JPS63178037U - - Google Patents
Info
- Publication number
- JPS63178037U JPS63178037U JP1987068783U JP6878387U JPS63178037U JP S63178037 U JPS63178037 U JP S63178037U JP 1987068783 U JP1987068783 U JP 1987068783U JP 6878387 U JP6878387 U JP 6878387U JP S63178037 U JPS63178037 U JP S63178037U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- casing
- filled
- case
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 238000007789 sealing Methods 0.000 claims abstract 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims abstract 2
- 229910052708 sodium Inorganic materials 0.000 claims abstract 2
- 239000011734 sodium Substances 0.000 claims abstract 2
- 239000004809 Teflon Substances 0.000 claims 2
- 229920006362 Teflon® Polymers 0.000 claims 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
- Glass Compositions (AREA)
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987068783U JPS63178037U (US07943777-20110517-C00090.png) | 1987-05-07 | 1987-05-07 | |
AT88106925T ATE93117T1 (de) | 1987-05-07 | 1988-04-29 | Dichtungsstruktur fuer ein elektronisches teil. |
DE88106925T DE3883059T2 (de) | 1987-05-07 | 1988-04-29 | Dichtungsstruktur für ein elektronisches Teil. |
EP88106925A EP0289956B1 (en) | 1987-05-07 | 1988-04-29 | Sealing structure for an electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987068783U JPS63178037U (US07943777-20110517-C00090.png) | 1987-05-07 | 1987-05-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63178037U true JPS63178037U (US07943777-20110517-C00090.png) | 1988-11-17 |
Family
ID=13383675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987068783U Pending JPS63178037U (US07943777-20110517-C00090.png) | 1987-05-07 | 1987-05-07 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0289956B1 (US07943777-20110517-C00090.png) |
JP (1) | JPS63178037U (US07943777-20110517-C00090.png) |
AT (1) | ATE93117T1 (US07943777-20110517-C00090.png) |
DE (1) | DE3883059T2 (US07943777-20110517-C00090.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01170929U (US07943777-20110517-C00090.png) * | 1988-05-20 | 1989-12-04 | ||
JP2015112849A (ja) * | 2013-12-13 | 2015-06-22 | オムロン株式会社 | 電子機器 |
CN104914474A (zh) * | 2014-03-14 | 2015-09-16 | 欧姆龙株式会社 | 电子设备 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3435792B2 (ja) * | 1994-04-15 | 2003-08-11 | 株式会社デンソー | シール装置 |
JP3128387U (ja) * | 2006-10-25 | 2007-01-11 | 船井電機株式会社 | 電気機器の電源回路部構造 |
FR2913808B1 (fr) * | 2007-03-16 | 2009-04-24 | Siemens Vdo Automotive Sas | Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive |
DE202016101136U1 (de) * | 2016-03-03 | 2017-06-09 | Tridonic Gmbh & Co Kg | Elektronisches Bauteil |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60179236A (ja) * | 1984-02-27 | 1985-09-13 | Nippon Valqua Ind Ltd | 四フツ化エチレン樹脂多孔質体の製造方法 |
JPS60199032A (ja) * | 1984-03-23 | 1985-10-08 | Asahi Organic Chem Ind Co Ltd | フツ素樹脂接着体 |
JPS6215738B2 (US07943777-20110517-C00090.png) * | 1981-11-04 | 1987-04-09 | Mitsubishi Jukogyo Kk |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3383565A (en) * | 1966-05-13 | 1968-05-14 | Gen Electric | Packaging of electrical components |
US4600969A (en) * | 1984-07-06 | 1986-07-15 | Hendrickson Max S | Protective apparatus for encapsulating electrical circuits |
US4552626A (en) * | 1984-11-19 | 1985-11-12 | Michael Landney, Jr. | Metal plating of polyamide thermoplastics |
DE3726357A1 (de) * | 1987-08-07 | 1989-02-16 | Siemens Ag | Epoxidharzverguss mit geringem schrumpfdruck und hohem isolationswiderstand fuer den verguss von elektrischen bauteilen |
-
1987
- 1987-05-07 JP JP1987068783U patent/JPS63178037U/ja active Pending
-
1988
- 1988-04-29 AT AT88106925T patent/ATE93117T1/de not_active IP Right Cessation
- 1988-04-29 DE DE88106925T patent/DE3883059T2/de not_active Expired - Fee Related
- 1988-04-29 EP EP88106925A patent/EP0289956B1/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6215738B2 (US07943777-20110517-C00090.png) * | 1981-11-04 | 1987-04-09 | Mitsubishi Jukogyo Kk | |
JPS60179236A (ja) * | 1984-02-27 | 1985-09-13 | Nippon Valqua Ind Ltd | 四フツ化エチレン樹脂多孔質体の製造方法 |
JPS60199032A (ja) * | 1984-03-23 | 1985-10-08 | Asahi Organic Chem Ind Co Ltd | フツ素樹脂接着体 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01170929U (US07943777-20110517-C00090.png) * | 1988-05-20 | 1989-12-04 | ||
JP2015112849A (ja) * | 2013-12-13 | 2015-06-22 | オムロン株式会社 | 電子機器 |
CN104914474A (zh) * | 2014-03-14 | 2015-09-16 | 欧姆龙株式会社 | 电子设备 |
Also Published As
Publication number | Publication date |
---|---|
DE3883059D1 (de) | 1993-09-16 |
DE3883059T2 (de) | 1994-04-07 |
EP0289956B1 (en) | 1993-08-11 |
ATE93117T1 (de) | 1993-08-15 |
EP0289956A2 (en) | 1988-11-09 |
EP0289956A3 (en) | 1990-03-07 |
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