JP2590080B2 - Transfer device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device for semiconductor devices, and more particularly to a transfer device for transferring a lead frame from a first assembly device to a second assembly device. It is about technology that is effective to apply.

[Conventional technology]

A semiconductor device in which a semiconductor chip is sealed with a resin such as a resin has a structure in which the semiconductor chip is bonded to a tab of a lead frame. The lead frame is transported to a bonding device for bonding a semiconductor chip, a bonding device for connecting bonding wires, and a molding device for sealing the semiconductor chip in order according to the manufacturing process. This conveyance is performed by, for example, a belt conveyor configured by arranging a plurality of belts having round cross sections in parallel. As an example of a transfer device, a transfer device that transfers a wafer using a rubber belt is described in Ohmsha, published on October 25, 1982, “LSI Process Engineering” p139.
~ P140.

[Problems to be solved by the invention]

As a result of studying a belt conveyor for conveying the lead frame, the present inventors have found the following problems.

In order for the lead frame to be conveyed in a stable state without snaking on the belt conveyor, it is necessary to use a belt conveyor suitable for the size of the lead frame. However, the width of each belt constituting the belt conveyor or the distance between the belts is fixed. For this reason, there has been a problem that the belt conveyor itself must be replaced every time the type of the lead frame changes.

An object of the present invention is to provide a transport device capable of transporting lead frames of various sizes in a stable state.

The above and other objects and novel features of the present invention are as follows.
It will become apparent from the description of the present specification and the accompanying drawings.

[Means for solving the problem]

The outline of a typical invention disclosed in the present application is briefly described as follows.

That is, a lead frame is mounted on a rack, and the rack on which the lead frame is mounted is mounted on a pallet and transported.

[Action]

According to the above means, the lead frame is stably held by the rack, and the rack can be selected in various sizes according to the size of the lead frame, so that the lead frames of various sizes can be transported in a stable state. can do.

 Hereinafter, the present invention will be described with examples.

〔Example〕

FIG. 1 is a diagram schematically showing the system of the transport device of the present embodiment.

In FIG. 1, reference numeral 1 denotes a transfer system for transferring a lead frame, and the flow of the transfer is indicated by arrows. Adjacent to the transport system 1, there are provided pellet bonders 2 and 3 for bonding pellets to tabs of a lead frame, wire bonders 4 and 5 for connecting leads and bonding pads of pellets with wires, and a molding device 6 for molding pellets with resin. Have been. The lead frame is sent from the transfer system 1 to the pellet bonder 2 through the transfer system 1A, where pelletization is performed, and then the lead frame is sent out by the transfer system 1B. The lead frame is sent to the pellet bonder 3 through the transfer system 1C, and the lead frame after pelletization is sent out from the transfer system 1B. That is, in the transport system 1 shown in FIG. 1, the transport system 1B is used for common delivery of the pellet bonders 2 and 3. Pelletized lead frame is transported by 1D or
The lead frame sent to the wire bonder 4 or 5 by 1F and the wire bonding is completed is transferred to the transport system 1E.
Or sent out by 1G. The lead frame on which the wire bonding has been completed is sent to the molding apparatus 6 by the transfer system 1H, and the lead frame on which the molding has been completed is sent out by the transfer system 1I.

FIG. 2 shows a partial configuration of the transport system 1 and 1A to 1I.

In FIG. 2, reference numeral 7 denotes a pulley (belt wheel), and a round belt 8 is hung in a groove (not shown). One round belt 8 is hung on two pulleys 7, and when the pulley 7 is rotated by an electric motor, it rotates between the two pulleys 7.
The cross section in the direction crossing the longitudinal direction of the round belt 8 is round. In the direction of the rotation axis of the pulley 7, the two pulleys 7 are arranged side by side, and fixedly connected between them by a cylinder 9, so that the two pulleys 7 rotate simultaneously. Therefore, the pair of round belts 8 spanning the two pulleys 7 connected by the cylinder 9 have the same moving speed. The pulley 7 is rotatably supported by the side plate 10. Between the two side plates 10, the pair of pulleys 7, the cylinder 9, and the round belt 8 are repeatedly arranged in the longitudinal direction to form one transport system 1, 1A, 1B. That is, a pallet 13 and a rack 14 (see FIG. 3) for transporting the lead frame are placed on the two round belts 8. Two pulleys 7 are stretched over one round belt 8, and one of the pulleys 7 is driven by an electric motor. Practically, since two pulleys 7 are connected to one cylinder, the two pulleys 7 are driven by one electric motor. In FIG. 2, two transport systems 1, 1A and 1B are arranged side by side.

The pulley 7, the cylinder 9, the round belt 8, and the side plate 10 are provided in a ventilation duct 11 as shown by a dashed line, and the lead before molding is formed by flowing clean air into the ventilation duct 11. It is preferable to protect the frame, the pellet, the wire bonding, and the like.

Here, FIG. 3 shows a cross-sectional structure in a direction intersecting the longitudinal direction of the transport systems 1 and 1A to 1I. The third
The drawing does not show the pulley 7 and the cylinder 9.

Although not shown in FIG. 2, the upper part of the round belt 8 when it is wound around the pulley 7, that is, the side on which the pallet 13 and the rack 14 for transporting the lead frame are placed is a sliding plate 12. It is supported and moves while sliding on it.

 Next, the configurations of the pallet 13 and the rack 14 will be described.

 FIG. 4 is a perspective view of the pallet 13 and the rack 14.

In FIG. 4, the pallet 13 is made of, for example, stainless steel, and has two projections 15 and 16 mounted on its upper surface. The projections 15 and 16 have a perfect circular shape when viewed from above, and have a tapered shape in which the upper part is thinner than the lower part. Fitting holes 17 and 18 are formed in the bottom of the rack 14 so as to fit with the projections 15 and 16. The fitting hole 17 is an oval, and the fitting hole 18 is a perfect circle. The work of mounting the rack 14 on the pallet 13 is facilitated by making the fitting holes 17 oval. By providing these projections 15, 16 and fitting holes 17, 18, the rack 14
13 I do not move on the top. As shown in FIG. 3, the pallet 13 is placed on the round belt 8, and this pallet is
The lead frame 20 is transported by placing the rack 14 on the projection 13 so that the projections 15 and 16 and the fitting holes 17 and 18 are fitted.
A plurality of linear grooves 19 are formed inside the side walls on both sides of the rack 14, and the lead frame 20 is inserted into the grooves 19 and transported. In addition, the lead frame 20
Six packages are integrated.

The width and length of the lead frame 20 vary depending on the semiconductor device. For this reason, the width and length of the rack 14 are variously changed according to the lead frame 20. However, whatever the size of the racks 14, they are
The transport system 1 and 1A to 1B do not need to be changed even if the size of the lead frame 20 changes because the transport system 1 can be placed on the transport. That is, lead frames 20 of various sizes can be transported by the same transport system 1 and A to 1B. Since the rack 14 is mounted on the flat pallet 13, the rack 14 in other words, the lead frame 20 can be transported in a stable state.

Next, how the pallet 13 and the rack 14 are transported will be described.

First, between the place where the used lead frame 20 is stocked and the entrance of the pellet bonder 2, the groove of the rack 14 is provided at the place where the new lead frame 20 is stocked.
The lead frame 20 is stored in 19, and thereafter, is transported to the entrance of the pellet bonder 2 by the transport systems 1 and 1A. Here, after all the lead frames 20 have been lowered, they are returned to the place where the lead frames 20 are stocked through the return path of the transport systems 1A and 1. That is, the place where the new lead frame 20 is stocked and the pellet bonder 2
Pallet 13 and rack 14 reciprocate between the entrances. In addition,
The return path of the transport systems 1 and 1A is not shown. Next, the outlet of the pellet bonder 2 is provided with the pallet 13 used for transportation between the lead frame 20 and the inlet of the pellet bonder 2.
A pallet 13 and a rack 14 different from the rack 14 are on standby, and the rack 14 stores the lead frame 20 that has exited the pellet bonder 2. Then, the pallet 13 and the rack 14 in which the lead frame 20 has been stored are transferred to the transport system 1.
It is carried to the entrance of the wire bonder 4 through B, 1 and 1D. The rack 14 from which all the lead frames 20 have been lowered at the entrance of the wire bonder 4 is returned to the exit of the pellet bonder 2 through the return paths of the transport systems 1D, 1 and 1B together with the pallet 13 thereunder. Thus, the pallet 13 and the rack
14 is adapted to be carried back and forth between the outlet of the first device and the inlet of the second device.

As described above, the present invention has been specifically described based on the embodiments. However, it is needless to say that the present invention is not limited to the above embodiments and can be variously modified without departing from the gist thereof. Absent.

For example, the pallet 13 can be configured as shown in FIG.

 FIG. 5 is a sectional view of the pallet 13 and the rack 14.

In the pallet 13 shown in FIG. 5, the rack 14 is pressed and fixed to the stopper 13A by the movable piece 22 attached to the tip of the holding shaft 23. The stopper 13A is provided fixed to the edge of the pallet 13. Presser shaft 23 is a pallet
13 is slidably supported by a fixed support 21 fixedly provided on the side opposite to the stopper 13A. A spring 24 is inserted into the holding shaft 23 so that the movable piece 22 is pressed against the rack 14. A stopper 25 is provided on the opposite side of the movable piece 22 of the presser shaft 23 so that the presser shaft 23 does not fall off.

With the pallet 13 having such a configuration, racks 14 of various sizes can be transported by the same pallet 13.

〔The invention's effect〕

The effects of the present invention disclosed by the present application will be briefly described as follows.

That is, by mounting the rack on a pallet and transporting the same, even if the size of the rack, in other words, the size of the lead frame varies, the same pallet can be used to transport the rack. The frames can be transported by the same transport system. Thereby, workability can be improved.

[Brief description of the drawings]

1 is a diagram for explaining a transport system, FIG. 2 is a diagram showing a specific configuration of the transport system, FIG. 3 is a cross-sectional view of the transport system, and FIG. 4 is a pallet and a rack. FIG. 5 is a sectional view of a pallet and a rack according to a modification of the embodiment. 1, 1A to 1I: transport system, 2, 3, ..., pellet bonder, 4, 5 ... wire bonder, 6: molding device, 7
... pulley, 8 ... round belt, 9 ... cylinder, 10 ... side plate, 11 ... ventilation duct, 12 ... sliding plate, 13 ... pallet, 14 ... rack, 15, 16 ... ... projection, 17 , 18 ... fitting hole, 19 ... groove.

Claims (1)

(57) [Claims] 1. A transfer device for transferring lead frames between manufacturing apparatuses by means of a rack which inserts the lead frames into grooves formed on both inner side walls and stores the lead frames in multiple stages, wherein the lead frames are stored or empty. The rack is transported between manufacturing apparatuses, the rack being transported and the traveling path are covered by a ventilation duct, and a transport system that flows clean air in the ventilation duct; and the rack is placed on the transport system. Transported,
A pallet provided with a projection that fits with the bottom surface of the rack at a predetermined position on the upper surface thereof; and an inner volume having various sizes according to the type of the lead frame to be conveyed. A rack provided with a fitting hole for fitting.