JPS6317615B2 - - Google Patents
Info
- Publication number
- JPS6317615B2 JPS6317615B2 JP15919780A JP15919780A JPS6317615B2 JP S6317615 B2 JPS6317615 B2 JP S6317615B2 JP 15919780 A JP15919780 A JP 15919780A JP 15919780 A JP15919780 A JP 15919780A JP S6317615 B2 JPS6317615 B2 JP S6317615B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated paper
- fiberboard
- wood fiberboard
- wood
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000123 paper Substances 0.000 claims description 38
- 239000011094 fiberboard Substances 0.000 claims description 37
- 239000002023 wood Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 14
- 230000005484 gravity Effects 0.000 claims description 13
- 229920002522 Wood fibre Polymers 0.000 claims description 8
- 239000002025 wood fiber Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000011101 paper laminate Substances 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Description
【発明の詳細な説明】
本発明は、表面に樹脂含浸紙が積層固着された
樹脂含浸紙積層木質繊維板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a resin-impregnated paper-laminated wood fiberboard having resin-impregnated paper laminated and fixed on the surface thereof.
従来、合板等の板状物表面に、加熱圧締により
樹脂含浸紙を一体に積層固着した化粧板等の樹脂
含浸紙積層板はよく知られている。 BACKGROUND ART Conventionally, resin-impregnated paper laminates such as decorative boards, in which resin-impregnated paper is integrally laminated and fixed to the surface of a plate-like object such as plywood by heat pressing, are well known.
一方、第２図に示すように、樹脂含浸紙積層木
質繊維板１１に関しては、木質繊維を主原料とす
る組成物を、例えば、丸網式湿式抄造法等により
抄造し、比重が0.4以下程度の低比重木質繊維マ
ツト状あるいは板状物（以下、これを低比重木質
繊維板と称する。）１２とし、それに、この低比
重木質繊維板１２をホツトプレス等により加熱圧
締して、半硬質繊維板あるいは硬質繊維板１３に
形成し、ついで、この半硬質ないし硬質繊維板１
３の表面に樹脂含浸紙１４を配して加熱圧締し
て、樹脂含浸紙を一体に固着することにより製造
していた。 On the other hand, as shown in FIG. 2, the resin-impregnated paper laminated wood fiberboard 11 is made from a composition whose main raw material is wood fiber, for example, by a circular net wet papermaking method, and has a specific gravity of about 0.4 or less. A low-specific gravity wood fiber pine-like or plate-like material (hereinafter referred to as low-specific gravity wood fiberboard) 12 is formed, and the low-specific gravity wood fiberboard 12 is heated and pressed using a hot press or the like to form semi-rigid fibers. board or hard fiberboard 13, and then this semi-rigid or hard fiberboard 1
The resin-impregnated paper 14 was disposed on the surface of the paper 3 and was heat-pressed to fix the resin-impregnated paper together.
しかしながら、この方法では熱圧プレスが２回
行なわれるなど、工程が繁雑で、生産性が悪く、
コスト高となり、加圧後の繊維板の表面に凹凸が
ある場合、樹脂含浸紙１１の接着性が悪くなる等
の欠点を有している。 However, this method requires complicated steps such as hot-pressing being carried out twice, resulting in poor productivity.
This method has drawbacks such as high cost and poor adhesion of the resin-impregnated paper 11 if the surface of the fiberboard after pressurization is uneven.
本発明は、かかる従来の欠点に鑑みてなされた
もので、その目的は生産効率のよい樹脂含浸紙積
層木質繊維板の製造方法を提供することにある。 The present invention has been made in view of these conventional drawbacks, and its purpose is to provide a method for manufacturing a resin-impregnated paper laminated wood fiberboard with good production efficiency.
次に、本発明に係る方法を第１図を参照しつつ
説明する。 Next, the method according to the present invention will be explained with reference to FIG.
まず、繊維板の製造材料となる木質繊維組成物
であるが、木材片をパルパー等で解繊して得られ
る木質繊維からなり、さらに、この木質繊維に結
合剤として、スターチ、石油樹脂、フエノール樹
脂、尿素樹脂、メラミン樹脂等を添加してもよ
い。そして、前記組成物を丸網式湿式抄造法等に
より抄造乾燥して、比重が0.4以下程度の低比重
木質繊維板２を形成し、その片面または両面に樹
脂含浸紙３を配し、ホツトプレス等の加熱圧締装
置にて加熱圧締して樹脂含浸紙積層木質繊維板１
を形成する。 First, the wood fiber composition used as a manufacturing material for fiberboard is made of wood fibers obtained by defibrating wood pieces with a pulper, etc., and is further added with starch, petroleum resin, phenol, etc. as a binder to this wood fiber. Resins, urea resins, melamine resins, etc. may be added. Then, the composition is formed into a paper using a circular net wet forming method or the like and dried to form a low specific gravity wood fiberboard 2 having a specific gravity of about 0.4 or less, and a resin-impregnated paper 3 is placed on one or both sides of the wood fiber board 2, which is then hot pressed or the like. Resin-impregnated paper laminated wood fiber board 1
form.
ここで、樹脂含浸紙とは、ジアリルフタレート
樹脂含浸紙、メラミン樹脂含浸紙、グアナミン樹
脂含浸紙、不飽和ポリエステル樹脂含浸紙、フエ
ノール樹脂含浸紙、エポキシ樹脂含浸紙等のこと
で、樹脂含浸用の紙には、印刷紙等の通常の紙の
他に布、不織布等を含むものである。 Here, the resin-impregnated paper refers to diallylphthalate resin-impregnated paper, melamine resin-impregnated paper, guanamine resin-impregnated paper, unsaturated polyester resin-impregnated paper, phenolic resin-impregnated paper, epoxy resin-impregnated paper, etc. Paper includes ordinary paper such as printing paper, as well as cloth, nonwoven fabric, and the like.
また、前記加熱圧締条件は、樹脂含浸紙の樹脂
を溶融させて、繊維板表面に融着硬化させるとと
もに、低比重繊維板を圧縮高比重化させることの
できるもので、加熱条件としては130〜200℃、プ
レス圧力５〜50Kg／cm2であるが、樹脂含浸紙の種
類、木質繊維板の所望密度等に応じて最適な条件
を設定すればよい。 The heating conditions are such that the resin in the resin-impregnated paper can be melted and cured by fusion on the surface of the fiberboard, and the low-density fiberboard can be compressed to a high specific gravity. ~200° C. and a press pressure of 5 to 50 kg/cm 2 , but the optimum conditions may be set depending on the type of resin-impregnated paper, the desired density of the wood fiberboard, etc.
なお、加熱温度が200℃を越える高温になると、
含浸紙の紙質やインクが変質して化粧性を損なう
ことがあるので、加熱温度は200℃以下で、好ま
しくは180℃以下が好ましい。また、前記加熱圧
締条件の中で低温、低圧側の条件下では厚みの大
なる半硬質繊維板が得られ、高温、高圧側の条件
下では硬質繊維板が得られる。なお、半硬質繊維
板を得る場合に樹脂等の結合剤を添加したものは
強度向上が著しい。 In addition, if the heating temperature reaches a high temperature exceeding 200℃,
Since the paper quality and ink of the impregnated paper may change in quality and the cosmetic properties may be impaired, the heating temperature is preferably 200°C or lower, preferably 180°C or lower. Further, among the heat pressing conditions, a semi-rigid fiberboard with a large thickness is obtained under the conditions on the low temperature and low pressure side, and a hard fiberboard is obtained under the conditions on the high temperature and high pressure side. In addition, when obtaining a semi-rigid fiberboard, the strength is significantly improved when a binder such as a resin is added.
前記加熱圧締により、低比重木質繊維板は、硬
質あるいは半硬質の繊維板に形成されるととも
に、樹脂含浸紙が溶融硬化し、前記繊維板に一体
固着され、樹脂含浸紙積層木質繊維板が出来上が
る。 By the heat pressing, the low specific gravity wood fiberboard is formed into a hard or semi-rigid fiberboard, and the resin-impregnated paper is melted and hardened to be integrally fixed to the fiberboard, and the resin-impregnated paper laminated wood fiberboard is formed. It's done.
次に、本方法による樹脂浸紙積層木質繊維板の
製造結果について説明する。 Next, the results of manufacturing a resin-impregnated paper laminated wood fiberboard by this method will be explained.
湿式抄造法により厚さ９mmの木質繊維板を得、
これを乾燥して比重0.25のものを得た。この表面
に樹脂含有率53％のDAP含浸紙を配し温度180
℃、圧力40Kg／cm2のもとで10分間加熱圧締し、厚
さ３mm、比重0.75のDAP貼繊維板を得た。木質
繊維板自体は表裏にかなりの凹凸を有していた
が、プレス後の状態は表裏共平滑なものであつ
た。 A 9mm thick wood fiberboard was obtained using the wet papermaking method.
This was dried to obtain a product with a specific gravity of 0.25. DAP-impregnated paper with a resin content of 53% is placed on this surface and the temperature is 180.
C. and a pressure of 40 kg/cm 2 for 10 minutes to obtain a DAP-bound fiberboard with a thickness of 3 mm and a specific gravity of 0.75. The wood fiberboard itself had considerable unevenness on the front and back, but after pressing, both the front and back were smooth.
以上の説明より明らかなように、本発明によれ
ば、低比重木質繊維板の加熱圧締成形と、樹脂含
浸紙の固着とを同時に行つているため、従来のよ
うに、基板である半硬質ないしは硬質繊維板の表
面に発生した損傷部が、その上に積層固着した樹
脂含浸紙表面にまで現出して、表面外観を損なう
こともなく、安定して美麗な積層固着面を得るこ
とができる。 As is clear from the above description, according to the present invention, the heat-pressing molding of the low-density wood fiberboard and the fixing of the resin-impregnated paper are performed at the same time. Otherwise, the damaged part that occurs on the surface of the hard fiberboard will not appear on the surface of the resin-impregnated paper that is laminated and fixed on top of it, and the surface appearance will not be damaged, and a stable and beautiful laminated and fixed surface can be obtained. .
また、前記同時加工により、工程を簡略化して
生産性を向上させることができる。 Moreover, the simultaneous processing can simplify the process and improve productivity.
さらに、従来法では半硬質ないしは硬質繊維板
を作りこの表面に樹脂含浸紙を貼るため、表面に
凹凸があると含浸紙の接着性が悪くなるのに対し
て、本発明によれば、基材を圧縮して半硬質ない
しは硬質繊維板とするのでボードの圧縮と樹脂の
流動により基材に凹凸があつても型板に追従して
接着できる。 Furthermore, in the conventional method, a semi-rigid or hard fiberboard is made and resin-impregnated paper is pasted on the surface of the board, so if the surface is uneven, the adhesion of the impregnated paper deteriorates. Since it is compressed to form a semi-rigid or hard fiberboard, even if the base material has irregularities due to the compression of the board and the flow of the resin, it can be bonded by following the template.
その他、基板に凹凸模様を付けたり、立体成型
する場合にも適用可能である等の効果を有する。
すなわち、半硬質または硬質繊維板では高比重の
ために成型性が悪く無理して成型すると破断す
る。 In addition, it has the advantage that it can be applied to cases where a concavo-convex pattern is formed on a substrate or when three-dimensional molding is performed.
That is, semi-rigid or hard fiberboard has poor moldability due to its high specific gravity and will break if forced to mold it.
第１図は本発明に係る方法を示す工程図、第２
図は従来の方法を示す工程図である。
１……樹脂含浸紙積層繊維板、２……低比重木
質繊維板、３……樹脂含浸紙。
FIG. 1 is a process diagram showing the method according to the present invention, FIG.
The figure is a process diagram showing a conventional method. 1...Resin-impregnated paper laminated fiberboard, 2...Low specific gravity wood fiberboard, 3...Resin-impregnated paper.
Claims (1)
て低比重木質繊維板に形成し、この低比重木質繊
維板の片面または両面に熱硬化性樹脂含浸紙を配
したのち130〜180℃、５〜50Kg／cm2の条件下で加
熱圧締成形して、この木質繊維板を圧縮成形する
と同時に、樹脂含浸紙を一体に固着させることを
特徴とする樹脂含浸紙積層木質繊維板の製造方
法。 ２ 低比重木質繊維板を形成するに際し、適量の
結合剤を添加して抄造することを特徴とする特許
請求の範囲第１項に記載の樹脂含浸紙積層木質繊
維板の製造方法。[Scope of Claims] 1 A composition whose main raw material is wood fiber is formed into a low-density wood fiberboard by papermaking and drying, and a thermosetting resin-impregnated paper is arranged on one or both sides of the low-density wood fiberboard. A resin-impregnated paper laminate characterized in that the wood fiberboard is then compression-molded by heating under conditions of 130 to 180°C and 5 to 50 kg/ cm2 , and at the same time, the resin-impregnated paper is fixed together. Method for manufacturing wood fiberboard. 2. The method for producing a resin-impregnated paper laminated wood fiberboard according to claim 1, characterized in that when forming the low specific gravity wood fiberboard, an appropriate amount of a binder is added during papermaking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15919780A JPS5782044A (en) | 1980-11-11 | 1980-11-11 | Manufacture of resin impregnated paper laminated woody fiber board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15919780A JPS5782044A (en) | 1980-11-11 | 1980-11-11 | Manufacture of resin impregnated paper laminated woody fiber board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5782044A JPS5782044A (en) | 1982-05-22 |
| JPS6317615B2 true JPS6317615B2 (en) | 1988-04-14 |
Family
ID=15688437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15919780A Granted JPS5782044A (en) | 1980-11-11 | 1980-11-11 | Manufacture of resin impregnated paper laminated woody fiber board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5782044A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0515403A (en) * | 1991-07-05 | 1993-01-26 | Nobuhiro Shinohara | Finger ring |
| JPH071807U (en) * | 1994-06-24 | 1995-01-13 | 信博 篠原 | Ring |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01288404A (en) * | 1988-05-16 | 1989-11-20 | Kasai Kogyo Co Ltd | Manufacture of core material for trimming |
-
1980
- 1980-11-11 JP JP15919780A patent/JPS5782044A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0515403A (en) * | 1991-07-05 | 1993-01-26 | Nobuhiro Shinohara | Finger ring |
| JPH071807U (en) * | 1994-06-24 | 1995-01-13 | 信博 篠原 | Ring |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5782044A (en) | 1982-05-22 |
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