JPH01118353U - - Google Patents
Info
- Publication number
- JPH01118353U JPH01118353U JP1140788U JP1140788U JPH01118353U JP H01118353 U JPH01118353 U JP H01118353U JP 1140788 U JP1140788 U JP 1140788U JP 1140788 U JP1140788 U JP 1140788U JP H01118353 U JPH01118353 U JP H01118353U
- Authority
- JP
- Japan
- Prior art keywords
- condensation sensor
- dew condensation
- electrodes
- comb
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005494 condensation Effects 0.000 claims description 8
- 238000009833 condensation Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 description 1
Description
第1図、第2図は、本考案の実施例を示す結露
センサの表面と裏面側からみた斜視図、第3図は
、同実施例を示す結露センサを回路基板に搭載し
た状態の一部縦断側面図、第4図と第5図は、本
考案の他の実施例を示す結露センサの表面と裏面
側からみた斜視図、第6図は、同実施例を示す結
露センサを回路基板に搭載した状態の一部縦断側
面図、第7図〜第9図は、本考案の他の実施例を
示す結露センサの斜視図、第10図は、従来例を
示す結露センサをシヤーシから取り外した状態の
斜視図、第11図は、同従来例で示した結露セン
サをシヤーシに取り付けた状態の一部縦断側面図
である。
1……基板、3……クシ形電極、4……感湿膜
、8……端子電極。
Figures 1 and 2 are perspective views of a dew condensation sensor according to an embodiment of the present invention seen from the front and back sides, and Figure 3 is a partial view of the dew condensation sensor according to the embodiment mounted on a circuit board. 4 and 5 are perspective views from the front and back sides of a dew condensation sensor showing another embodiment of the present invention, and FIG. 6 shows a condensation sensor mounted on a circuit board showing the same embodiment. FIGS. 7 to 9 are perspective views of a dew condensation sensor showing other embodiments of the present invention, and FIG. 10 shows a conventional dew condensation sensor removed from the chassis. FIG. 11, which is a perspective view of the present invention, is a partially vertical side view of the conventional example in which the dew condensation sensor is attached to the chassis. DESCRIPTION OF SYMBOLS 1...Substrate, 3...Comb-shaped electrode, 4...Moisture-sensitive membrane, 8...Terminal electrode.
Claims (1)
,3が形成され、該クシ形電極3,3を覆うよう
に感湿膜4が設けられた結露サンサにおいて、前
記基板1の端面または裏面の両端寄りの少なくと
も何れか一方に、前記各クシ形電極と電気的に接
続された端子電極8,8が形成されていることを
特徴とする結露センサ。 A pair of comb-shaped electrodes 3 are placed on the surface of an insulating substrate 1.
. A dew condensation sensor characterized by forming terminal electrodes 8, 8 electrically connected to the electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1140788U JPH01118353U (en) | 1988-01-30 | 1988-01-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1140788U JPH01118353U (en) | 1988-01-30 | 1988-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01118353U true JPH01118353U (en) | 1989-08-10 |
Family
ID=31219932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1140788U Pending JPH01118353U (en) | 1988-01-30 | 1988-01-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01118353U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016217757A (en) * | 2015-05-15 | 2016-12-22 | 富士通株式会社 | Gas sensor device component, gas sensor device and fabrication method for the same, information processing system |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52140871A (en) * | 1976-05-19 | 1977-11-24 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
JPS5599057A (en) * | 1979-01-24 | 1980-07-28 | Matsushita Electric Ind Co Ltd | Detecting element |
JPS6126162B2 (en) * | 1979-03-02 | 1986-06-19 | Ushio Electric Inc | |
JPS61270649A (en) * | 1985-05-24 | 1986-11-29 | Omron Tateisi Electronics Co | Moisture sensitive element |
-
1988
- 1988-01-30 JP JP1140788U patent/JPH01118353U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52140871A (en) * | 1976-05-19 | 1977-11-24 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
JPS5599057A (en) * | 1979-01-24 | 1980-07-28 | Matsushita Electric Ind Co Ltd | Detecting element |
JPS6126162B2 (en) * | 1979-03-02 | 1986-06-19 | Ushio Electric Inc | |
JPS61270649A (en) * | 1985-05-24 | 1986-11-29 | Omron Tateisi Electronics Co | Moisture sensitive element |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016217757A (en) * | 2015-05-15 | 2016-12-22 | 富士通株式会社 | Gas sensor device component, gas sensor device and fabrication method for the same, information processing system |