JPH05190645A - Semiconductor substrate transfer mechanism - Google Patents

Abstract

PURPOSE:To collect dust generated from a pulley and a bearing without floating in air and to prevent it from attaching to a wafer by providing a suction nozzle by vacuum with its suction port facing a lower part of an area near a pulley which drives a belt whereon a wafer is mounted and sent and a bearing. CONSTITUTION:A pulley 1 rotates, a belt 2 is sent to one direction and a wafer 3 is also sent by friction with the belt 2. In the process, dust is generated by friction between the pulley 1 and a transfer belt 2 and friction between the pulley 1 and a bearing 8. However, a vacuum pump 6 operates all the time and air flow shown by an arrow is generated in an area near the bearing 8 and the pulley 1. Dust is sucked forcibly to a suction nozzle 4 without floating in air due to the air flow. Therefore, it is possible to prevent dust generated from the pulley 1 and the bearing 8 from attaching to the wafer 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor substrate carrying mechanism, and more particularly to a semiconductor substrate carrying mechanism for carrying a semiconductor substrate on a belt.

[0002]

2. Description of the Related Art Generally, when manufacturing a semiconductor device, impurities are implanted into a semiconductor substrate (hereinafter simply referred to as a wafer),
It is divided into a process of forming a number of integrated circuits and a process of dividing the wafer on which the circuits are formed into individual integrated circuits into pellets, and forming pellets into the lead frames to assemble them into a semiconductor device. In the former process, a single wafer is often transferred between facilities. There is a semiconductor substrate transfer device as an equipment used in such a case. This device is not stand-alone as a unit, but many have been used as part of the delivery device of other equipment.

The transport mechanism applied to such a transport apparatus is required to have various performances such as smooth feeding, no damage to a fragile wafer, and no generation or adhesion of dust. Was there. Although not shown in the drawings, a semiconductor substrate transfer mechanism of this type has heretofore been a simple mechanism including a belt made of rubber and having a round cross section, and a V-groove pulley.

[0004]

However, in the conventional conveying mechanism, a slight amount of dust is generated due to friction between the conveying belt and the pulley that transmits power to the belt.
In addition, dust is also generated due to friction between the pulley and the bearing that holds the pulley. The generated dust drifts around the transport mechanism and adheres to the wafer, adversely affecting the fine electric circuits formed on the semiconductor substrate. Particularly in recent years, with the miniaturization of circuits, the problem of this dust has become serious.

It is an object of the present invention to provide a semiconductor substrate transfer mechanism which is provided with a means for collecting dust generated in order to eliminate such a problem without drifting in the air and prevents the dust from adhering to the semiconductor substrate.

[0006]

According to the present invention, there is provided a semiconductor substrate transporting mechanism comprising a belt for carrying a semiconductor substrate, a pulley for feeding the belt, a bearing for supporting the pulley, and a suction port near the bearing and the pulley. And a vacuum pump connected to the suction nozzle via a pipe.

[0007]

The present invention will be described below with reference to the drawings.

FIGS. 1A and 1B are a side view and a sectional view of a semiconductor substrate transfer mechanism showing an embodiment of the present invention.
As shown in FIG. 1, this semiconductor substrate transfer mechanism has a suction nozzle 4 disposed below a pulley 1 for feeding a belt 2 and a bearing 8 for rotating the pulley 1, and a suction pipe 4 is provided between these suction nozzles 4 through flexible pipes 5. That is, the vacuum pump 6 is connected. Otherwise, it is the same as the conventional example.

Next, the operation of the semiconductor substrate transfer mechanism will be described. First, the pulley 1 rotates, the belt 2 is fed in one direction, and the wafer 3 is also fed by the frictional force with the belt 2. At this time, dust is generated due to friction between the pulley 1 and the conveyor belt 2 and friction between the pulley 1 and the bearing 8.
However, the vacuum pump 6 is constantly operating, and a flow of air indicated by an arrow is generated near the bearing 8 and the pulley 1. Due to this air flow, dust is forcibly sucked into the suction nozzle 4 without drifting in the air.

[0010]

As described above, according to the present invention, a pulley for driving a belt on which a wafer, which is a semiconductor substrate, is placed and a suction nozzle for vacuuming the suction port toward the lower portion in the vicinity of the bearing are provided. Since an air flow flowing downward is formed and dust can be collected without drifting in the air, there is an effect that dust is not attached to the wafer.

[Brief description of drawings]

FIG. 1 is a side view and a sectional view of a semiconductor substrate transfer mechanism showing an embodiment of the present invention.

[Explanation of symbols]

 1 Pulley 2 Belt 3 Wafer 4 Suction Nozzle 5 Piping 6 Vacuum Pump 8 Bearing

Claims (1)

[Claims] 1. A belt on which a semiconductor substrate is placed, a pulley for feeding the belt, a bearing for supporting the pulley, a suction nozzle arranged near the bearing and the pulley with a suction port facing upward, A semiconductor substrate transfer mechanism comprising: a suction nozzle and a vacuum pump connected via a pipe.