JPS63181335A - Equipment for manufacturing semiconductor device - Google Patents

Abstract

PURPOSE:To improve work efficiency, by providing a rotory mechanism wherein a specified lead frame among lead frames to be molded which is to be set in the inverse direction is rotated and set in the inverse direction, and the lead frame set in the inverse direction among molded lead frames is set in the normal direction. CONSTITUTION:When a lead frame 11 to be set in the inverse direction is transferred from on a round belt 14 at the left side of a rotation machine 5 to a central part of the round belt 14 on a turn table 15, the rotation of the round belt 14 is interrupted. When, by a driving equipment 16, the turn table 15 is rotated in the left direction by one half of a rotation, the lead frames 11 is rotated by 180 deg., together with the round belt 14 mounting the lead frame, and the direction of the lead frame 11 is turned into the opposite state at the time when it is carried on the rotation machine 6. After the lead frames 11 set in the inverse direction are returned to the intial direction, and the lead frames 11 are arranged in a row, each lead frame 11 is mounted on a rack and carried out from a molding equipment. The work efficiency can be improved, thereby.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an apparatus for manufacturing semiconductor devices, and is particularly effective when applied to a molding apparatus for molding semiconductor chips with resin.

[Prior art]

One of the techniques for sealing semiconductor chips is to use resin such as resin. Resin molding is made by pouring resin into a predetermined mold, and this mold is usually used to form a plurality of lead frames, for example, four lead frames at one time.

The mold is divided into an upper mold and a lower mold, and after a lead frame is sandwiched between them, resin is poured. In both the upper mold and the lower mold, a runner for injecting resin is provided in the center, and cavities shaped like packages are arranged on both sides of the runner. On the other hand, the current flow is based on one lead frame.

There is a slight difference between the area around the lead pin that is close to the runner and the area that is far from the runner. Under this influence, the electrical characteristics of the lead pins also differ slightly. For this reason, the arrangement of the lead pins is symmetrical between the lead frame placed on the left side of the runner and the lead frame placed on the right side.
Either the left lead frame or the right lead frame is turned in the opposite direction and then placed in the mold. Note that the technology related to resin molds is described in, for example, Nikkei Electronics Special Issue "Micro Devices J no. 2.1984.
Published June 11, 2015, pages 79-81.

[Problem that the invention seeks to solve]

As a result of studying the molding apparatus, the inventor found the following problems.

The lead frame to be turned in the opposite direction must be manually turned in the opposite direction before being carried into the molding device, which significantly reduces work efficiency. It is also conceivable to transport the lead frame to the entrance of the molding device using an automatic transport machine, but in this case, an automatic reversing machine must be installed between the automatic transport machine and the molding machine, and the transport mechanism and control However, the object of the present invention is to improve the workability of a molding device.

Another object of the present invention is to provide a good mechanical connection between an automatic conveyance machine and a molding device.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, a rotating machine rotates a predetermined lead frame to be oriented in the opposite direction among the lead frames to be molded, and a rotating machine that rotates a predetermined lead frame that is oriented in the opposite direction among the molded lead frames, and a rotating machine that rotates a predetermined lead frame that is oriented in the opposite direction among the molded lead frames. A rotary machine is installed inside the molding machine.

[Effect]

According to the above-mentioned means, the lead frames can be sequentially fed into the molding device while keeping the same orientation.
The work of manually reversing the lead frame to be reversed at the entrance of the molding device is eliminated, and after molding, the lead frame that is in the opposite orientation can be manually reversed to its original orientation at the exit of the molding device. This can save you the work of returning it. Alternatively, a rotating machine for turning a predetermined lead frame in the opposite direction is not provided between the automatic conveyance machine and the molding device, but is provided inside the molding device,
In addition, a rotary machine that returns the oppositely oriented lead frames of each molded lead frame to the original direction is not installed between the molding device and the automatic conveyance machine, but is installed inside the molding device. The mechanisms from the automatic conveyance machine for feeding the lead frame to the molding device and the automatic conveyance machine for feeding out the molded lead frame are simplified, thereby improving the controllability between them.

[Embodiments of the invention]

The present invention will be explained in detail below.

FIG. 1 shows the flow of a program from loading a lead frame into a molding device to unloading it.

As shown in FIG. 1, a lead frame molding device 2
The program from carrying the lead frame into the molding machine 2 to carrying it out is as follows: 1 carrying the lead frame into the molding machine 2;
The loader is set at a predetermined position on the transport machine in Rotation to change the orientation of a predetermined lead frame among the respective lead frames to be molded5. Frame alignment 6 for aligning each lead frame so that it can be molded, a mold 7 for molding the lead frames, a gate break 8 for removing the mold from the lead frame after molding, and a lead frame facing in the opposite direction. rotation 9 to return the lead frame to its original orientation, and an unloader 10 to set the lead frame on a rack used for transportation.
, and an unloader 3 for unloading the lead frame from the molding device 2.

In the molding device 2 of this embodiment, operations from a loader 4 to an unloader 10 can be performed within the molding device 2.Next, the outline of the mechanism for carrying in 1 and the loader 4 will be explained using FIG. .

As shown in Figure 2, the lead frame construction is as follows.

It is set on the rack 12, and this rack 12 is loaded into the loading machine IA.
It is carried to the loader 4 by conveying it to the loader 4. Although not shown, a semiconductor chip is bonded onto the tab of the lead frame, and the bonding pads of the semiconductor chip and predetermined lead pins are connected by bonding wires. Note that from now on, in order to make it easier to understand the direction of the lead frame 11,
For example, in FIG. 2 and subsequent figures, if a point P is shown at a similar portion of two lead frames 11, for example at the bottom left end, then 11 means facing the same direction. If the point P of one lead frame 11 is on the lower left end and the point P of the other lead frame 11 is on the upper right end, then those two lead frames 1
1 means that the direction is 180 degrees different 6.

The lead frame 11 is mounted on a rack 12 and transported to the loader 4 by transporting the rack 12 by a carry-in machine IA. When mounting the lead frames 11 on the rack 12, the lead frames 11 are mounted so that they are oriented in the same direction. The loader 4 arranges the lead frames 11 in the transported rack 12 on a round belt 14 constituting a conveyor in the molding device 2 so as to face in the same direction. Note that the round belt 14 constitutes a conveyor together with the pulley 13 and a drive motor (not shown). A lead frame 11 is installed in such a way as to bridge the two round belts 14 arranged side by side.
is placed.

Next, FIG. 3 shows an example of a rotating machine mechanism for changing the direction of a predetermined lead frame 11. As shown in FIG.

As shown in FIG. 3, the rotating machine includes a turntable 15,
It consists of a driving device 16, a round belt 4 disposed on a turntable 15, a pulley 13, and the like. round belt 1
Although the motor for moving the belts 4 is not shown, the two round belts 14 are driven simultaneously by the same motor. This drive motor has a round belt 14, a pulley 13
etc., on the turntable 15.

In addition, from now on, turntable 15. The pulley 13, round belt 14, etc. on the drive device 16° turntable 15 constitute a rotating machine for implementing the rotation program 5, so when referring to them as a whole, they are referred to as the rotating machine 5. Up to the rotary machine 5, the lead frame 11 is carried by the round belt 14 on the left side.The lead frames 11 are oriented in the same direction before the six rotary machine 5. That is, the point P shown for convenience is located at the lower left end of all lead frames 11 before the rotating machine 5.

Lead frames 1 arranged in the same direction
1, every other lead frame 11 is a lead frame 11 that can be turned in the opposite direction. however,
In succession, two may be in the normal direction, the latter two may be in the opposite direction, and the next two may be in the normal direction again. The permutations of the lead frame 11 in the normal direction and in the opposite direction are as follows:
Various combinations can be made depending on the configuration of the mold for molding.

After the rotating machine 5 changes the orientation of the lead frame 11 that is turned in the opposite direction, the lead frame 11 is carried out onto the round belt 14 on the right side of the rotating machine 5, and the lead frame 11 in the normal orientation is It is carried out onto the round belt 14 on the right side of the rotating machine 5 without changing its direction. In other words, the lead frame 11 facing the opposite direction is first placed on the rotating machine 5.
from above the round belt 14 on the left side to above the round belt 14 on the turntable 15. When the lead frame 11 has moved to the center of the round belt 14 on the turntable 15, the rotation of the round belt 4 on the turntable 15 is stopped. Next, the drive device 16 drives the turntable! For example, when the lead frame 11 is rotated by half a rotation counterclockwise, the lead frame 11 and the round belt 14 on which it is placed are rotated by 180 degrees. As a result, the lead frame 11
The direction is opposite to when it is carried onto the rotating machine 5.

In other words, if the position of point P when it was brought in was at the bottom left end, then the point P after being rotated 180 degrees
is located at the top right edge. By rotating the round belt 14 on the turntable 15 once again, the lead frame 11 that has been turned in the opposite direction is moved to the right round belt 1 of the rotating machine 5.
4 to be carried out. On the other hand, when a single lead frame whose direction does not change is moved onto the turntable 15, the turntable 15 is not rotated. At this time, the round belt 14 on which the lead frame 14 is placed may temporarily stop rotating when the lead frame 11 reaches the center of the turntable 5, or may continue to rotate.

When the rotation is temporarily stopped, the round belt 14 is rotated again and carried out onto the right round belt 14 of the rotating machine 5.

The lead frames 11 that have passed the rotating machine 5 are aligned so that they can be set in a mold for molding, as shown in FIG.

Incidentally, FIG. 3 is a plan view showing an outline of the lower mold for molding.

As shown in Fig. 4, the mold has a cull 17, a runner 18,
It consists of a gate 19, a cavity 20, etc. The lead frames 11 are arranged on both sides of the runner 18, with the lead frames 11 below and above the runner 18 in FIG. 4 having opposite directions. After molding is performed by sandwiching the lead frame 11 between the lower mold and the upper mold (not shown), these molds are separated from the lead frame 11 (
Gatebreak). The molding mechanism for actually molding the lead frame 11 includes an upper mold, a lower mold, a device for feeding resin into the cavity 20, and the like.

Next, the lead frames 11, which have been turned in the opposite direction, are returned to their original orientation, and the lead frames 11 are arranged, for example, in a negative column. This is done by installing a rotating machine similar to the rotating machine 5 shown in FIG. 3 after the molding mechanism. Thereafter, each lead frame 11 is mounted on a rack by an unloader mechanism and is unloaded from the molding device 2.

As explained above, since the rotating machine 5 as shown in FIG. You can omit the work of orienting. Similarly, since a rotary machine similar to the rotary machine 5 shown in FIG. The work of reorienting can be omitted.

Alternatively, the rotary machine 5 for changing the direction of the lead frame 11 that should be turned in the opposite direction before being fed into the molding mechanism may be installed inside the molding device 2 instead of being provided as a separate device between the carry-in machine IA and the molding device 2. A rotary machine 5 is provided as a separate device between the molding device 2 and the unloading device 3, and a rotary machine 5 is provided between the molding device 2 and the unloading device 3 to restore the direction of the lead frames 11 facing oppositely to each other out of the respective lead frames 11 that have come out of the mold mechanism. By providing it in the molding device 2 instead of providing it, the configuration of the system from the loading machine 1 to the molding device 3 to the unloading machine 3 can be simplified. In other words, these systems become easier to control.

The present invention has been specifically described above based on examples, but 1.
It goes without saying that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit thereof.

For example, as a mechanism for changing the direction of the lead frame 11, a suction device as shown in FIG. 5 may be used.

FIG. 5 is a perspective view showing an outline of a suction device for changing the orientation of the lead frame 11.

In FIG. 5, 21 is a suction pipe, 22 is an electric motor, 23 is a suction port, and A and B are gears, which constitute a suction device. The suction pipe 21 is connected to a suction pump (not shown). In this suction device, the suction port 23 is applied to the frame portion of the lead frame 11, and the lead frame 11 is suctioned through the suction pipe 21 and the suction device 23.

The direction of the lead frame 11 is changed by rotating the suction pipe 21 through the gears B and A by the electric motor 22.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

Since the lead frame can be fed into the molding machine with the same orientation, the orientation can be changed.The work of manually turning the lead frame in the opposite direction at the entrance of the molding machine and the lead frame coming out of the molding machine. Of these, it is possible to omit the work of restoring the orientation of the lead frame that is oriented in the opposite direction. Due to this.

Work efficiency can be improved.

In addition, a rotary machine for changing the direction of a predetermined lead frame is provided inside the molding machine instead of between the carry-in machine and the molding machine. A rotary machine for restoring the lead frame to its original orientation is not installed between the molding machine and the unloading machine, but is installed inside the molding machine, so the system from the loading machine to the molding machine to the unloading machine is The configuration can be simplified. In other words, it becomes easier to control those systems.

[Brief explanation of the drawing]

Figure 1 shows the flow of the mold program, Figure 2 shows the flow of the mold program.
FIG. 3 is a schematic diagram of the loader of the molding device, and FIG. 3 is a schematic diagram of the rotating machine. FIG. 4 is a plan view of the mold, and FIG. 5 is a schematic diagram of the adsorber. IA... Carrying machine, 2... Mold device, 11...
Lead frame, 12...Rack, P...Point, 13...Pulley, 14...Round belt, 15...
Turntable, 16... Drive device, 17... Cal, 18... Runner, 19... Gate, 20... Cavity, 21... Adsorption pipe, 22... Electric motor, 23... ...Suction port, A, B...gear. Agent: Patent attorney Katsutoshi Ogawa) 1 S... Part 4 Figure 5

Claims (1)

[Scope of Claims] 1. A molding device for sealing a semiconductor chip and a lead frame to which the semiconductor chip is attached, the molding device including a rotary machine for changing the direction of the lead frame. A semiconductor device manufacturing device characterized by: 2. The rotating machines are installed at the front and rear stages of a molding mechanism that molds using a mold, and when molding a lead frame, the rotating machines at the front stage are arranged so that the arrangement of each lead pin provided on the lead frame is as described above. This is to ensure that the lead frames on both sides of the mold runner are symmetrical, and the rotating machine in the latter stage returns the lead frames that are facing the opposite direction to their normal orientation after molding. An apparatus for manufacturing a semiconductor device according to claim 1, wherein the apparatus is for manufacturing a semiconductor device. 3. The semiconductor device manufacturing apparatus according to claim 1, wherein the rotating machine is constructed using a turntable or a suction device.