JPS63182577A - Ic tester - Google Patents
Ic testerInfo
- Publication number
- JPS63182577A JPS63182577A JP62014349A JP1434987A JPS63182577A JP S63182577 A JPS63182577 A JP S63182577A JP 62014349 A JP62014349 A JP 62014349A JP 1434987 A JP1434987 A JP 1434987A JP S63182577 A JPS63182577 A JP S63182577A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- insertion hole
- contact
- contactor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims abstract description 27
- 230000037431 insertion Effects 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims description 17
- 238000005259 measurement Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置の電気的特性を測定するＩＣテス
タに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC tester that measures the electrical characteristics of a semiconductor device.
従来、この種のＩＣテスタは第４図に示すように構成さ
れている。これを同図、第５図および第６図に基づいて
説明すると、同図において、符号１で示すものはり−ド
挿通孔１ａを有し上方に開口するＩＣテスタ用の筐体、
２はこの筺体１の内部に固定され測定時に半導体装置３
を支持するスタンド、４はこのスタンド２の両側に押さ
え板５によって前記筺体１の底面１ｂを押圧するように
保持され内外２つのり一部４ａ、４ｂを有する接触子で
ある。この接触子４の両リード４ａ、４ｂは、基部４Ｃ
の上下側に一体に設けられており、内部リード４ａは測
定時に前記半導体装置３のリードピン３ａに接触し、ま
た外部リード４ｂは一部が筐体１の外部に露呈するよう
に構成されている。Conventionally, this type of IC tester has been constructed as shown in FIG. This will be explained based on FIG. 5, FIG. 6, and FIG.
2 is fixed inside this housing 1, and the semiconductor device 3 is fixed at the time of measurement.
A stand 4 for supporting the stand 2 is a contact that is held on both sides of the stand 2 by pressing plates 5 so as to press against the bottom surface 1b of the housing 1, and has two inner and outer glue portions 4a and 4b. Both leads 4a and 4b of this contactor 4 are connected to the base 4C.
The internal leads 4a are configured to contact the lead pins 3a of the semiconductor device 3 during measurement, and the external leads 4b are partially exposed to the outside of the housing 1. .
このように構成されたＩＣテスタによって半導体装置３
の電気的特性を測定するには、筺体１内のスタンド２上
に半導体装置３を載置することにより行う。The semiconductor device 3 is tested by the IC tester configured in this manner.
The electrical characteristics of the semiconductor device 3 are measured by placing the semiconductor device 3 on the stand 2 inside the housing 1.
この場合、位置決め装置（図示せず）によって半導体装
置３をスタンド２上に載置すると、リードピン３ａと内
部リード４ａとが接触する。このとき、リードピン３ａ
の押圧によって接触子４が外側に弾性変形する。In this case, when the semiconductor device 3 is placed on the stand 2 by a positioning device (not shown), the lead pins 3a and the internal leads 4a come into contact. At this time, lead pin 3a
The contact 4 is elastically deformed outward by the pressure.
ところで、この種のＩＣテスタにおいては、接触子４の
外部リード４ｂが筺体１のリード挿通孔１ａを遊嵌する
構造であるため、リードピン３ａが内部リード４ａに接
触した場合に、リード挿通孔１ａのクリアランスＣによ
って接触子４にがたつきが生じていた。この結果、内部
リード４ａとリードピン３ａ間の接触状態に悪影響を及
ぼし、ＩＣ測定上の信頼性が低下するという問題があっ
た。また、がたつきによって接触子４が損傷し易いとい
う問題もあった。Incidentally, in this type of IC tester, the external lead 4b of the contactor 4 is loosely fitted into the lead insertion hole 1a of the housing 1, so when the lead pin 3a comes into contact with the internal lead 4a, the lead insertion hole 1a The contact 4 was rattling due to the clearance C. As a result, there was a problem in that the contact state between the internal lead 4a and the lead pin 3a was adversely affected, and the reliability in IC measurement was reduced. Further, there was also the problem that the contact 4 was easily damaged due to rattling.
そこで、筺体１のリード挿通孔１ａを精密加工すること
により孔径の寸法精度を高くすることが考えられるが、
この場合にはコストが嵩むという不都合があった。Therefore, it may be possible to increase the dimensional accuracy of the hole diameter by precision machining the lead insertion hole 1a of the housing 1.
In this case, there is a disadvantage that the cost increases.
本発明はこのような事情に鑑みなされたもので、接触子
の長寿命化およびコストの低廉化を図ることができると
共に、ＩＣ測定上の信顧性を向上させることができるＩ
Ｃテスタを提供するものである。The present invention has been made in view of the above circumstances, and is capable of prolonging the life of a contact and reducing costs, as well as improving reliability in IC measurement.
C tester.
本発明に係るＩＣテスタは、半導体装置のり−ドビンに
接触する接触子が挿通する筐体に、接触子の挿通孔と同
一の方向に開口するリード挿入孔を設け、このリード挿
入孔内に弾性変形可能に圧入される保持片を接触子に設
けたものである。In the IC tester according to the present invention, a lead insertion hole that opens in the same direction as the contact insertion hole is provided in the casing through which the contact that contacts the semiconductor device glue dowel is inserted, and an elastic The contact is provided with a deformably press-fitted holding piece.
本発明においては、半導体装置のリードピンが内部リー
ドに接触した場合に接触子のがたつきを阻止することが
できる。In the present invention, it is possible to prevent the contactor from shaking when the lead pin of the semiconductor device comes into contact with the internal lead.
第１図は本発明に係るＩＣテスタを示す局部断面図、第
２図は同じくＩＣテスタの要部を示す断面図、第３図は
その接触子を示す正面図で、同図において第４図〜第６
図と同一の部材については同一の符号を付し、詳細な説
明は省略する。同面において、符号１１で示すものは前
記リード挿通孔１ａと同一の方向に開口するリード挿入
孔で、前記筺体１に設けられており、その孔径は前記リ
ード挿通孔１ａの孔径より幾分大きい寸法に設定されて
いる。１２はこのリード挿入孔１１の内部−ご −
に弾性変形可能に圧入される保持片で、前記接触子４の
基部４Ｃに一体に設けられており、全体が板厚方向にく
字状に折り曲げることにより形成されている。この保持
片１２は、その両側面が前記リード挿入孔１１内のエツ
ジ部分を含む３箇所を押圧して筺体１に対し接触子４を
弾性保持するように構成されている。FIG. 1 is a local sectional view showing an IC tester according to the present invention, FIG. 2 is a sectional view showing the main parts of the IC tester, and FIG. 3 is a front view showing a contactor thereof. ~6th
The same members as those in the figures are given the same reference numerals, and detailed explanations will be omitted. On the same plane, a reference numeral 11 denotes a lead insertion hole that opens in the same direction as the lead insertion hole 1a, and is provided in the housing 1, and its diameter is somewhat larger than the diameter of the lead insertion hole 1a. The dimensions are set. Reference numeral 12 denotes a holding piece that is press-fitted into the inside of this lead insertion hole 11 so that it can be elastically deformed, and is provided integrally with the base 4C of the contactor 4, and the whole can be bent into a dogleg shape in the thickness direction. It is formed by This holding piece 12 is configured such that its both sides press against three locations including the edge portion inside the lead insertion hole 11 to elastically hold the contactor 4 against the housing 1.
このように構成されたＩＣテスタにおいては、筐体１に
対し接触子４を弾性保持することができるから、リード
ピン３ａが内部リード４ａに接触した場合に接触子４の
がたつきを阻止し、接触子４の内部リード４ａと半導体
装置３のリードピン３ａ間に良好な接触状態を得ること
ができる。In the IC tester configured in this manner, since the contact 4 can be elastically held against the housing 1, shaking of the contact 4 can be prevented when the lead pin 3a contacts the internal lead 4a. A good contact state can be obtained between the internal lead 4a of the contactor 4 and the lead pin 3a of the semiconductor device 3.
因に、本発明におけるＩＣテスタによって半導体装置３
の電気的特性を測定するには、従来と同様にして行うこ
とができる。Incidentally, the semiconductor device 3 is
The electrical characteristics can be measured in a conventional manner.
すなわち、筺体１内のスタンド２上に位置決め装置（図
示せず）によって半導体装置３を＠置する。That is, the semiconductor device 3 is placed on the stand 2 inside the housing 1 using a positioning device (not shown).
なお、本実施例においては、保持片１２の形状はく字状
に折り曲げ形成する例を示したが、本発明はこれに限定
されるものではなく、リード挿入孔１１内に保持片１２
が弾性変形可能に圧入されるものであるなら、その形状
は適宜変形することが自由である。In this embodiment, the shape of the holding piece 12 is bent into a dogleg shape. However, the present invention is not limited to this, and the holding piece 12 is formed in the lead insertion hole 11.
If it is press-fitted so that it can be elastically deformed, its shape can be changed as appropriate.
以上説明したように本発明によれば、半導体装置のリー
ドピンに接触する接触子が挿通する筐体に、接触子の挿
通孔と同一の方向に開口するリード挿入孔を設け、この
リード挿入孔内に弾性変形可能に圧入される保持片を接
触子に設けたので、半導体装置のリードピンが接触子の
内部リードに接触した場合接触子のがたつきを阻止する
ことができる。したがって、接触子の内部リードと半導
体装置のリードピン間に良好な接触状態を得ることがで
きるばかりか、接触子の損傷を防止することができるか
ら、ＩＣ測定上の信頬性を向上させることができると共
に、接触子の長寿命化を図ることができる。また、従来
のようにリード挿通孔の孔径の寸法精度を高くするもの
ではないから、コストの低廉化を図ることができる。As explained above, according to the present invention, a lead insertion hole that opens in the same direction as the contact insertion hole is provided in the casing through which the contact that contacts the lead pin of the semiconductor device is inserted, and the lead insertion hole opens in the same direction as the contact insertion hole. Since the contact is provided with a holding piece that is press-fitted to be elastically deformable, it is possible to prevent the contact from wobbling when the lead pins of the semiconductor device come into contact with the internal leads of the contact. Therefore, not only can a good contact condition be obtained between the internal leads of the contact and the lead pins of the semiconductor device, but also damage to the contact can be prevented, which improves the reliability of IC measurements. At the same time, it is possible to extend the life of the contact. Further, since the dimensional accuracy of the hole diameter of the lead insertion hole is not increased as in the conventional case, the cost can be reduced.
第１図は本発明に係るＩＣテスタを示す局部断面図、第
２図は同じ＜ＩＣテスタの要部を示す断面図、第３図は
その接触子を示す正面図、第４図は従来のＩＣテスタを
示す局部断面図、第５図はその要部を示す断面図、第６
図は接触子を示す正面図である。
１・・・・筐体、１ａ・・・・リード挿通孔、１ｂ・・
・・底面、２・・・・スタンド、３・・・・半導体装置
、３ａ・・・・リードピン、４・・・・接触子、４ａ・
・・・内部リード、４ｂ・・・・外部リード、１１・・
・・リード挿入孔、１２・・・・保持片。
代 理 人 大岩増雄
第１図
１：ｌ イ本
１ｏ： リ−）’Ｊｌｉ矛Ｌ ｔ、、４２
１１ｂ ： Ａ（鉛
４０ ： ν９卸 リード挿通孔２１
第３図Fig. 1 is a local sectional view showing an IC tester according to the present invention, Fig. 2 is a sectional view showing the main parts of the same IC tester, Fig. 3 is a front view showing its contacts, and Fig. 4 is a conventional A local cross-sectional view showing the IC tester, Fig. 5 is a cross-sectional view showing its main parts, Fig. 6
The figure is a front view showing the contactor. 1... Housing, 1a... Lead insertion hole, 1b...
...bottom, 2...stand, 3...semiconductor device, 3a...lead pin, 4...contact, 4a...
...Internal lead, 4b...External lead, 11...
... Lead insertion hole, 12... Holding piece. Agent Masuo Oiwa Figure 1 1: l I book 1 o: Lee)' Jli t,, 42
11b: A (lead
40: ν9 wholesale lead insertion hole 21
Figure 3
Claims (1)
筐体を備えたＩＣテスタにおいて、前記筐体に前記接触
子の挿通孔と同一の方向に開口するリード挿入孔を設け
、このリード挿入孔内に弾性変形可能に圧入される保持
片を前記接触子に設けたことを特徴とするＩＣテスタ。In an IC tester including a casing into which a contact that contacts a lead pin of a semiconductor device is inserted, the casing is provided with a lead insertion hole that opens in the same direction as the insertion hole of the contact, and a lead insertion hole is provided in the lead insertion hole. An IC tester characterized in that the contact is provided with a holding piece that is press-fitted so as to be elastically deformable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62014349A JPS63182577A (en) | 1987-01-23 | 1987-01-23 | Ic tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62014349A JPS63182577A (en) | 1987-01-23 | 1987-01-23 | Ic tester |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182577A true JPS63182577A (en) | 1988-07-27 |
Family
ID=11858589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62014349A Pending JPS63182577A (en) | 1987-01-23 | 1987-01-23 | Ic tester |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182577A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991015881A1 (en) * | 1990-04-06 | 1991-10-17 | Advanced Interconnections Corporation | Integrated circuit adapter having gullwing-shaped leads |
| US5088930A (en) * | 1990-11-20 | 1992-02-18 | Advanced Interconnections Corporation | Integrated circuit socket with reed-shaped leads |
| US5151039A (en) * | 1990-04-06 | 1992-09-29 | Advanced Interconnections Corporation | Integrated circuit adapter having gullwing-shaped leads |
-
1987
- 1987-01-23 JP JP62014349A patent/JPS63182577A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991015881A1 (en) * | 1990-04-06 | 1991-10-17 | Advanced Interconnections Corporation | Integrated circuit adapter having gullwing-shaped leads |
| US5151039A (en) * | 1990-04-06 | 1992-09-29 | Advanced Interconnections Corporation | Integrated circuit adapter having gullwing-shaped leads |
| US5088930A (en) * | 1990-11-20 | 1992-02-18 | Advanced Interconnections Corporation | Integrated circuit socket with reed-shaped leads |
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