JPS63177043U - - Google Patents
Info
- Publication number
- JPS63177043U JPS63177043U JP1987066675U JP6667587U JPS63177043U JP S63177043 U JPS63177043 U JP S63177043U JP 1987066675 U JP1987066675 U JP 1987066675U JP 6667587 U JP6667587 U JP 6667587U JP S63177043 U JPS63177043 U JP S63177043U
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- film carrier
- etching
- protruding
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000011888 foil Substances 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987066675U JPS63177043U (ro) | 1987-05-01 | 1987-05-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987066675U JPS63177043U (ro) | 1987-05-01 | 1987-05-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63177043U true JPS63177043U (ro) | 1988-11-16 |
Family
ID=30904903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987066675U Pending JPS63177043U (ro) | 1987-05-01 | 1987-05-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63177043U (ro) |
-
1987
- 1987-05-01 JP JP1987066675U patent/JPS63177043U/ja active Pending