JPS63177045U - - Google Patents
Info
- Publication number
- JPS63177045U JPS63177045U JP1987066674U JP6667487U JPS63177045U JP S63177045 U JPS63177045 U JP S63177045U JP 1987066674 U JP1987066674 U JP 1987066674U JP 6667487 U JP6667487 U JP 6667487U JP S63177045 U JPS63177045 U JP S63177045U
- Authority
- JP
- Japan
- Prior art keywords
- flexible insulating
- insulating film
- bonding portion
- lead bonding
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987066674U JPS63177045U (US07576130-20090818-C00114.png) | 1987-05-01 | 1987-05-01 | |
| EP88106849A EP0289026B1 (en) | 1987-05-01 | 1988-04-28 | External circuit connecting method and packaging structure |
| DE3852563T DE3852563T2 (de) | 1987-05-01 | 1988-04-28 | Verfahren zum Anschliessen eines externen Schaltkreises und Verpackungsstruktur. |
| US07/463,486 US5042919A (en) | 1987-05-01 | 1990-01-11 | External-circuit connecting and packaging structure |
| US07/483,312 US5019201A (en) | 1987-05-01 | 1990-02-21 | External-circuit connecting method and packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987066674U JPS63177045U (US07576130-20090818-C00114.png) | 1987-05-01 | 1987-05-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63177045U true JPS63177045U (US07576130-20090818-C00114.png) | 1988-11-16 |
Family
ID=30904901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987066674U Pending JPS63177045U (US07576130-20090818-C00114.png) | 1987-05-01 | 1987-05-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63177045U (US07576130-20090818-C00114.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0414233A (ja) * | 1990-05-07 | 1992-01-20 | Kaijo Corp | ボンディング装置 |
-
1987
- 1987-05-01 JP JP1987066674U patent/JPS63177045U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0414233A (ja) * | 1990-05-07 | 1992-01-20 | Kaijo Corp | ボンディング装置 |
