WO1991015881A1 - Integrated circuit adapter having gullwing-shaped leads - Google Patents

Abstract

An adapter to connect device leads (12) to contacts arranged in a rectangle on a circuit surface (30). The adapter has a body and leads (26) that extend outwardly, downwardly and then outwardly again in a pair of opposing curves to form feet which match the pattern on the circuit surface (30). The body has sites (16) for connecting with the device (10) and supports conductive elements connecting the leads to the sites. The adapter may connect gullwing-shaped device leads disposed in a rectangle (e.g., QFP) to contacts in a similar pattern. Strain relief elements (32) are shown. The body may include a stack of connected body portions. The device leads may be anchored in holes in the substrate, and may be bent portions of a lead frame sealed in a molded insulating body. Vertically extending resilient single-reed-shaped contacts (224) may connect to a surface of a downwardly extending section on a device package lead (214).

Description

INTEGRATED CIRCUIT ADAPTER HAVING GULLWING-SHAPED LEADS Background of the Invention This invention relates to adapters for interfacing integrated circuits with sockets and printed circuit boards. Electronic circuits are often built using printed circuit technology. Printed circuit cards generally include plated holes or pads for receiving the leads of an electronic device such as an integrated circuit. Surface mounted devices are mounted on pads on the circuit board and soldered in place. Quad flat pack (QFP) devices include gullwing-shaped leads which project out from four sides of a rectangular package and are soldered to four corresponding rows of pads on the circuit board.

It is known to solder a socket to a printed circuit board to receive a device, thus providing a removable mounting site and electrical connection to the circuit board. Examples of such sockets are presented in Advanced Interconnections Catalog No. 9 , (available from 5 Energy Way, West Warwick, RI 02893) . One known socket for removably installing a QFP package includes a top section that holds the package and a bottom section with tuning-fork shaped contacts having a connecting surface for connection to the inner surface of the package leads.

Summary of the Invention In general, the invention features an adapter which may connect device leads to contacts, such as pads, arranged in a rectangle on a circuit surface. The adapter has a body and leads that extend outwardly, downwardly and then outwardly again in a pair of opposing curves to form feet which match the pattern on the circuit surface. The body has sites for making connections with the device and supports conductive elements which connect the leads to the sites.

In general, the invention also features an adapter which may connect gullwing-shaped device leads disposed in a rectangle to contacts on a circuit surface in a similar pattern. The adapter has a body with contacts matching the device lead pattern for making connections to the device leads, and leads for making electrical connections to the circuit surface, which extend outwardly, downwardly, and then outwardly again in a pair of opposing curves to form feet that match the circuit surface pattern.

In preferred embodiments, the body is a substrate supporting the conductive elements, such as a printed circuit board; leads are connected to it only by soldering to the outer periphery of its upper surface; the conductive elements and adapter leads are portions of a lead frame and the body is molded around them; a connector connected to the attachment sites makes connections to the device leads; this connector is a separate body; this connector includes socket terminals; this connector mates with another connector which has conductive elements for making connections between it and attachment sites on the second body; the second connector includes connector elements supported in a second body; this second body is separate; attachment sites on the second body are contact pads for making solder connections to the leads of the device; a strain relief element on the adapter allows mechanical connection to the circuit surface; the second body is a printed circuit board; portions of a lead frame form the conductive elements which are molded in the second body; the body includes a stack of connected body portions; an upper portion supports the contacts, leads extend from a lower portion, and the adapter includes separable connectors between them; the adapter is made by soldering leads to the periphery of the upper surface of the circuit board, pressing the leads to the board, and bending them into a gullwing shape; the device is a QFP device.

In general, the invention also features a method of manufacturing an adapter for removably connecting leads of a device to contacts on a circuit surface arranged in a pattern having four rows, one on each side of a rectangular pattern. The method includes the steps of molding a first insulating body, sealing a series of leads in a lead frame to the body, and bending the sealed leads into a gullwing shape corresponding to the pattern.

In preferred embodiments, the step of sealing the leads is performed by heat sealing the lead frames in grooves molded_*in the body; the step of sealing the leads is performed by means of an adhesive; terminals are embedded in the body, and are electrically connected to the leads; the step of electrically connecting the leads to the terminals is performed by soldering; the step of electrically connecting the leads to the terminals is performed by press- fitting; a second shot molding portion may be molded around the body and sealed leads.

In general, the invention also features an adapter that is to be connected to contacts on a mother circuit surface. The adapter has a circuit bearing element with connection sites that are connected to metalized holes opening onto its top side. Leads are anchored in the holes and bent down around the edge of the top side of the circuit bearing element to below it, and may be connected to the contacts on the mother circuit surface. In general, the invention also features a method of providing gullwing-shaped leads to a circuit bearing element, in which lead frame elements are provided in a lead frame. The method includes bending the lead frame elements into a hook-shape, soldering them in holes in the circuit bearing element, bending the soldered leads down around the edge of.the top surface of the circuit bearing element and below it, and removing a side frame portion from the bent lead frame.

In preferred embodiments, the leads are lead frame elements; the circuit bearing element is a printed circuit board; the leads are soldered to the holes in the circuit bearing element; the leads are bent outwardly below the circuit.bearing element to form feet for attachment to the circuit surface; the leads are bent in a gullwing shape with two opposing curves; receptacles are connected to the connection sites and a chimney provides a mounting for the receptacles; a through-hole pin reinforces the mechanical connection between the adapter and the circuit surface; the contacts are arranged in a pattern having four rows of contacts; one row on each side of a rectangular pattern; the corners of the soldered lead frame are removed before the step of bending the soldered leads; the step of removing a side portion from the bent lead frame is performed after the step of bending the soldered leads; the bending operations are performed with bending tools; the steps of bending the soldered leads and cutting the leads are performed in a single operation with a single tool. In general, the invention also features a socket that has several upwardly extending resilient single-reed- shaped contacts that connect to downwardly extending portions of the leads of an integrated circuit package. A bottom section supports these contacts and the leads of the socket, which are connected to the contacts.

In preferred embodiments, the contacts are integral to lead frame elements, make a wiping contact over at least half of the downward section or at least 0.02 inches, extend from the bottom surface of the package, press inwardly or outwardly against the package leads, and are separated and maintained in registration .by ribs; a top section with ribs separates and maintains the package leads in registration; a resilient reed retains the package in the top section; a pin-and-socket connector maintains the top section in place; the package leads are retained by a surface between ribs in the top section against the force applied by the contacts; the socket leads are pins supported by the bottom section and are each connected to a lead frame element; the bottom section is made of a molded thermoplastic; the lead frame elements are at least partially embedded in said bottom section; the socket leads and contacts are integral to the same lead frame elements; the leads may be adapted for through-hole insertion or surface mount and may have the same footprint as that of the package; the socket includes a cover. Embodiments may be made by providing lead frame elements from more than one lead frame by successive steps of bending, attaching and trimming of the lead frames. An adapter according to the invention allows devices to be interfaced in a variety of ways to a printed circuit board having a gullwing pad configuration. For example, a designer may create a single circuit board which can accept a socket in a prototype or upgradable configuration or a soldered-in device for larger-scale, less expensive production. The designer may also use sockets on boards that were designed with a simple gullwing pad configuration without re-designing the circuit board pad configuration — usually an expensive and time-consuming undertaking. The designer may even interface different device footprints to a gullwing pad configuration if they are more readily available or include other desireable features. A socket according to the invention also provides a reliable long stroke wiping contact to package leads such as QFP leads. The metal contacts are durable and may be made inexpensively from one or more lead frames. The molded sections allow for precise tolerances in the registration of the package leads and the contacts, and prevent them from touching each other. The fact that the top body portion is retained by a pin-and-socket mechanism avoids complex and expensive mold cavity shapes. A socket of the invention may be inexpensively provided that has the same footprint as the package it is intended to accept, and may be provided for very small lead spacings. As the lead frames in a socket of the invention may include curved horizontal portions, numerous footprints may be accommodated. Further, since the reed contacts are long for a package of a given height, they can accommodate large variations in the tolerances of the package leads. These benefits allow for an inexpensive and reliable 0.3 mm pitch QFP socket. Test clips according to the invention allow connection to a device soldered in place and may be easily inspected during assembly.

Description of the Preferred Embodiment We first briefly describe the drawings. FIG. 1 presents a disassembled side view of an adapter, including the device to be mounted thereon as well as the circuit surface onto which the adapter is to be loaded.

FIG. 2 shows a side view of an adapter mounted on a circuit surface with its associated device. FIG. 3 presents a disassembled side view of another adapter, including the device to be mounted thereon as well as the circuit surface onto which the adapter is to be loade . FIG. 4 presents an assembled side view of the adapter, device and circuit surface of FIG. 3.

FIGS. 5-10 show manufacturing steps for the gullwing-shaped leads. FIG. 11 is a partially sectioned side elevation of an adapter with sealed-in leads that is mounted on a circuit surface with its associated device.

FIG. 12 is a plan view of the bottom surface of the chimney connector body. FIG. 13 is a plan view of a lead frame for use with the chimney connector body of FIG. 13.

FIG. 14 includes two sub-figures of a partial cross- section of the chimney connector body as indicated by the arrows in FIG. 12, showing the leads before and after heat is applied to secure them to the chimney connector body.

FIG. 15 shows a partially sectioned elevation of an adapter according to the invention.

FIG. 16 is a top plan view of a lead frame prior to assembly in the adapter of FIG. 15. FIG. 17 is a cross-section of the lead frame of FIG.

16 along 17-17, before the bending operations.

FIG. 18 presents the view of FIG. 17 after the first bending operation.

FIG. 19 presents the view of FIG. 17 after the lead frame has been soldered to its printed circuit board element and its corners have been removed.

FIG. 20 presents the view of FIG. 17 after the second bending operation, and shows the removal of the frame portions of the lead frame. FIG. 21 shows a schematic cross section of a bending apparatus for use in the second bending and cutting operations.

FIG. 22 is a top plan view of a QFP package. FIG. 23 is a side elevation of the QFP package of FIG. 22.

FIG. 24 is a partial top plan view of a single lead of the package of FIG. 22 taken from the circled area of FIG. 22.

FIG. 25 is an exploded perspective view of a socket for QFP packages.

FIG. 26 is a perspective view of the socket of FIG. 25 with its top section fully engaged in its bottom section. FIG. 27 is an exploded plan view of the socket of

FIG. 25 and its associated integrated circuit package.

FIG. 28 is an upside-down perspective view of the top section of the socket of FIG. 25.

FIG. 29a is a partial cross-sectional view, along 29a-29a of FIG. 31, showing the top section of the socket of FIG. 4 and its associated package.

FIG. 29b presents an orthographic projection of the bottom of the top section of the socket of FIG. 29a with a package installed, further showing the relationship between the top section ribs and the leads of the package.

FIG. 30a is a partial cross sectional view, along 30a-30a of FIG. 31, showing the top section of the socket of FIG. 25, its package retaining reed and a portion of its associated package. FIG. 30b is a top view of the portion of the socket shown in FIG. 30a.

FIG. 30c is a side view of the package retaining reed shown in FIG. 30a.

FIG. 31 is a top plan view of the socket of FIG. 25 and its associated package.

FIG. 32 is a cross sectional view along 32-32 of FIG. 31. FIG. 33 is a cross sectional view along 33-33 of FIG. 31.

FIG. 34 is an enlargement of the portion of FIG. 33 within the circle marked "34". FIG. 35 is a partial cross-sectional view of a socket having integral through-hole socket leads and contacts.

FIG. 36 is a partial cross-sectional view of a socket having integral surface-mount socket leads and contacts.

FIG. 37 is a plan view of a lead frame for making a socket.

FIG. 38 is a perspective view of two lead frames juxtaposed to illustrate the spatial relationship of their respective lead elements as they are to be installed.

FIG. 39 is a cross sectional view of a socket for LCC type packages.

FIG. 40 is a top view of the package retaining features of the socket of FIG. 25. FIG. 41 is a two-part cross sectional view of a test clip for QFP devices designed to accept a cable having female connectors.

FIG. 42 is a partial cross sectional view of a test clip for QFP devices designed to accept a cable having male connectors.

FIG. 43 is a perspective view of the test clip of FIG. 41.

Referring to FIG. 1, a QFP device 10 may be soldered by its leads 12 to a QFP adapter 14. The QFP adapter 14 comprises a QFP adapter printed circuit board 18, pads 16 which are placed to correspond to the device leads, and pins 20. The QFP adapter printed circuit board 18 may be manufactured by printed circuit board fabrication techniques. The pins 20 are press fit into plated-through holes therein and thus connected to the pads 16 by conductive elements (e.g. , traces) in the insulative body of the QFP adapter circuit board. The pins 20 may also be soldered to the QFP adapter printed circuit board 18.

The pins 20 of the QFP adapter 14 are spaced to engage terminals 24 in chimney connector 22. Chimney connector 22 is fabricated of insulative material such as glass epoxy or molding compounds, and the terminals 24 are low insertion force socket terminals. The terminals 24 include solder tails 25 which are soldered to electrical attachment sites on adapter substrate 28. Adapter substrate 28 may also be manufactured by printed circuit board fabrication techniques. Also soldered to the adapter substrate 28 are gullwing-shaped adapter leads 26. These gullwing-shaped adapter leads are electrically connected to the electrical attachment sites by conductive elements supported by the insulative body of the adapter substrate 28. As shown in FIG. 5, the gullwing-shaped adapter leads 26 are manufactured from a single lead frame 50 which is soldered to the top surface of adapter substrate 28. The corners 52 of lead frame 50 are then removed (FIG. 6) . A jig (not shown) is then pressed onto the top of leads 26 to hold them firmly to adapter substrate 28, and the leads are bent in two different directions to form the opposing curves of a gullwing shape (FIGS. 7 and 8). The jig prevents the solder joints from being subjected to excessive stress during the bending operation. The remainder of the edges 54 of the lead frame 50 are then cut (FIG. 9) to form the final gullwing-shaped adapter leads 26 (FIG. 10) .

Leads 26 thus include feet adapted to be soldered to standard QFP spaced pads 31 on circuit board surface 30 by - li ¬ the end user with surface mount soldering techniques, as shown in FIG. 2. Strain relief elements 32 may optionally be mounted on the adapter substrate and soldered to the circuit board 31. The strain relief elements may be soldered in holes in the circuit surface as shown in FIG. 2, or shorter strain relief elements may be soldered to pads on the circuit surface.

Once the leads 26 on the adapter substrate are soldered to the circuit board surface 30, the user may insert the QFP adapter 14 with a device 10 soldered to it. To change devices (e.g., for the purpose of experimentation, upgrading or repair) , the QFP adapter board may be removed from chimney connector 22 and replaced with another adapter board carrying another device. Referring now to FIG. 3, an adapter is presented which is configured to receive a device 10 in a socket 38. Quad flat pack sockets as shown are available from sources such as AMP or 3M. In this embodiment, the socket 38 includes pins 40 which may be inserted in receptacles 36 in the socket adapter 34.

The socket adapter 34 is made up of a socket adapter circuit board 37 which includes pins 20 which are connected to the receptacles 36 by traces in the socket adapter circuit board. Pins 20 are adapted to engage the terminals 24 in the chimney connector 22.

Referring to FIG. 4, once the adapter leads 26 on the adapter substrate 28 are soldered to the circuit board surface 30, the user may insert the socket adapter 34 into the chimney connector 22. A device 10 may then be inserted into the socket 38. To change devices, the device 10 may be removed from socket 38 and replaced with another device.

It should be noted that the socket adapter 34 can be made to have the same pin configuration as the QFP adapter 14 thus making the parts interchangeable on the same chimney connector 22.

If this degree of flexibility is not required, the socket adapter 34 may be directly soldered to the adapter substrate 28 by means of pins 20. Of course, the receptacles 36 should be prevented from touching adapter leads 26 (e.g., by using standoffs). This results in a simpler adapter with a lower profile (not shown) .

It is also possible to eliminate receptacles 36 by simply soldering the socket 38 to the socket adapter 34. This will also contribute to a simpler and somewhat lower profile adapter (not shown) .

Furthermore, the socket 38 may be a QFP socket, or it may accommodate other device types, such as LCC, PLCC or PGA packages, for example.

Moreover, the parts of the adapter that are implemented with printed circuit boards may be built using embedded lead frames as discussed in my co-pending application, entitled "Molded-in Lead Frames", serial numbers 121,568 and 272,074, which are herein incorporated by reference. For example, in the adapter substrate, the lead frame 50 which is manipulated to form the gullwing- shaped adapter leads may also serve to form conductive elements within the adapter substrate. Such a construction would be less expensive to manufacture than those in which the conductive elements are traces formed using printed circuit board fabrication methods.

The adapter may also be implemented using the molding process discussed in my application entitled "Molded Integrated Circuit Package", Serial No. 07/564,406, which is herein incorporated by reference.

Referring to FIG. 11, the structure of an adapter made using this method includes a plastic molded chimney connector 60 that accepts a QFP adapter 14 and its associated device. Leads are mounted on the lower surface of the plastic molded chimney connector and connected to the terminals 68 within the chimney. In manufacturing this adapter, a plastic chimney connector body 61 is first molded in a first-shot molding process. As shown in FIG 12, on the bottom of the body are grooves 62 that each extend from the edge of the body to the bottom of a hole for holding one of the terminals. At the hole, the channel forms an eye-shaped area 64 around the bottom aperture of the hole.

Chimney body 61 is made by injection-molding a high molding pressure plastic, glass-filled polyphenylene sulfide (PPS) . This plastic resists the high temperatures present in wave soldering, vapor phase soldering and infra-red soldering. It also has a low affinity for moisture and desirable dielectric properties. This plastic must be molded at high pressures and temperatures, but the molding operation may be relatively short in duration (e.g., around 15 seconds) . A typical molding pressure is between 500 and 800 p.s.i.g.

Referring to FIG. 13, an associated lead frame 74 is then placed on the bottom surface of the body so that each individual lead 76 rests in its corresponding channel 62. It will be observed that eye-shaped portions 75 of the leads will rest in their corresponding eye-shaped areas 64. Referring to FIG. 14a, it can be seen that the ridges 63 between the grooves 62 are thicker than the leads 76 themselves. FIG. 14b shows the first-shot portion of the body after the second operation. The second operation involves the application of heat to the areas between the grooves by pressing on the first-shot portion using a hot metal iron. This application of heat softens the plastic and causes it to surround the leads and thus secure them to the first- shot portion. Since the ridges between the grooves extend beyond the lead frame, there will be a small amount of excess material that will be pressed so as to fill the small voids between the leads and the walls of the grooves.

In performing this operation, the iron is held at a temperature between 425 and 450 degrees fahrenheit, and applied to the chimney connector body with a force of 30 p.s.i.g.

With the leads secured in place, the terminals 68 may be installed in the chimney and connected to the eyes 75 of the leads 76. The electrical connection may be made by soldering or press-fitting, for example. The lead frame may then be cut and bent to leave the gullwing-shaped leads.

This may require applying a force to hold the leads in place during the bending operation.

If desired, further material can be added to the chimney in a second-shot molding operation. This further material assists in holding the leads in place. It is also possible to glue the lead frames in place instead of heat sealing them.

Referring to FIG. 15, another embodiment of a QFP adapter 110 includes a circuit bearing element, such as a printed circuit board element 112, with plated, or otherwise metalized, holes 113 that accept bent gullwing-shaped leads 114. These leads are soldered to the circuit board element at one end and include feet at the other end which may be soldered to pads arranged in four rows on a mother circuit board 116 or mounted in a suitable socket (not shown) . Other interconnect elements, such as receptacles 118 embedded in chimney 119 are also connected to the circuit board element 112 and allow for connection to external circuitry.

Referring to FIGS. 16 and 17, a lead frame 120 for use in assembling an adapter according to the invention includes a frame portion 122 and lead elements 124. The lead frame may be made by stamping or etching or by any other suitable method.

In assembling an adapter, the lead elements 124 of the lead frame are first bent (FIG. 18) to a hook-shape in a bending apparatus. Once bent, the lead frame ends are inserted in corresponding holes in the printed circuit board 112, and the lead elements are anchored in place, for example, by infra-red soldering (FIG. 19) . With the lead frame soldered in place, its corners 123 (FIG. 16) are cut away. The leads are then bent to their final gullwing shape (FIG. 20) in a second bending operation and the remaining side frame portions 121 (FIG. 16) are cut away.

It is observed that it is important to be careful to prevent solder from flowing substantially away from the solder holes along the lead frame during soldering, as this solder may interfere with the second bending operation.

The second bending operation and the cutting operation may be performed in a single operation using a bending apparatus. Referring to FIG. 21, the soldered but unfinished adapter 110 is placed on a pedestal 130, and the bending tool 140 is lowered onto the part. Upon lowering the tool, a spring-loaded jaw 132 first engages the adapter and holds it in place on its pedestal. As the tool continues to descend, four bending implements 136 engage the leads and bend them around bending dies 142 on the pedestal. These dice are designed to guide the leads down around the edges of the top of the printed circuit element and impart them with the opposing curves and feet of a gullwing shape. They are also dimensioned to allow for a certain amount of overbending, so that the leads spring into their specified shape when the implements are retracted. Finally, as the tool reaches the end of its stroke, four blades 136 cut away the remaining side portions 121 (FIG. 16) of the frame portion of the lead frame.

The above manufacturing process has the advantage of performing several steps in a single operation with a single tool. It is, of course, possible to separate the cutting and bending operations into separate individual operations. The unfinished adapter is now ready for further operations, such as the addition of a chimney 119 and embedded receptacles as shown in FIG. 15. These receptacles may be electrically connected to attachment sites on the printed circuit element. These sites are connected to the leads by circuit elements, such as copper traces within the printed circuit element, thus providing connections between the receptacles and the leads. Through-hole-type pins may also be provided on the adapter, for the purpose of reinforcing the mechanical connection between the adapter and the mother circuit board, when soldered in place.

Referring now to FIGS. 22 and 23, a QFP package 210 includes a body 212 and leads 214. A socket for receiving such a package (FIGS. 25, 26) includes a top section 216 and a bottom (or lead supporting) section 218. These sections are made of injection molded thermoplastic such as PPS or LCP. Socket leads 220 extend downwardly and allow connection to a circuit board or a socket (not shown) .

Retaining pins 222 extend upwardly within the bottom section to engage receptacles 226 in the top section (see also FIGS. 28 and 32) and thereby retain the top section in the engaged position shown in FIG. 26. The receptacles 226 include resilient pin retaining elements 227 that bear against the pins at gentle curves 229 to positively retain the top section on the bottom section. This method of retaining the top section is advantageous in that it avoids the necessity of molded-in latch portions and the like, which generally require complex and expensive mold cavities. A series of contacts 224, which connect to the socket leads 220, extend upwardly into the cavity formed within the bottom section. These contacts make contact with the package leads when a package is installed in the socket. Referring to FIG. 27, a package is first inserted into the top section of the socket (step A) , and then the top section is inserted into the bottom section (step B) . The top section has ribs 228 (FIG. 28) that separate channels 230. These channels accept the leads of the package and maintain them in a definite, separated, position. FIGS. 29a-29b illustrate the relation between the leads of the package and the ribs.

Referring to FIG. 24, an individual lead 14 typically includes a dam bar portion 215. The tolerances of the maximum width M of this dam bar portion are generally quite large. For this reason, the top section ribs 228 (FIGS. 29a-29b) are made short enough that they do not interfere with the dam bar portions.

As shown in FIGS. 28 and 30a-c, a resilient package retaining reed 232 extends downward at one corner of the top section to retain the package in place within the top section by biasing it sideways. The retaining reed 232 is bent to apply a force on the lower surface 213 of the side of the package and may be extended 233 into a hole (not shown) in the bottom section. The retaining reed 232 includes teeth 235 that bite into the walls of a slot 239 in the top portion 216 and hold it in place. FIG. 30 shows the features that retain the package in place in the top section. The retaining reed 232 presses the package 210 along a chamfered corner of the package and causes one or more of the other corners of the package to bear against the insides of the corner portions 211 of the top section 216. The corner of the top section that includes a retaining reed is keyed 234 (FIG. 28) to prevent the package from being inserted in an incorrect orientation. As shown in FIG. 31, the socket lead pins 220 are arranged on a grid having an offset outer row of pins. This grid is offset in this manner to allow for a maximum number of circuit traces to be placed between the required holes in a circuit board designed to accept the socket.

Referring to FIGS. 23 and 24, the reed-shaped contacts 224 are each part of a lead frame element 236 which also extends along ^{^}the lower surface of the bottom section 218. Pins are installed in the lower section 218 to connect to the lead frame elements 236. Methods of connecting pins and lead frame elements are described in detail in my co- pending applications entitled MOLDED-IN LEAD FRAMES, Serial Nos. 07/121,568 and 07/272,074, filed November 17, 1987 and November 16, 1988 respectively, and herein incorporated by reference.

Ribs 238 separate the contacts 224 and maintain them in registration with the package leads. The resilient contacts 224 engage the package leads 214 in a wiping contact when the top portion is engaged in the bottom portion. This wiping action covers a significant portion of the inner surface of the package lead (i.e., at least half), or at least 0.02 inches in the case of a 0.3 millimeter lead pitch. This provides for a reliable contact. The resilience of the lead frame elements 236 is sufficient to provide a contact force of 15 grams per pin between the contacts and the package leads. This force is applied by the contact to the lead, which bears against the inside retaining surface 231 of the channel 230 (FIGS. 28 and 29) . Because the reeds begin at the bottom surface of the bottom section (see FIG. 34), the reeds have a long cantilever arm, for a given package height. This allows the arm to be flexible and to accommodate package leads with high tolerance variations.

Since the top and bottom sections of the socket are injection molded, the ribs on each of these sections may be positioned quite precisely and will have non-cumulative tolerances. This is particularly advantageous for smaller pitch packages.

The top section and the bottom section are molded to fit closely so that the ribs in the top section and the ribs in the bottom section are maintained in alignment. This keeps the reed contacts in alignment with the package leads. Referring to FIG. 34, this is done by keeping the distance between top wall portion x and bottom wail portion y small. Referring to FIGS. 37 and 38, the socket of the invention is manufactured using a pair of lead frames. Each lead frame includes a series of lead frame element portions 236 and a frame portion 242. The leads 236a of a first lead frame are first bent into their upwardly extending positions. The lead frame is then installed in corresponding grooves that are molded in the lower section, and the lead frame is heat sealed in place. This method of assembly is described in detail in my co-pending application entitled MOLDED INTEGRATED CIRCUIT PACKAGE, Serial No. 07/564,406, filed August 8, 1990, and herein incorporated by reference.

Once sealed in place, the frame portion 242 is cut away. A second lead frame is then bent and heat sealed in place at right angles to the first, and its frame portion is cut away. This dual-lead frame assembly method allows for the use of lead frame elements that are quite long. FIG. 38 illustrates the relationship between leads 236a from the first lead frame 242 and leads 236b from the second lead frame 244.

This process could, of course, be extended to more than two lead frames, if necessary. For example, one lead frame could be used for each side, for a total of four lead frames. If the geometry of the socket permits (i.e., the reed contacts are short enough) , a single lead frame could also be used.

The use of lead frames in the assembly method is advantageous in that multiple leads are installed at the same time. Also, the tolerances of the lead positions, due to the method of manufacture of the lead frame, are non- cumulative.

The horizontal portion 237 of the lead frame (FIG. 34) that is heat sealed in place need not be stamped to be straight and perpendicular with its associated reed contact 224. It may be shaped as needed, much like a trace on a printed circuit board, to accommodate a variety of footprints.

This may result in space-efficient use of real estate. For example, in the embodiment of FIG. 31, pins may be placed all around the outer edge of the bottom section, not just in direct alignment with the contacts. This use of lead frames also allows the particular optimized offset pattern of the socket of FIG. 31. FIG. 35 shows a cross section of a portion of an embodiment of the invention wherein a lead frame 250 acts as both a contact 252 and a lead 254. In this embodiment, the lead is embedded between two bottom sections 256, 258. This is performed by heat sealing the lead frame to one of the pre-molded sections, and assembling the other section around the resulting assembly by press fitting or ultrasonic plastic welding. This type of process is described in my earlier referenced co-pending application entitled MOLDED INTEGRATED CIRCUIT PACKAGE. Standoff 260 is also molded in this second operation.

FIG. 36 shows a cross section of a portion of an embodiment of the invention that is similar to the embodiment of FIG. 35 except that its leads are bent into a gullwing shape to form a QFP-type footprint. It will be observed that the embodiment of FIG. 36 has the same footprint as the package that it is intended to accept. Although not necessary, this is particularly advantageous as the same circuit board may be fitted with a socket, (e.g., for prototyping purposes) or a package (e.g., for large- scale production) .

In the embodiments of FIGS. 35 and 36, the reeds are not held between ribs, but protrude through holes which perform the alignment function.

FIG. 39 shows a socket for leadless chip carrier (LCC) type packages that may be manufactured in a manner similar to that employed for the above described embodiments. In this socket, the reed-shaped contacts 66 provide an inward contact force to the leads 264 of the package 260.

FIGS. 42 and 43 show a test cable assembly 270 that may be clipped onto a QFP package 210 that is soldered in place, for example on a printed circuit board 272. The assembly 270 includes a series of conductors 278 (e.g., in the form of ribbon cables) and a clip portion 271. The conductors have receptacle ends 280 that mate with pins 286 in the clip portion 271. The clip portion includes reed-shaped contacts 282 that are connected to the pins 286. Ribs 284 separate the contacts, which provide an inward force to make contact with the outer surface of the leads 214. The clip portion is made by attaching bent lead frame elements 282, from one or more lead frames, to the inner section 276 of the clip, preferably by heat sealing. Pins 286 are then press-fit into the inner (or lead frame supporting) section 276 and soldered to the lead frame element 282. An outer section 274, bearing the lead- separating ribs 284, is then placed around the inner section 276 and attached thereto (e.g., by ultrasonic plastic welding at a notch joint 288) . The two-section construction allows inspection of the solder joints before assembly of the sections.

Referring to FIG. 42, a clip that accepts male connectors may also be made. In this embodiment, the conductors 278 are connected to male connectors 290. Receptacles 300 in the upper (or lead frame supporting) section 292 accept the pins 298 of these connectors and are soldered to reed-shaped contacts 302 that make contact with the leads 214 of the package 210. Separate upper and ribbed 304 lower sections 292, 294, assembled at the notch joint 296 after soldering, provide for intermediate inspection of the solder joints.

A reed, as shown in FIGS. 30a-30c, is embedded in the test clip embodiments presented and serves to hold the test clip in place on the package.

It will be observed that electrical interfacing elements for integrated circuit packages, such as sockets and test clip assemblies, may be manufactured according to the invention for a wide variety of integrated circuit package types. Other embodiments are within the following claims. Indications of direction such as vertical and downward are used in the claims because ordinarily the socket (or other interfacing element) is installed by vertical movement relative to the IC package. In the event that the direction of installation were other than vertical, these expressions should be understood as meaning generally along the direction of installation.

Ceramic quad flat pack devices may be used with this invention as well as plastic quad flat pack devices (PQFP) . Other embodiments are within the scope of the following claims.

What is claimed is:

Claims

1. An adapter for removably electrically connecting the device leads of an electronic device to a circuit surface on which there are contacts arranged in a pattern having four rows of contacts, one row on each side of a rectangular pattern, said adapter comprising: a first insulative body; electrical attachment sites on said body for making electrical connections with said electronic device; a plurality of lead frame portions, each including an adapter lead extending outwardly from said body and bending downwardly below said body and then further outwardly in a pair of opposing curves, each said adapter lead having ends forming feet located in a pattern matching that of said contacts on said circuit surface; and a conductive element supported by said body and connecting said adapter lead to one of said electrical attachment sites; and a first electrical connector connected at said electrical attachment sites for making connections to said device leads and wherein said first electrical connector comprises a plurality of socket terminals.

2. An adapter for removably electrically connecting the device leads of an electronic device of the type having four rows of gullwing-shaped leads disposed on the sides of a rectangular pattern to a circuit surface on which there are contacts arranged in a pattern having four rows of contacts, one row on each side of a rectangular pattern, said adapter comprising: a first insulative body; electrical attachment sites on said body for making electrical connections with said electronic device; a plurality of lead frame portions, each including an adapter lead extending outwardly from said body and bending downwardly below said body and then further outwardly in a pair of opposing curves, each said adapter lead having ends forming feet located in a pattern matching that of said contacts on said circuit surface; and a conductive element supported by said body and connecting said adapter lead to one of said electrical attachment sites; a first electrical connector connected at said electrical attachment sites for making connections to said device leads; and a second insulative body with a second series of electrical attachment sites configured for making connections to said gullwing-shaped leads, a second connector, separate from said second body, configured to mate with said first connector, said connector comprising a plurality of electrical connector elements and conductive elements supported on said second body for making electrical connections between said second connector and said second series of electrical attachment sites.

3. An adapter for removably electrically connecting the device leads of an electronic device of the type having four rows of gullwing-shaped leads disposed on the sides of a rectangular pattern to a circuit surface on which there are contacts arranged in a pattern having four rows of contacts, one row on each side of a rectangular pattern, said adapter comprising: a first insulative body; electrical attachment sites on said body for making electrical connections with said electronic device; a plurality of lead frame portions, each including an adapter lead extending outwardly from said body and bending downwardly below said body and then further outwardly in a pair of opposing curves, each said adapter lead having ends forming feet located in a pattern matching that of said contacts on said circuit surface; and a conductive element supported by said body and connecting said adapter lead to one of said electrical attachment sites; a first electrical connector connected at said electrical attachment sites for making connections to said device leads; and a second insulative body with a second series of electrical attachment sites configured for making connections to said gullwing-shaped leads, a second connector configured to mate with said first connector, conductive elements supported on said second body for making electrical connections between said second connector and said second series of electrical attachment sites, and at least one strain relief element affixed to said adapter for mechanical connection to the circuit surface.

4. An adapter for removably electrically connecting the device leads of an electronic device of the type having four rows of gullwing-shaped leads disposed on the sides of a rectangular pattern to a circuit surface on which there are contacts arranged in a pattern having four rows of contacts, one row on each side of a rectangular pattern, said adapter comprising: a first insulative body; electrical attachment sites on said body for making electrical connections with said electronic device; a plurality of lead frame portions, each including an adapter lead extending outwardly from said body and bending downwardly below said body and then further outwardly in a pair of opposing curves, each said adapter lead having ends forming feet located in a pattern matching that of said contacts on said circuit surface; and a conductive element supported by said body and connecting said adapter lead to one of said electrical attachment sites; a first electrical connector connected at said electrical attachment sites for making connections to said device leads; -nd a second insulative body with a second series of electrical attachment sites configured for making connections to said gullwing-shaped leads, a second connector configured to mate with said first connector, said connector comprising a plurality of socket terminals and conductive elements supported on said second body for making electrical connections between said second connector and said second series of electrical attachment sites.

5. An adapter for removably electrically connecting the device leads of an electronic device of the type having four rows of gullwing-shaped leads disposed on the sides of a rectangular pattern to a circuit surface on which there are contacts arranged in a pattern having four rows of contacts, one row on each side of a rectangular pattern, said adapter comprising: a first insulative body; electrical attachment sites on said body for making electrical connections with said electronic device; a plurality of lead frame portions, each including an adapter lead extending outwardly from said body and bending downwardly below said body and then further outwardly in a pair of opposing curves, each said adapter lead having ends forming feet located in a pattern matching that of said contacts on said circuit surface; and a conductive element supported by said body and connecting said adapter lead to one of said electrical attachment sites; a first electrical connector connected at said electrical attachment sites for making connections to said device leads; and a second insulative body with a second series of electrical attachment sites configured for making connections to said gullwing-shaped leads, a second connector configured to mate with said first connector, and conductive elements supported on said second body for making electrical connections between said second connector and said second series of electrical attachment sites, wherein said conductive elements of said second body comprise portions of a lead frame, and said second body comprises portions molded around said lead frame.

6. An adapter for removably electrically connecting the leads of an electronic device to a circuit surface, wherein said leads are gullwing-shaped and disposed in four rows, one on each of four sides of a rectangular pattern, and wherein said circuit surface has contacts disposed in essentially the same rectangular pattern as that of the electronic device, said adapter comprising an insulative adapter body; contacts on said adapter body, said contacts being configured for making electrical connections to the leads of the device and being disposed in a pattern matching that of said device leads; and adapter leads extending from said adapter body for making electrical connections to the circuit surface, each said adapter lead extending outwardly from said adapter body and bending downwardly below said body and then further outwardly in a pair of opposing curves, said adapter leads having ends, and said ends of said adapter leads forming feet located in a pattern matching that of said contacts on said circuit surface.

7. The adapter of claim 6 wherein said adapter leads are gullwing-shaped.

8. The adapter of claim 6 wherein said adapter body comprises a plurality of body portions electrically connected in a vertical stack.

9. The adapter of claim 8 wherein said adapter body comprises an upper portion on which said contacts are supported and a lower portion from which said adapter leads extend, and wherein said adapter further comprises electrical connectors providing separable electrical connections between said upper and lower portions.

10. The adapter of claim 6 wherein said electronic device is a quad flat pack device.

11. The subject matter of claim 6 wherein said contacts are conductive pads on said circuit surface.

12. The adapter of claim 6, wherein said adapter body comprises a first insulative body portion; electrical attachment sites on said body portion for making electrical connections with said electronic device; and conductive elements supported by said body portion and connecting said adapter leads to said electrical attachment sites.

13. The adapter of claim 12 wherein said body portion is a substrate on which said conductive elements are supported.

14. The adapter of claim 13 wherein said conductive elements are printed circuit paths and said substrate is a printed circuit board.

15. The adapter of claim 12 wherein said conductive elements and said adapter leads are portions of a lead frame, and said body portion comprises portions molded around said lead frame.

16. The adapter of claim 12 wherein said conductive elements and said adapter leads are portions of a lead frame, and said lead frame is sealed in said body portion.

17. The adapter of claim 12, wherein said adapter body further comprises a first electrical connector connected at said electrical attachment sites for making connections to said device leads.

18. The adapter of claim 17 wherein said first electrical connector comprises a body portion separate from said first body portion.

19. The adapter of claim 17 wherein said first electrical connector comprises a plurality of socket terminals.

20. The adapter of claim 17 wherein the electronic device is of the type having four rows of gullwing-shaped leads disposed on the sides of a rectangular pattern, and wherein said adapter body further comprises a second insulative body portion with a second series of electrical attachment sites configured for making connections to said gullwing-shaped leads of said device, a second connector configured to mate with said first connector, and second conductive elements supported on said second body portion for making electrical connections between said second connector and said second series of electrical attachment sites.

21. The adapter of claim 20 wherein said second connector comprises a plurality of electrical connector elements supported in said second body portion.

22. The adaptor of claim 20 wherein said second connector comprises a body portion separate from said second body portion.

23. The adapter of claim 20 wherein said attachment sites on said second body portion are contact pads configured for making solder connections to said gullwing- shaped leads of the device.

24. The adapter of claim 20 further including at least one strain relief element affixed to said adapter for mechanical connection to the circuit surface.

25. The adapter of claim 20 wherein said second connector comprises a plurality of socket terminals.

26. The adapter of claim 20 wherein said second body portion comprises a printed circuit board and said conductive elements are printed circuit paths on said board.

27. The adapter of claim 20 wherein said conductive elements of said second body portion comprise portions of a lead frame, and said second body portion comprises portions molded around said lead frame.

28. An adapter for removably electrically connecting the gullwing-shaped leads of a quad flat pack electronic device to a circuit surface, wherein said leads are disposed in four rows, one on each of four sides of a rectangular pattern, and wherein said circuit surface has contacts disposed in essentially the same rectangular pattern as that of the electronic device, said adapter comprising a first insulative body bearing electrical attachment sites, adapter leads extending from said first insulative body for making electrical connections to the circuit surface, each said adapter lead extending outwardly from said adapter body and bending downwardly below said body and then further outwardly in a pair of opposing, gullwing- shaped curves, said adapter leads having ends, and said ends of said adapter leads forming feet located in a pattern matching that of said contacts on said circuit surface, first conductive elements supported by said first insulative body and connecting said adapter leads to said electrical attachment sites, a chimney connector including a plurality of receptacles connected to said attachment sites in said first insulative body, a second insulative body with a second plurality of electrical attachment sites configured for making connections to said gullwing-shaped leads of said quad flat pack device, a plurality of posts supported by said second body and configured to mate with said receptacles, and second conductive elements supported on said second body for making electrical connections between said posts and said second plurality of electrical attachment sites.

29. The adapter of claim 28 wherein said first conductive elements in said first body are printed circuit paths and said first insulative body is a printed circuit board.

30. The adapter of claim 28 wherein said first conductive elements in said first body and said adapter leads are portions of a lead frame, and said body comprises portions molded around said lead frame.

31. The adapter of claim 28 further including atleast one strain relief element affixed to said adapter for mechanical connection to the circuit surface.

32. The adapter of claim 28 wherein said attachment sites on said second body are contact pads configured for making solder connections to said gullwing-shaped leads of the device.

33. An adapter for removably electrically connecting the gullwing-shaped leads of a quad flat pack electronic device to a circuit surface, wherein said leads are disposed in four rows, one on each of four sides of a rectangular pattern, and wherein said circuit surface has contacts disposed in essentially the same rectangular pattern as that of the electronic device, said adapter comprising a first insulative body bearing electrical attachment sites, adapter leads extending from said first insulative body for making electrical connections to the circuit surface, each said adapter lead extending outwardly from said adapter body and bending downwardly below said body and then further outwardly in a pair of opposing, gullwing- shaped curves, said adapter leads having ends, and said ends of said adapter leads forming feet located in a pattern matching that of said contacts on said circuit surface, first conductive elements supported by said first insulative body and connecting said adapter leads to said electrical attachment sites, a chimney connector including a first plurality of receptacles connected to said attachment sites in said first insulative body. a second insulative body bearing a second plurality of receptacles, a first plurality of posts configured to mate with said first plurality of receptacles, and second conductive elements supported on said second body for making electrical connections between said first plurality of posts and said second plurality of receptacles, and a third insulative body bearing a second plurality of posts for connection to said second plurality of receptacles, and a plurality of electrical connection sites configured for making connections to said gullwing-shaped leads of said quad flat pack device, said connection sites and said posts being electrically connected.

34. The adapter of claim 33 wherein said first conductive elements in said first body are printed circuit paths and said first insulative body is a printed circuit board.

35. The adapter of claim 33 wherein said first conductive elements in said first body and said adapter leads are portions of a lead frame, and said body comprises portions molded around said lead frame.

36. The adapter of claim 33 further including at least one strain relief element affixed to said adapter for mechanical connection to the circuit surface.

37. The adapter of claim 33 wherein said attachment sites on said second body are contact pads configured for making solder connections to said gullwing-shaped leads of the device.

38. The adapter of claim 12 wherein said substrate further has a top side, a plurality of metalized holes opening onto said top side, said metalized holes being electrically connected to said electrical attachment sites, and wherein said leads are anchored in said holes and bent down around the edge of said top side of said circuit bearing element to below said circuit bearing element for connection to the contacts on the mother circuit surface.

39. An adapter for connecting to contacts on a mother circuit surface, comprising: a circuit bearing element having a top side, a plurality of metalized holes opening onto said top side, and a plurality of connection sites electrically connected to said holes, and a plurality of leads anchored in said holes and bent down around the edge of said top side of said circuit bearing element to below said circuit bearing element for connection to the contacts on the mother circuit surface-

40. The adapter of claim 39 wherein said leads are lead frame elements.

41. The adapter of claim 39 wherein said circuit bearing element is a printed circuit board.

42. The adapter of claim 39 wherein said leads are soldered to said holes in said circuit bearing element.

43. The adapter of claim 39 wherein said leads are bent outwardly below said circuit bearing element to form feet for attachment to the circuit surface.

44. The adapter of claim 43 wherein said leads are bent in a gullwing shape with two opposing curves.

45. The adapter of claim 39 further including receptacles connected to said connection sites and a chimney providing a mounting for said receptacles.

46. The adapter of claim 39 further including a through-hole pin for reinforcing any mechanical connection between the adapter and the circuit surface.

47. The adapter of claim 39 wherein said contacts are arranged in a pattern having four rows of contacts, one row on each side of a rectangular pattern.

48. An adapter for connecting to a mother circuit surface on which there are contacts arranged in a pattern having four rows of contacts, one row on each side of a rectangular pattern, said adapter comprising: a printed circuit board element having a top side, a plurality of plated holes opening onto said top side, and a plurality of connection sites electrically connected to said holes, and a plurality of lead frame elements soldered in said holes and bent down around the edge of said top side of said printed circuit board to below said circuit bearing element and then outwardly to form a gullwing shape having two opposing curves and feet for attachment to the contacts on said circuit surface.

49. The adapter of claim 48 further including receptacles connected to said connection sites and a chimney embedding said receptacles.

50. The adapter of claim 48 further including a through-hole pin for reinforcing the mechanical connection between the adapter and the circuit surface.

51. An electrical interfacing element for connection to the leads of an integrated circuit package, each package lead having a downwardly extending section, said socket comprising a plurality of interfacing element terminals for connection to a circuit bearing element (e.g., a printed circuit board or a cable) , a supporting section for supporting said terminals, and a plurality of vertically extending resilient single-reed-shaped contacts supported by said supporting section, each electrically connected to one of said interfacing element terminals, for connecting to a surface of said downwardly extending section.

52. The interfacing element of claim 51 wherein said interfacing element is a socket and wherein said terminals are leads.

53. The interfacing element of claim 51 wherein said interfacing element is a test clip assembly and further includes a cable for connection to said terminals.

54. The interfacing element of claim 51 further including a plurality of lead frame elements, each of said contacts being integral to one said lead frame element.

55. The interfacing element of claim 51 wherein said contacts make a wiping contact over at least half of the downward section of the lead upon mating the package and said interfacing element.

56. The interfacing element of claim 51 wherein said contacts make a wiping contact over at least 0.02 inches of the downward section of the lead upon mating the package and said interfacing element.

57. The interfacing element of claim 51 wherein said reed-shaped contacts extend upwardly from the bottom surface of the package.

58. The interfacing element of claim 51 wherein said contacts press outwardly on the package leads to maintain contact with the package leads when the package and the interfacing element are in an engaged position.

59. The interfacing element of claim 51 wherein said contacts press inwardly on the package leads to maintain contact with the package leads when the package and the interfacing element are in an engaged position.

60. The interfacing element of claim 51 wherein said contacts are portions of lead frame elements and are separated and maintained in registration by ribs in said bottom section.

61. The interfacing element of claim 51, wherein said interfacing element is a socket and said supporting section is a bottom section and further including a top section for holding the package when installing the package on said bottom section, said top section including top section ribs to separate and maintain the package leads in registration.

62. The socket of claim 61 wherein said top section further includes a resilient reed for retaining the package in said top section.

63. The socket of claim 61 further including a pin- and-socket connector for maintaining said top section in place on said bottom section.

64. The socket of claim 61 wherein said top section provides a retaining surface for retaining the package leads against a force applied by said contacts against the package leads.

65. The socket of claim 61 further including a cover for covering said body sections.

66. The interfacing element of claim 54 wherein said terminals comprise pins supported by said supporting section and are each connected to one of said lead frame elements.

67. The interfacing element of claim 54 wherein said terminals comprise receptacles supported by said supporting section and are each connected to one of said lead frame elements.

68. The interfacing element of claim 51 wherein said supporting section is made of a molded thermoplastic.

69. The interfacing element of claim 68 wherein said lead frame elements are at least partially embedded in said supporting section.

70. The interfacing element of claim 51 further including a plurality of lead frame elements, each of said contacts being integral to one of said lead frame elements, and each of said terminals being integral to one of said lead frame elements.

71. The interfacing element of claim 70 wherein said lead frame elements are at least partially embedded in said bottom section.

72. The interfacing element of claim 70 wherein said interfacing element is a socket and said lead frame elements are bent to form leads for through-hole insertion into a circuit bearing element.

73. The interfacing element of claim 70 wherein said interfacing element is a socket and said lead frame elements leads are bent to form gullwing shaped leads for surface mount attachment to a circuit bearing element.

74. The interfacing element of claim 51 wherein said interfacing element is a socket and wherein said socket leads have the same footprint as does the package.

75. The interfacing element of claim 54 wherein a first group of said lead frame elements are cut from a first lead frame and a second group. of said lead frame elements are cut from a second lead frame.

76. The interfacing element of claim 54 wherein said interfacing element is a test clip and further including a second section bearing ribs attached to said supporting section.

77. The interfacing element of claim 76 further including a notch joint for attaching said sections.

78. The interfacing element of claim 54 wherein said interfacing element is a test clip and further including a resilient reed for retaining the test clip engaged on said package.

79. A socket for connection to the leads of an QFP integrated circuit package, each package lead having a downwardly extending section, said socket comprising a plurality of socket leads for connection to a circuit bearing element (e.g., a printed circuit board), a molded bottom section for supporting said socket leads, a plurality of lead frame elements at least partially embedded in said bottom section, each said lead frame element including an upwardly extending resilient single-reed-shaped contact supported in said bottom section, each said lead frame element being electrically connected to one of said socket leads, each said lead frame element being for pressing outwardly to make a wiping contact to a surface of said downwardly extending section, said bottom section including ribs for maintaining said contacts separated and in registration, and a top section for holding the package when installing the package on said bottom section, said top section including top section ribs to separate and maintain the package leads in registration.

80. The socket of claim 79 wherein said contacts make a wiping contact over at least half of the downward section of said lead upon installing the package in said socket.

81. The socket of claim 79 wherein said contacts make a wiping contact over at least 0.02 inches of the downward section of said lead upon installing the package in said socket.

82. The socket of claim 79 further including a pin- and-socket connector for maintaining said top section in place on said bottom section, and wherein said top section provides a retaining surface for retaining the package leads against a force applied by said contacts against the package leads,

83. The socket of claim 79 wherein said socket leads are pins supported by said bottom section and are each connected to one of said lead frame elements, and wherein said reed-shaped contacts extend upwardly from the bottom surface of the package.

84. The socket of claim 79 wherein each of said leads is integral to one of said lead frame elements and wherein each of said lead frame elements is bent to form a lead for through-hole insertion into a circuit bearing element.

85. The socket of claim 79 wherein each of said leads is integral to one of said lead frame elements and wherein each of said lead frame elements is bent to form a gullwing shaped lead for surface mount attachment to a circuit bearing element.

86. The socket of claim 79 wherein each of said leads is integral to one of said lead frame elements and wherein each of said lead frame elements is bent to form a gullwing shaped lead for surface mount attachment to a circuit bearing element having the same footprint as does the package.

87. The socket of claim 79 further including a cover for covering said body sections.

88. The socket of claim 79 wherein a first group of said lead frame elements are cut from a first lead frame and a second group of said lead frame elements are cut from a second lead frame.

89. A socket for connection to the leads of an LCC integrated circuit package, each package lead having a downwardly extending section, said socket comprising a plurality of socket leads for connection to a circuit bearing element (e.g., a printed circuit board), a molded bottom section for supporting said socket leads, a plurality of lead frame elements at least partially embedded in said bottom section, each said lead frame including an upwardly extending resilient single- reed-shaped contact supported in said bottom section, each said lead frame element being electrically connected to one of said socket leads, each said lead frame element being for pressing inwardly to make a wiping contact to a surface of said downwardly extending section, said bottom section including ribs for maintaining said contacts separated and in registration.

90, A test clip for connection to the leads of a QFP integrated circuit package, each package lead having a downwardly extending section, said test clip comprising a plurality of terminals for connection to a circuit bearing element (e.g., a cable), a molded supporting section for supporting said terminals, a plurality of lead frame elements at least partially embedded in said supporting section, each said lead frame including a downwardly extending resilient single-reed-shaped contact supported in said bottom section, each said lead frame element being electrically connected to one of said terminals, each said lead frame element being for pressing inwardly to make a wiping contact to a surface of said downwardly extending section, and a second section attached to said first section and including ribs for maintaining said contacts separated and in registration.

91. The test clip of claim 90 wherein said terminals are receptacles for accepting a cable with pinned connectors connected to it.

92. The test clip of claim 90 wherein said terminals are pins for accepting a cable with receptacles connected to it.

93. A method of manufacturing an adapter for removably electrically connecting the device leads of an electronic device to a circuit surface on which there are contacts arranged in a pattern having four rows of contacts, one row on each side of a rectangular pattern, said method comprising the steps of molding a first insulating body, sealing a series of leads in a lead frame to said body, and bending said sealed leads into a gullwing shape corresponding to said pattern.

94. The method of claim 93 wherein said step of sealing said leads is performed by heat sealing said lead frames in grooves molded in said body.

95. The method of claim 93 wherein said step of sealing said leads is performed by means of an adhesive.

96. The method of claim 93 further including the steps of embedding terminals in said body, and electrically connecting said leads to said terminals.

97. The method of claim 96 wherein said step of electrically connecting said leads to said terminals is performed by soldering.

98. The method of claim 96 wherein said step of electrically connecting said leads to said terminals is performed by press-fitting.

99. The method of claim 94 further including the step of molding a second shot molding portion around said body and sealed leads.

100. A method of providing gullwing-shaped leads to a circuit bearing element including providing a plurality of lead frame elements in a lead frame, bending said lead frame elements into a hook-shape, soldering said bent lead frame elements in holes in the circuit bearing element, bending the soldered leads down around the edge of the top surface of the circuit bearing element and below the circuit bearing element, and removing a side frame portion from said bent lead frame.

101. The method of claim 100, further including the steps of removing the corners of said soldered lead frame before said step of bending said soldered leads.

102. The method of claim 100, wherein said step of removing a side portion from said bent lead frame is performed after said step of bending said soldered leads.

103. The method of claim 100 wherein said bending operations are performed with bending tools.

104. The method of claim 100 wherein said steps of bending said soldered leads and cutting said leads are performed in a single operation with a single tool.

105. A method of making an electrical interfacing element for connecting package leads to terminals in said interfacing element, comprising the steps of bending a plurality of lead elements in a first lead frame upwardly, mounting the bent first lead frame on an interfacing element lead frame supporting section, bending a plurality of lead elements in a second lead frame upwardly after said step of mounting the frame of said first lead frame, mounting the bent second lead frame on the interfacing element lead supporting section.

106. The method of claim 105 wherein said bent lead frame elements from said first and second lead frames are heat sealed into said lead supporting section.

107. The method of claim 105 further including the steps of cutting away the frame of the mounted first lead frame and cutting away the frame of the mounted second lead frame.

108. The method of claim 105 further including the steps of cutting away the frame of the mounted first lead frame after the step of mounting the bent first lead frame and before the step of mounting the bent second lead frame, and cutting away the frame of the mounted second lead frame after the step of mounting the bent second lead frame.

109. A method of making an electrical interfacing element for connection to downwardly extending sections of an integrated circuit package leads, including the steps of: bending lead frame elements, mounting the lead frame elements on a lead supporting section, soldering said mounted lead frame elements to terminals, inspecting the resulting solder joints, and attaching a further, ribbed, section to said lead supporting section.