JPS63182840A - Integrated circuit case for power supply - Google Patents

Abstract

PURPOSE:To enable a large current to be supplied for limiting voltage decline to the minimum by a method wherein a contactor in contact with a lead terminal only for power supply as well as another contactor in contact with another lead terminal only for grounding are arranged in an inner layer of IC case. CONSTITUTION:A grounding E contactor i.e. a grounding copper bar 3 and a power supply V contactor i.e. a voltage supplying copper bar 4 are arranged inside an outer wall cover 2 of IC case 10. The copper bars 3, 4 are provided with outer connecting terminal parts 31, 41 fixed as tap holes or socket contacts while outer connecting holes 22, 21 are formed in the outer wall cover 2 corresponding to the terminal parts 31, 41. Through these procedures, the contactors 3, 4 can be externally power-supplied through the intermediary of the connecting holes 21, 22 made in the outerwall coated with insulator.

Description

[Detailed Description of the Invention] [Summary] The present invention is configured to enable conduction using an IC case as a power supply terminal when supplying power to an integrated circuit such as an integrated circuit (IC) or a large integrated circuit (LSI). , which supplies a large current with a low voltage drop.

[Industrial application field]

The present invention relates to the structure of a case for an integrated circuit (IC), large-scale integrated circuit (LSI), etc., and particularly relates to a structure in which an IC case is used as a power supply terminal.

In recent years, with the development of the information society, integrated circuits (IC)
, semiconductor components such as large integrated circuits (LSI) (hereinafter referred to as
There has been a remarkable improvement in the degree of integration of ICs (all of which are collectively referred to as ICs), and there are even devices that can even reach enemy gates (a gate refers to the number of logic elements integrated on one chip) in a single chip. ing. In proportion to this increase in the degree of integration, the power consumption per IC chip and the IC chip
The power consumption per electronic circuit package on which a chip is mounted tends to increase dramatically, and efficient supply of large current is required. In addition, a voltage drop in the power supply system has a subtle effect on the output level adjustment of the main power supply. That is, the output terminal of the main power source must be set in consideration of the voltage drop in the power supply system to the element.

For this reason, it is necessary to reduce the voltage drop when supplying a large current.

[Conventional technology]

Conventional IC cases are shown in FIGS. 5 and 6.

FIG. 5 shows the completed IC case sealed in the case, and FIG. 6 shows the IC with the lid 8 (FIG. 5), which is the upper case, removed. In FIG. 6, 9 indicates an IC case body, 91 a chip constituting logic mounted on the IC case body, and 92 an input/output terminal. These input/output terminals 92 are connected to through holes of a printed wiring board (not shown). A bonding connection is made between the chip 91 and the connection terminal 92 using a fine wire 93.

The chip 91 side is bonded to the chip fixing terminal portion. Power is supplied to the IC chip 91, which is this element, from a main power source placed outside via a pattern (generally an inner layer pattern) on the printed wiring board. One of the connection terminals at both ends of the element is used for voltage supply (V), and the other is used for grounding (E).

(Problems to be Solved by the Invention) Power is supplied from the conventional main power supply (generally a dedicated package) to the IC chip 91 via various connectors. Namely, the main power supply - main power output connector back Board - Printed wiring board connector - Printed wiring board pattern - Lead terminal - Fine wire IC chip.Therefore, the voltage drop will be large in each connection path.In addition, although the main path passes through the backboard and printed wiring board, Since the printed wiring board is constructed with a very small copper foil (chromium) pattern, the permissible current is kept low, and it is not suitable for supplying a large current.

[Means for solving problems]

In order to solve such problems, according to the present invention,
In an IC case that has a substantially rectangular or square shape with a desired thickness, has an IC chip mounted on an internal substrate, and has a plurality of lead terminals connected to the chip on both sides or all sides, the IC A contact that contacts only the lead terminal for power supply and a contact that contacts only the lead terminal for grounding are arranged on the inner layer of the case. A power supply IC case is provided, characterized in that power can be supplied to the contacts.

[For production]

In the present invention, power is supplied to the IC chip by using the IC case itself in which the chip is mounted as a power supply component.
It becomes possible to supply power directly from the outside.

〔Example〕

Embodiments of the power supply IC case according to the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a detailed internal sectional view of an IC case according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view of a contact portion between a lead terminal and an inner layer contact, and FIG. 3 is an illustration of an IC case according to an embodiment of the present invention. FIG. 4 is a perspective view showing the completed body, and FIG.

As shown in FIG. 3, the IC case 10 has a substantially rectangular or square shape with a desired thickness. An integrated circuit or a large integrated circuit chip (hereinafter referred to as an IC chip) 6 is mounted on an internal substrate 1 made of a suitable substrate material, for example ceramic. A plurality of lead terminals 5 are arranged on both sides or all sides (only both sides in the embodiment) of the IC case 10. These lead terminals 5 are bonded and connected to the central IC chip 6 by fine wires 7, and have the same structure as the conventional IC case.

In the present invention, a grounding (E) contact, that is, a grounding copper bar 3, and a power supply (V) contact, that is, a voltage supplying copper bar 4 are provided inside the outer wall top cover 2 of the IC case 10. Arrange. The outer wall upper cover 2 is made of an insulator such as resin mold or ceramic.The 0W4 bar 3.4 has a terminal portion 3 for external connection configured as a tap hole or an insertion socket as a contact.
1.41, and holes 21.22 for external connection are formed in the outer wall upper lid 2 corresponding to this. As a result, power is supplied directly from the IC case 10 instead of the conventional power supply lead terminal 92 (FIG. 6) via a pattern on the printed wiring board.

The end portion 42 of the voltage supply copper bar 4 is thickened downward, and is electrically connected only to the power supply lead terminal 5.

In order to ensure this contact continuity, as shown in FIG.
3 is formed. In this way, in order to maintain reliable contact, there are a plurality of fitting locations, and the structure is such that a complete contact force is maintained due to the pressure when the case is enclosed.

The grounding copper bar 3 also has a contact structure corresponding to the voltage supplying copper bar 4, and the thick portion 42 of the voltage supplying copper bar 4 and the end 32 on the diagonal opposite side are thickened downward. , contact continuity occurs only to a grounding lead terminal (not shown).

As is clear from Fig. 1, the lead terminal 5 that contacts the copper bar 3.4 is limited to a power supply or grounding lead terminal, and has a different shape from the general signal lead terminal 5'. , improving reliability. That is, the lead terminal 5 has a plurality of recesses 51 for contact as described above, and also has an inner end 53 for bonding connection bent downward.

〔Effect of the invention〕

According to the present invention, since the case itself can supply power as a power supply component, it is possible to supply a large current compared to the conventional supply of power through the pattern of a printed wiring board, and it is also possible to supply power directly from the outside. Since the power source can be drawn in, it is possible to supply power with a low voltage drop. Furthermore, almost the entire periphery of the chip can be covered with a copper bar 3.4 for voltage supply (V) or grounding (E), so that the shielding effect for preventing external noise can be improved. It has great effects such as being able to hold it.

[Brief explanation of the drawing]

FIG. 1 is a detailed internal cross-sectional view of a tC case according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of the contact portion between a lead terminal and an inner layer contact, and FIG. FIG. 4 is a perspective view showing the completed body, and FIG. In addition, FIG. 5 shows the conventional IC
FIG. 6 is a perspective view showing a completed case. FIG. 6 is a perspective view of a conventional IC case with the top cover removed. 1... Board 10... RC case 2... Case top cover outer wall 21.22... External connection hole 3.4... Voltage supply (or ground) copper bar 31.41.
...External connection contact 32, 42...Thick part for contact 43...Protrusion for contact 5...Lead terminal for connection 5゛...Lead terminal for general signal 51...For copper bar contact Recess 6...Chip 7...Fine wire

Claims (1)

[Claims] 1. Constructed into a substantially rectangular or square shape with a desired thickness,
An integrated circuit case (1) has an integrated circuit chip (6) mounted on an internal substrate (1), and has a plurality of lead terminals (5) connected to the integrated circuit chip (6) on both sides or all sides.
0), a contactor (3, 31 or 4, 41) that contacts only the lead terminal for power supply and a contactor (4, 41) that contacts only the lead terminal for grounding are provided on the inner layer of the integrated circuit case (10). 41 or 3, 31), and power can be supplied to the contactor from the outside through connection holes (21, 22) provided in an outer wall covered with an insulator. Supply integrated circuit case.