JPS63183525U - - Google Patents
Info
- Publication number
- JPS63183525U JPS63183525U JP7395087U JP7395087U JPS63183525U JP S63183525 U JPS63183525 U JP S63183525U JP 7395087 U JP7395087 U JP 7395087U JP 7395087 U JP7395087 U JP 7395087U JP S63183525 U JPS63183525 U JP S63183525U
- Authority
- JP
- Japan
- Prior art keywords
- cantilever beam
- strain
- force sensor
- resistor
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Measurement Of Force In General (AREA)
Description
第１図ａ，ｂおよびｃは本考案の一実施例に係
る力センサを示す上面図、側面図および下面図、
第２図は第１図に示した力センサにおけるフルブ
リツジ回路の接続態様を示す模式図、第３図は第
２図に示したフルブリツジ回路を示す回路図であ
る。
図において、１……片持ちはり、１ａ〜１ｄ…
…透孔、２，３……支持部材、４ａ〜４ｄ……感
歪抵抗、５……調整用抵抗、６ａ〜６ｄ……電極
端子、７……リード線、８ａ，８ｂ……導体カツ
テイング部、９……力点である。
Figures 1a, b and c are top, side and bottom views of a force sensor according to an embodiment of the present invention;
FIG. 2 is a schematic diagram showing the connection mode of the full bridge circuit in the force sensor shown in FIG. 1, and FIG. 3 is a circuit diagram showing the full bridge circuit shown in FIG. 2. In the figure, 1...cantilever beams, 1a to 1d...
...Through hole, 2, 3... Support member, 4a-4d... Strain-sensitive resistor, 5... Adjustment resistor, 6a-6d... Electrode terminal, 7... Lead wire, 8a, 8b... Conductor cutting part , 9...This is the emphasis.
Claims (1)
持ちはりと、 この片持ちはりの感歪部の上下両面に厚膜印刷
・焼成技術によりそれぞれ２つずつ形成された感
歪抵抗と、 前記片持ちはりの不感歪部の一面に厚膜印刷・
焼成技術により形成されたトリミング可能な調整
用抵抗と、 厚膜印刷・焼成技術により前記片持ちはりを貫
通する透孔を通じてスルーホール印刷されて形成
され前記感歪抵抗と前記調整用抵抗とをフルブリ
ツジ接続するリード線と、 を有することを特徴とする力センサ。 (2) 前記片持ちはりが、セラミツク板により形
成されていることを特徴とする実用新案登録請求
の範囲第１項記載の力センサ。 (3) 前記片持ちはりが、ガラスグレース絶縁層
を表面に有する金属板により形成されていること
を特徴とする実用新案登録請求の範囲第１項記載
の力センサ。 (4) 前記調整用抵抗が、前記リード線の一部を
切断することにより前記感歪抵抗でなるフルブリ
ツジ回路のうちの２辺のいずれか一方に選択的に
介挿されるようになつていることを特徴とする実
用新案登録請求の範囲第１項記載の力センサ。[Scope of Claim for Utility Model Registration] (1) A cantilever beam whose surface is insulating at least in part, and two each formed on the top and bottom sides of the strain-sensitive part of this cantilever beam using thick film printing and baking technology. thick film printing/printing on one side of the strain-sensitive resistor and the insensitive strain part of the cantilever beam.
A trimmable adjustment resistor formed by a firing technique, and a through-hole printed through a hole penetrating the cantilever beam by a thick film printing/baking technique to form a full bridge between the strain-sensitive resistor and the adjustment resistor. A force sensor comprising: a connecting lead wire; (2) The force sensor according to claim 1, wherein the cantilever beam is formed of a ceramic plate. (3) The force sensor according to claim 1, wherein the cantilever beam is formed of a metal plate having a glass gray insulating layer on its surface. (4) The adjustment resistor is configured to be selectively inserted into either one of two sides of the full bridge circuit made up of the strain-sensitive resistor by cutting a part of the lead wire. A force sensor according to claim 1 of the utility model registration claim, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7395087U JPH0450521Y2 (en) | 1987-05-18 | 1987-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7395087U JPH0450521Y2 (en) | 1987-05-18 | 1987-05-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63183525U true JPS63183525U (en) | 1988-11-25 |
| JPH0450521Y2 JPH0450521Y2 (en) | 1992-11-27 |
Family
ID=30918738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7395087U Expired JPH0450521Y2 (en) | 1987-05-18 | 1987-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0450521Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010249782A (en) * | 2009-04-20 | 2010-11-04 | Minebea Co Ltd | Bending sensor |
-
1987
- 1987-05-18 JP JP7395087U patent/JPH0450521Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010249782A (en) * | 2009-04-20 | 2010-11-04 | Minebea Co Ltd | Bending sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0450521Y2 (en) | 1992-11-27 |