルケトン、メチルイソブチルケトン等のケ
トン類、メタノール、エタノール、ｎ−ブタノール、イ
ソブタノール等のアルコール類、エチレングリコールモ
ノメチルエーテル、エチレングリコールモノエチルエー
テル、エチレングリコールモノブチルエーテル等のエー
テル類、酢酸エチル、酢酸ブチル等のエステル類などが
挙げられる。これらの化合物は単独でまたは２種以上混
合して使用される。トルエン／メタノール／エチレング
リコールモノブチルエーテルの混合系は、硬化時に溶媒
が一度に飛散して塗膜が発泡することがな（、特に好ま
しい。Examples of organic solvents used in the present invention include aromatic hydrocarbons such as benzene, toluene, and xylene, ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, and alcohols such as methanol, ethanol, n-butanol, and isobutanol. Examples include ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol monobutyl ether, and esters such as ethyl acetate and butyl acetate. These compounds may be used alone or in combination of two or more. A mixed system of toluene/methanol/ethylene glycol monobutyl ether is particularly preferred because the solvent does not scatter all at once and the coating film does not foam during curing.
有機溶剤は所望の膜厚が得られるように適宜その配合割
合が決められる。The blending ratio of the organic solvent is determined as appropriate so that a desired film thickness can be obtained.
本発明のエポキシ樹脂組成物は、前記のエピ−ビス型エ
ポキシ樹脂、クレゾール・ノボラック型エポキシ樹脂、
フェノール樹脂硬化剤、硬化促進剤および有機溶剤を、
配合することにより得られる。The epoxy resin composition of the present invention includes the above-mentioned epi-bis type epoxy resin, cresol novolac type epoxy resin,
Phenolic resin curing agent, curing accelerator and organic solvent,
Obtained by blending.
本発明のエポキシ樹脂組成物には、所望によりカップリ
ング剤、着色剤、消泡剤、充虜剤とじてに制限はない。The epoxy resin composition of the present invention may optionally include a coupling agent, a coloring agent, an antifoaming agent, a filler, etc. without any limitation.
（発明の効果）
本発明のエポキシ樹脂組成物は、その硬化物がクレゾー
ル・ノボラック型エポキシ樹脂の欠点であるヒートサイ
クル性を向上させ、しかもエピ−ビス型エポキシ樹脂の
欠点である耐湿性をも著しく向上させた優れたものであ
る。(Effects of the Invention) The cured product of the epoxy resin composition of the present invention improves the heat cycle property, which is a drawback of cresol novolac type epoxy resins, and also has moisture resistance, which is a drawback of epi-bis type epoxy resins. This is an excellent product that has been significantly improved.
本発明のエポキシ樹脂組成物は、半導体装置の対土用樹
脂として使用することにより薄型（例えば膜厚約１００
μｍ）で、耐湿性に優れた、信頼性の高い半導体装置を
提供することができる。The epoxy resin composition of the present invention can be used as a soil-retaining resin for semiconductor devices to achieve a thin structure (for example, a film thickness of about 100 mm).
μm), it is possible to provide a highly reliable semiconductor device with excellent moisture resistance.
（実施例） 実施例１ 。(Example) Example 1.
エポキシ当ｆｆ１２０００のエピコート１００７ （
エピ−ビス型エポキシ樹脂、油化シェルエポキシ（株）
ｍ商品名）５０重量部、エポキシ当量的２００のＹＤＣ
Ｎ−７０２（クレゾール・ノボラック型エポキシ樹脂、
東部化成（株）製部品名）５０重量部、フェノール樹脂
硬化剤Ｈ−１（明相化成（株）製）２８重量部、硬化促
進剤として１−シアノエチル−２−エチル−４−メチル
イミダゾール（四国化成（株）製、２Ｅ４ＭＺ−ＣＮ）
０゜２重量部、トルエン６０ｉ量部、メタノール３０重
量部およびエチレングリコールモツプチルエーテル３０
重量部を配合してフラスコ内で８０℃に加温、攪拌して
完全に溶解させ、本発明のエポキシ樹脂組成物を得た。Epoxy ff12000 Epicoat 1007 (
Epi-bis type epoxy resin, Yuka Shell Epoxy Co., Ltd.
m trade name) 50 parts by weight, epoxy equivalent 200 YDC
N-702 (cresol novolac type epoxy resin,
50 parts by weight of phenolic resin curing agent H-1 (manufactured by Meiso Kasei Co., Ltd.), 1-cyanoethyl-2-ethyl-4-methylimidazole (as a curing accelerator) Manufactured by Shikoku Kasei Co., Ltd., 2E4MZ-CN)
0.2 parts by weight, 60 parts by weight of toluene, 30 parts by weight of methanol, and 30 parts by weight of ethylene glycol motubutyl ether.
Parts by weight were blended, heated to 80°C in a flask, stirred, and completely dissolved to obtain an epoxy resin composition of the present invention.
実施例２
エポキシ当量９００のエビコー）１００４ （エピ−
ビス型エポキシ樹脂、油化シェルエポキシ（株）製）４
０！ｆｆｉ部、エポキシ当量的２００のＹＤＣＮ−７０
２（クレゾール・ノボラック型エポキシ樹脂、東部化成
（株）製）６０重量部、フェノール樹脂硬化剤Ｈ−１（
明相化成（株）製）３４ｆｆｉ１部、硬化促進剤として
ベンジルジメチルアミン（正正（株）製）０．５重量部
、カップリング剤Ａｌ１００ （日本ユニカー（株）製
）２Ｍ量部、トルエン３０重量部、メタノール５０重量
部およびエチレングリコールモノエチルエーテル３０重
量部を配合してフラスコ内で８０℃に加温、攪拌して完
全に溶解させ、本発明のエポキシ樹脂組成物を得た。Example 2 Epoxy equivalent weight 900 Ebico) 1004 (Epi-
Screw-type epoxy resin, manufactured by Yuka Shell Epoxy Co., Ltd.) 4
0! ffi part, epoxy equivalent 200 YDCN-70
2 (cresol novolak type epoxy resin, manufactured by Tobu Kasei Co., Ltd.) 60 parts by weight, phenolic resin curing agent H-1 (
1 part of 34ffi (manufactured by Meiso Kasei Co., Ltd.), 0.5 parts by weight of benzyldimethylamine (manufactured by Seisei Co., Ltd.) as a curing accelerator, 2M parts of coupling agent Al100 (manufactured by Nippon Unicar Co., Ltd.), 30 parts of toluene. parts by weight, 50 parts by weight of methanol, and 30 parts by weight of ethylene glycol monoethyl ether were blended, heated to 80°C in a flask, stirred, and completely dissolved to obtain an epoxy resin composition of the present invention.
実施例３
エポキシ当量２０００のエピコート１００７ （エピ−
ビス型エポキシ樹脂、油化シェルエポキシ（株）１１）
３０重量部、エポキシ当量的２２０のＥＯＣＮ−１０２
（クレゾール・ノボラック型エポキシ樹脂、日本化薬（
株）製部品名）７０重量部、フェノール樹脂硬化剤ＨＰ
−６０７Ｎ （日立化成工業（株）製）４０Ｍ量部、硬
化促進剤としてポリキャット５ＡＮＯ１０２（サンアボ
ット（株）製部品名）１重量部、カップリング剤ＫＢＭ
４０３ （信越化学（株）製部品名）２重量部、トルエ
ン３０重量部、メタノール５０重量部およびエチレング
リコールモノエチルエーテル３０重量部を配合してフラ
スコ内で８０℃に加温、攪拌して完全に溶解させ、本発
明のエポキシ樹脂組成物を得た。Example 3 Epikote 1007 (Epi-
Screw-type epoxy resin, Yuka Shell Epoxy Co., Ltd. 11)
30 parts by weight, epoxy equivalent 220 EOCN-102
(Cresol novolac type epoxy resin, Nippon Kayaku (
Co., Ltd. part name) 70 parts by weight, phenolic resin curing agent HP
-607N (manufactured by Hitachi Chemical Co., Ltd.) 40M parts, as a curing accelerator Polycat 5ANO102 (part name manufactured by Sun Abbott Co., Ltd.) 1 part by weight, coupling agent KBM
403 (part name manufactured by Shin-Etsu Chemical Co., Ltd.) 2 parts by weight, 30 parts by weight of toluene, 50 parts by weight of methanol, and 30 parts by weight of ethylene glycol monoethyl ether were mixed together, heated to 80°C in a flask, and stirred to complete the mixture. The epoxy resin composition of the present invention was obtained.
比較例１
エポキシ当、ｆｆ２０００のエピコート１００７ （
エピ−ビス型エポキシ樹脂、油化シェルエポキシ（株）
製）１００重量部、フェノール樹脂硬化剤Ｈ−１（明相
化成（株）製）５重量部、硬化促進剤として１−シアノ
エチル−２−エチル−４−メチルイミダゾール（四国化
成（株）ｆ１！！、２Ｅ４ＭＺ−ＣＮ）０．２重量部、
トルエン６０重量部、メタノール３０重量部およびエチ
レングリコールモノブチルエーテル３０重量部を配合し
てフラスコ内で８０℃に加温、攪拌して完全に熔解させ
、エポキシ樹脂組成物を得た。Comparative Example 1 Epoxy, ff2000 Epikote 1007 (
Epi-bis type epoxy resin, Yuka Shell Epoxy Co., Ltd.
100 parts by weight of phenolic resin curing agent H-1 (manufactured by Meiso Kasei Co., Ltd.), 5 parts by weight of phenolic resin curing agent H-1 (manufactured by Meiso Kasei Co., Ltd.), and 1-cyanoethyl-2-ethyl-4-methylimidazole (manufactured by Shikoku Kasei Co., Ltd. f1!) as a curing accelerator. !, 2E4MZ-CN) 0.2 parts by weight,
60 parts by weight of toluene, 30 parts by weight of methanol, and 30 parts by weight of ethylene glycol monobutyl ether were blended, heated to 80°C in a flask, stirred, and completely melted to obtain an epoxy resin composition.
比較例２
エポキシ当量２００のＹＤＣＮ−７０２（クレゾール・
ノボラック型エポキシ樹脂、東部化成（株）製部品名）
１００！量部、フェノール樹脂硬化剤Ｈ−１（明相化成
（株）製部品名）５２正量部、硬化促進剤として１−シ
アンエチル−２−エチル−４−メチルイミダゾール（四
国化成（株）製、２８４ＭＺ−ＣＮ）０．２重量部、ト
ルエン６０重量部、メタノール３０Ｍ量部およびエチレ
ングリコールモノブチルエーテル３０重量部を配合して
フラスコ内で８０°Ｃに加温、攪拌して完全に熔解させ
、エポキシ樹脂組成物を得た。Comparative Example 2 YDCN-702 (cresol) with an epoxy equivalent of 200
Novolac type epoxy resin, manufactured by Tobu Kasei Co., Ltd. Part name)
100! 52 parts by weight of phenolic resin curing agent H-1 (part name manufactured by Meiso Kasei Co., Ltd.), 1-cyanethyl-2-ethyl-4-methylimidazole (manufactured by Shikoku Kasei Co., Ltd.) as a curing accelerator . An epoxy resin composition was obtained.
試験例
実施例１〜３および比較例１〜２で得られたエポキシ樹
脂組成物を、第１図に外観および第２図に断面図を示す
ＩＣ封止用セラミックキャップ１（１５Ｘ２５Ｘ２鳳園
、厚さ１璽１のハイフ゛リッドｒｃ用セラミック基板３
との接着面に塗布後、８０℃で１時間予備乾燥した。次
いで第３図に示すように５００ｇの荷Ｍ４をかけて１８
０℃で２時間硬化させ、セラミックキャップ１をイボキ
シ樹脂組成物２で接着したハイブリッドＩＣ用セラミッ
ク基板３を試料として用い、ＭＩＬ規格ＭＩＬ−３ＴＤ
−８８３Ｂのグロスリーク試験（フロロカーボンにより
）で気密性を評価した。その結果を第１表に示す。Test Examples The epoxy resin compositions obtained in Examples 1 to 3 and Comparative Examples 1 to 2 were used in a ceramic cap 1 for IC sealing (15 x 25 Ceramic substrate 3 for hybrid RC of size 1
After coating on the adhesive surface, it was pre-dried at 80° C. for 1 hour. Next, as shown in Figure 3, a 500g load M4 was applied to the 18
A ceramic substrate 3 for hybrid IC, which was cured at 0° C. for 2 hours and a ceramic cap 1 was bonded with an ivoxy resin composition 2, was used as a sample, and the MIL standard MIL-3TD was used.
-883B gross leak test (using fluorocarbon) to evaluate airtightness. The results are shown in Table 1.
（１）半田耐熱性：２６０℃の半田浴に１０秒間浸漬す
る。(1) Solder heat resistance: Immerse in a 260°C solder bath for 10 seconds.
（２）耐ヒートザイクル性ニー４５℃−ｃ １ 時ｆ？
Ｆｆ、次いで１２５℃で１
時間の処理を１サイ
クルとして１００サ
イクル行なう。(2) Heat cycle resistance knee 45℃-c 1 hour f?
Ff and then 100 cycles, each cycle consisting of treatment at 125° C. for 1 hour.
（３）耐湿性：水を入れた１２０℃、２気圧のオートク
レーブ中で１００時間放置
する。(3) Moisture resistance: Leave in an autoclave filled with water at 120°C and 2 atm for 100 hours.
第 １ 表
（８も表中の分子はリーク不良（１０−８ｍｍｌ（ｇで
リークしたもの）の数、分母は全試料数を示す。In Table 1 (also referred to as 8), the numerator indicates the number of leak failures (10-8 mml (leaked in g)), and the denominator indicates the total number of samples.
第１表の結果から、本発明により、ノボラック型エポキ
シ用脂の欠点である脆弱さを改善でき、そのためヒート
サイクル性が向上され、しかもエピ−ビス型エポキシ樹
脂の欠点である耐湿性をも向上されることが示される。From the results shown in Table 1, the present invention can improve the fragility, which is a drawback of novolak type epoxy resins, improve heat cycle performance, and also improve moisture resistance, which is a drawback of epi-bis type epoxy resins. It is shown that
第１図および第２図は、本発明の試験例で用いたＩＣ封
止用セラミックキャップの形状を示す図、ならびに第３
図は、試験例で行なったエポキシ樹脂組成物を塗布した
ハイブリッドＩＣ用セラミックキャップを、ハイブリッ
ドＩＣ用セラミック基板に接着する方法を示す図である
。
１・・・セラミックキャップ、２・・・エポキシ樹脂組
成物、３・・・ハイブリッドＩＣ用セラミック基板、４
・・・荷重（５００ｇ）。
、ｆ１２ 図
第 ３ 図1 and 2 are diagrams showing the shape of the ceramic cap for IC sealing used in test examples of the present invention, and
The figure is a diagram showing a method of bonding a hybrid IC ceramic cap coated with an epoxy resin composition to a hybrid IC ceramic substrate in a test example. DESCRIPTION OF SYMBOLS 1... Ceramic cap, 2... Epoxy resin composition, 3... Ceramic substrate for hybrid IC, 4
...Load (500g). , f12 Figure 3
Claims (1)
ク型エポキシ樹脂、フェノール樹脂硬化剤、硬化促進剤
および有機溶剤を含有してなる半導体装置用エポキシ樹
脂組成物。1. An epoxy resin composition for semiconductor devices containing an epi-bis type epoxy resin, a cresol novolak type epoxy resin, a phenolic resin curing agent, a curing accelerator, and an organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1793287A JPS63186725A (en) | 1987-01-28 | 1987-01-28 | Epoxy resin composition for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1793287A JPS63186725A (en) | 1987-01-28 | 1987-01-28 | Epoxy resin composition for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63186725A true JPS63186725A (en) | 1988-08-02 |
Family
ID=11957546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1793287A Pending JPS63186725A (en) | 1987-01-28 | 1987-01-28 | Epoxy resin composition for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63186725A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02173057A (en) * | 1988-12-27 | 1990-07-04 | Sumitomo Bakelite Co Ltd | Resin composition for semiconductor sealing |
| KR100398315B1 (en) * | 2001-02-12 | 2003-09-19 | 한국과학기술원 | Method of manufacturing conductive adhesive for high frequency flip chip package applications |
-
1987
- 1987-01-28 JP JP1793287A patent/JPS63186725A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02173057A (en) * | 1988-12-27 | 1990-07-04 | Sumitomo Bakelite Co Ltd | Resin composition for semiconductor sealing |
| KR100398315B1 (en) * | 2001-02-12 | 2003-09-19 | 한국과학기술원 | Method of manufacturing conductive adhesive for high frequency flip chip package applications |
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