JPS63176123A - Runnerless injection molding equipment - Google Patents
Runnerless injection molding equipmentInfo
- Publication number
- JPS63176123A JPS63176123A JP624887A JP624887A JPS63176123A JP S63176123 A JPS63176123 A JP S63176123A JP 624887 A JP624887 A JP 624887A JP 624887 A JP624887 A JP 624887A JP S63176123 A JPS63176123 A JP S63176123A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- heat
- heated
- heating
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001746 injection moulding Methods 0.000 title claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 238000002347 injection Methods 0.000 claims abstract description 6
- 239000007924 injection Substances 0.000 claims abstract description 6
- 238000005338 heat storage Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 abstract description 16
- 229920005989 resin Polymers 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 4
- 238000009825 accumulation Methods 0.000 abstract 3
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野〕
この発明は、キャビティに通ずるゲート部の加熱を金型
内に設けた熱源を利用して高精度な成形加工を行うよう
にしたランナーレス射出成形装置に関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention is a runnerless injection method that uses a heat source provided in the mold to heat the gate portion leading to the cavity to perform high-precision molding. Regarding molding equipment.
(従来の技術〕
従来、この種のホットランナー方式と呼ばれるランナー
レス射出成形装置は、ゲート部を1m熱するものとして
本発明者が開発した商標名スピアシステムが知られてい
る。このスピアシステムは、ゲート部を内部または外部
よりヒータにより局部的に加熱することによりゲート部
の溶融樹脂の固化、溶融の切替操作によって精密成形を
行うことができるもので原料樹脂の無駄なスプルーラン
ナーを無くしてランナー方式と同様な高精度成形か可能
なシステムとして国の内外で高く1け値され−Cいる。(Prior Art) Conventionally, this type of runnerless injection molding apparatus called a hot runner method is known as the Spear System, a trademark developed by the present inventor, which heats the gate part by 1 m. By locally heating the gate part with a heater from the inside or outside, the molten resin in the gate part can be solidified, and precision molding can be performed by switching the melting operation, eliminating the need for sprue runners that waste raw material resin. It is highly valued both domestically and internationally as a system capable of high-precision molding similar to the -C method.
このようなゲート部の加熱手段に対して、従来のような
ヒータを用いることは、高積度の加工と、コスト高を避
けることはできず、しかも射出成形操作に関連してヒー
タの温度を制御する時は、コントローラの附設が不可欠
となり、経済的問題を除いて高精密なランナーレス射出
成形装置を提イJ(することは極めて困難であった。Using a conventional heater as a heating means for such a gate part cannot avoid high-volume processing and high costs, and moreover, it is difficult to control the temperature of the heater in connection with injection molding operations. For control purposes, it became essential to install a controller, and it was extremely difficult to provide a high-precision runnerless injection molding machine except for economical reasons.
C問題点を解決するための手段〕
この発明は以上の点に着目して成されたもので、従来一
般に用いられている原料可塑化手段。Means for Solving Problem C] The present invention has been made by focusing on the above points, and is a means for plasticizing raw materials that has been commonly used in the past.
射出成形手段、金型構成などをそのまま利用し面記金型
内に設けられるカートリッジヒータなどの加熱手段で加
熱される金型が保有する熱エネルギーな貯熱部にたくね
え、ゲート部に形成した加熱空間に対してピストンなど
の加圧手段によって熱流路を介して供給してゲート部を
局部的に加熱することによって上記問題点を解決した。Utilizing the injection molding means, mold structure, etc. as is, the mold is heated by a heating means such as a cartridge heater installed in the surface mold, and the thermal energy stored in the mold is stored in the heat storage part, and is formed in the gate part. The above problem was solved by locally heating the gate portion by supplying heat to the heating space via a heat flow path using a pressurizing means such as a piston.
こjにより高価なコントローラや、高蹟度、高価なゲー
ト部の加熱手段が省略でき、きわめて簡mな構成によっ
て安価なランナーレス射出成形装置を提供できるもので
ある。This makes it possible to omit an expensive controller and a high-temperature, expensive heating means for the gate portion, making it possible to provide an inexpensive runnerless injection molding apparatus with an extremely simple configuration.
原料可塑化手段によって得られランナー部に供給される
熱溶融された原料は、射出成形手段によりてゲート部を
通りキャビティ内に必要量の溶融樹脂を充填して成形加
工される。The hot melted raw material obtained by the raw material plasticizing means and supplied to the runner section is molded by injection molding means by filling a required amount of molten resin into a cavity through a gate section.
ところで、ゲート部には熱空間が形成され金型の保有す
る熱エネルギーを貯熱部より加圧手段により熱流路を経
て、瞬間にしかも効率良く供給されるので、ゲート部内
の原料樹脂は、ゲート部分の温度状態に応じて固化、半
固化、溶融の相変化を呈し所謂ゲートの開閉という状態
を感度よ・(操作できる。By the way, a thermal space is formed in the gate section, and the thermal energy held by the mold is instantly and efficiently supplied from the heat storage section through the heat flow path by pressurizing means, so that the raw resin in the gate section is Depending on the temperature of the part, it exhibits a phase change of solidification, semi-solidification, and melting, and can be operated with sensitivity to open and close the so-called gate.
したがっ°C1射出成形の操作の都度ゲート部内の原料
樹脂の温度制御を加圧手段の適切な制御によって有効に
行うことができ、これによりキャビ □ティ内への原
料樹脂の射出成形操作を確実にしかもゲート部よりの不
自然な鼻たれ現象を防いで高精度の射出成形を行うこと
ができる。Therefore, it is possible to effectively control the temperature of the raw resin inside the gate section each time a °C1 injection molding operation is performed by appropriately controlling the pressurizing means, thereby ensuring the injection molding operation of the raw resin into the cavity. Furthermore, it is possible to perform highly accurate injection molding by preventing the unnatural nose dripping phenomenon from the gate portion.
なを、ゲート部の加熱空間で熱交換された流体は、金型
相互のエアギャップなど通って支障なく外部に排出され
る。Second, the fluid that has undergone heat exchange in the heating space of the gate part passes through the air gap between the molds and is discharged to the outside without any problem.
以下に、この発明の実施例を図面と共に説明する。 Examples of the present invention will be described below with reference to the drawings.
1は、原料の熱可塑化手段、2は溶融樹脂の射出成形1
段、3は金型、ことに固定金型4に形成される湯道、5
は二以上の射出流路を形成するマニホールドで、必要数
のカートリッジヒータのような加熱手段6が必要個処に
設けられている。1 is a means for thermoplasticizing raw materials, 2 is an injection molding method for molten resin 1
Step 3 is a runner formed in a mold, especially a fixed mold 4;
is a manifold forming two or more injection channels, and a necessary number of heating means 6 such as cartridge heaters are provided at necessary locations.
7はマニホールド5とキャビティ8に通ずる中間金型9
間に配設されるランナー加熱手段で、管環状の支持ホル
ダー10内に収容配設される。7 is an intermediate mold 9 that communicates with the manifold 5 and the cavity 8
A runner heating means is disposed therebetween, and is accommodated in a tube-shaped support holder 10.
ところで、このランナー加熱手段7は格別特定する必要
はないが、ヒータとか高周波電磁誘導コイルのように自
己発熱型のものと熱伝導流体を充填したヒートバイブな
どの熱依存型とを選択して用いることができる。自己発
熱型ではコントローラを必要とする場合があるが熱依存
型てはコントローラは全く不用である。8aは可動金型
。Incidentally, the runner heating means 7 does not need to be particularly specified, but it is possible to select and use a self-heating type such as a heater or a high-frequency electromagnetic induction coil, or a heat-dependent type such as a heat vibrator filled with heat transfer fluid. be able to. Self-heating types may require a controller, but heat-dependent types do not require a controller at all. 8a is a movable mold.
この実施例では熱依存型のヒートパ、イブを用いており
、全体か二重パイプの管環状に形成され、所謂湯道3の
−・部として所望径R,の直線りの孔に相当するランナ
ー部11が形成されている。In this embodiment, a heat-dependent heat pump and eve are used, and the runner is formed in the shape of a whole or double pipe ring, and corresponds to a straight hole with a desired diameter R as the part of the so-called runner 3. A portion 11 is formed.
12は、前記ランナー加熱手段7と連接さねキャビティ
8と連通ずるゲート部を示しこのゲート部の外周に加熱
空間Hが形成され、さらにその基部には、環状鍔13を
有し、ヒートバイブの先端段部14と係合しており、狭
小テーパ一部15から前記径R1よりも小さい径R2の
ケート孔16を経て、さらにテーパ一部17を経てキャ
ビティ8のゲート16aを開孔している。そして前記ラ
ンナー部11とゲート部12とが同一軸線上、すなわち
同−直、tIIbに配設されている。なを、このゲート
部12は熱伝導の良い銅また、銅・ベリラムなどの金属
その他の材料で形成するのが好ましい。Reference numeral 12 denotes a gate portion that communicates with the runner heating means 7 and the connecting tongue cavity 8, and a heating space H is formed on the outer periphery of this gate portion, and an annular collar 13 is provided at the base of the gate portion, and a heat vibrator is provided. It engages with the tip step portion 14, and opens the gate 16a of the cavity 8 through the narrow taper portion 15, through the gate hole 16 having a diameter R2 smaller than the diameter R1, and further through the taper portion 17. . The runner section 11 and the gate section 12 are disposed on the same axis, that is, on the same axis, tIIb. Preferably, the gate portion 12 is made of copper, a metal such as copper, beryllum, or other material having good thermal conductivity.
I8は、前記ランナー加熱手段7とゲート部l2を支持
する前記支持ホルダー10の外周に配設さ第1て、前記
加熱空間Hも形成できる外周固定体で、中間金型9の位
置決めリング19により硬固に支持されている。I8 is an outer circumferential fixed body that is disposed on the outer circumference of the support holder 10 that supports the runner heating means 7 and the gate portion l2, and can also form the heating space H, and is fixed by the positioning ring 19 of the intermediate mold 9. solidly supported.
20は2等位置決めリング19.外周固定体18などと
中間金型9との間に形成されるエアギャップを示す。20 is the second positioning ring 19. An air gap formed between the outer peripheral fixing body 18 and the intermediate mold 9 is shown.
21は金型、ことにマニホールド5に設けた貯熱部で、
中空状のシリンダー構造を備えピストン22を慴動自在
に配設して例えばエアシリンダなどの制御手段23によ
り加熱空気の加圧手段24を形成している。25はこの
貯熱部21より+iif記ケート部12の加熱空間Hに
通ずる加熱空気の通路すなわち熱流路でマニホールド5
の通路25aと支持ホルダー10と外周固定体18に穿
った通路25bとによって構成され、加熱空間Hの排出
側の通路26は、外周固定体18を軽でエアギャップ2
0と通じている。27は可動金型。21 is a heat storage part provided in the mold, especially the manifold 5;
It has a hollow cylinder structure, a piston 22 is movably disposed therein, and a control means 23 such as an air cylinder forms a pressurizing means 24 for heated air. Reference numeral 25 denotes a heated air passageway, that is, a heat flow path leading from the heat storage section 21 to the heating space H of the cage section 12 described in +iif.
The passage 25a on the discharge side of the heating space H is formed by the passage 25a formed in the support holder 10 and the passage 25b bored in the outer peripheral fixed body 18.
It communicates with 0. 27 is a movable mold.
以上の構成に基づいて、作用を説明する。The operation will be explained based on the above configuration.
まず、原料の熱6f塑化手段lによって用いる原料を溶
融して射出成形可能とすると共に金型ことに固定金型4
のマニホールド5に配設した多数のヒータ6の熱エネル
ギーを、これと衝接する支持ホルダー10に伝達し、こ
の支持ホルダー10の熱伝導を受けてヒートパイプで構
成されるランナー加熱手段7を必要な温度に加熱させて
置く。First, the raw material to be used is melted by heat 6f plasticizing means l to make it possible to be injection molded, and a mold 4 is fixed to the mold.
The thermal energy of a large number of heaters 6 disposed in a manifold 5 is transmitted to a support holder 10 that collides with the manifold 5, and the runner heating means 7 consisting of a heat pipe is heated as needed by receiving heat conduction from the support holder 10. Heat it up to temperature.
そして併せて、このランナー加熱手段7と接触している
別部材のゲート部12に対しても必要な熱エネルギーが
供給される。At the same time, the necessary thermal energy is also supplied to the gate portion 12, which is a separate member and is in contact with the runner heating means 7.
一方、マニホールド5には貯熱部21が形成されシリン
ダー状の中空室が形成されているので、核部21の空気
は、マニホールド5のヒータ6で加熱されて温度は上昇
している。On the other hand, since the heat storage part 21 is formed in the manifold 5 and a cylindrical hollow chamber is formed, the air in the core part 21 is heated by the heater 6 of the manifold 5 and its temperature is increased.
このような状態において、射出成形手段2によって、溶
融原料樹脂を射出させると金494内の湯道3内の溶融
樹脂は、ランナー部11.ゲート部12を経て所望量の
溶融樹脂がキャビティ8内に充填される。In such a state, when the molten raw material resin is injected by the injection molding means 2, the molten resin in the runner 3 in the mold 494 flows into the runner section 11. A desired amount of molten resin is filled into the cavity 8 through the gate portion 12 .
この射出成形操作の際、加圧手段24が働き5貯熱部2
1内の加熱空気がエアシリンダーなどの制御手段23に
よってピストン22がストローク運動を呈すると、その
ストローク最に応じた加熱空気か熱流路25を通ってゲ
ート部!2の加熱空間Hに達し該空間Hを加熱しゲート
部12内の原料樹脂を加熱溶融する。During this injection molding operation, the pressurizing means 24 acts on the heat storage section 2.
When the piston 22 exhibits a stroke motion by the control means 23 such as an air cylinder, the heated air in the piston 22 passes through the heat flow path 25 according to the stroke and reaches the gate section! 2, the heating space H is heated, and the raw resin in the gate portion 12 is heated and melted.
加熱空気の流量、加熱時間、加熱温度などによってゲー
ト部12に作用する熱影習を可変調節でき同化、半固化
、溶融などの相変化を自在に行うことができる。The heat radiation acting on the gate portion 12 can be variably adjusted by adjusting the flow rate of heated air, heating time, heating temperature, etc., and phase changes such as assimilation, semi-solidification, and melting can be freely performed.
そして、加圧手段24の作動時、加熱空気の流通過程は
、ゲート部12の加熱空間Hで熱交換され乍ら低温の空
気となって排出側の流路26を経てエアギャップ20よ
り金型4の外部に排気される。When the pressurizing means 24 is activated, the heated air is heated in the heating space H of the gate part 12 and becomes low-temperature air. Exhausted to the outside of 4.
この加圧手段24は、それ自体ヒータなどの発熱機能を
附与しても差支えないが2通常、マニホールド5の保熱
エネルギーで十分間に合せることかできる。そして一度
加熱空気を吐出させたら、−1復動させ、射出成形操作
と連動させて再度同一ストローク面進運動を行わせて反
覆操作を行わせることができる。This pressurizing means 24 may be provided with a heat generating function such as a heater, but usually the heat retention energy of the manifold 5 is sufficient. Once the heated air is discharged, it can be moved back by -1 and the same stroke plane movement can be performed again in conjunction with the injection molding operation to perform a repeat operation.
その際、当然の事乍ら、キャビディ8内の成形品を取り
出すための型開r+A操作を行うことは勿論である。At that time, it goes without saying that a mold opening r+A operation is performed to take out the molded product inside the cavity 8.
この型開操作において、ゲート部12を加熱させないで
置くことによりゲート孔!(Sa部の原料樹脂を固化さ
せて所謂ゲートを閉塞状態に保持できるので州たれ現象
を防止できる。In this mold opening operation, by leaving the gate portion 12 without heating it, the gate hole is closed. (Since the raw material resin in the Sa part can be solidified and the so-called gate can be kept in a closed state, the sagging phenomenon can be prevented.
また、湯道3のランナー部11およびゲート部12は、
−直線上に形成してあり、抵抗部分がないので射出圧を
著しく小さくでき、しかもエアギャップ20が形成しで
あるため温度の逸散や熱エネルギーの損失が防がれる。Moreover, the runner part 11 and gate part 12 of the runner 3 are
- Since it is formed in a straight line and there is no resistance part, the injection pressure can be significantly reduced, and since the air gap 20 is formed, dissipation of temperature and loss of thermal energy are prevented.
その上、ランナー部11とゲート部12とか別部材で互
いに熱伝導か有効に保たれるように接続しであるためゲ
ート部12の加熱空間Hに作用する熱エネルギーは必要
以上に大きくする必要がなく、金型4のヒータ6の余熱
利用で間に合うという利点をも有する。Moreover, since the runner part 11 and the gate part 12 are connected to each other by separate members so as to effectively maintain heat conduction, it is necessary to make the thermal energy acting on the heating space H of the gate part 12 larger than necessary. There is also an advantage that the remaining heat of the heater 6 of the mold 4 can be used.
(発明の効果)
この発明によれば、ゲート部というきわめて挟少な個処
の加熱手段に、金型の加熱1段の熱を利用し、金型部内
に設けた貯熱部の熱エネルギーを加rE手段によって、
熱流路を介してゲートの加熱空間に圧送して局部的に加
熱するようにしたものであるから、応答性よくゲート部
の加熱操作を行うことができ、ゲート部内の原料樹脂を
加圧手段による加熱空気の圧送状態に応じて同化、半固
化、溶融などの開状態に相変化させて無駄のない高開度
のランナーレス射出成形を行うことができる。(Effects of the Invention) According to the present invention, the heat of one stage of heating the mold is used as a heating means for a very small area called the gate, and the thermal energy of the heat storage part provided in the mold part is heated. By rE means,
Since the heat is pumped into the heating space of the gate through a heat flow path to locally heat it, the heating operation of the gate can be performed with good response, and the raw resin in the gate can be heated by pressurizing means. By changing the phase to an open state such as assimilation, semi-solidification, or melting depending on the pumping state of heated air, it is possible to perform runnerless injection molding with a high opening degree and no waste.
第1図はこの発明に係るランナーレス射出成形装置の一
実施例を示す要部の横断・ト面図、第2図は同上の正面
より見た説明図である。
1・・・・・・原料の熱可塑化手段
2・・・・・・射出成形手段
3・・・−・湯道
4・・・・・・金型
5・・・・・・マニホールド
6−−−−−−ヒータなどの加熱手段
7・・・・・・ランナー加熱手段
10−−−−−・支持ホルダー
11・・・・・・ランナー部
12・・・・・・ゲート部
20・・・・・・エアギャップ
21・・・・・・貯熱部
24・・・・・・加圧手段
25・・・・・・熱流路
H−−−−−−加熱空間FIG. 1 is a cross-sectional top view of essential parts of an embodiment of a runnerless injection molding apparatus according to the present invention, and FIG. 2 is an explanatory view of the same as seen from the front. 1... Raw material thermoplasticization means 2... Injection molding means 3...- Run runner 4... Mold 5... Manifold 6- ----- Heating means such as a heater 7 ... Runner heating means 10 --- Support holder 11 ... Runner section 12 ... Gate section 20 ... ... Air gap 21 ... Heat storage section 24 ... Pressure means 25 ... Heat flow path H --- Heating space
Claims (2)
金型内に設けた湯道を通してランナー部、ゲート部を経
て所望のキャビティ内に射出成形できるようにしたラン
ナーレス射出成形装置であって、前記ゲート部には加熱
空間を形成し、金型内に設けた加熱手段によって得られ
る熱エネルギーを、貯熱部よりピストンなどの加圧手段
を用い熱流路を介して前記加熱空間に移送してゲート部
を局部的に加熱できるようにして成ることを特徴とする
ランナーレス射出成形装置。(1) A runnerless injection molding device that allows thermoplasticized raw materials to be injected into a desired cavity through a runner section and a gate section through a runner provided in a mold using an injection means such as a piston. A heating space is formed in the gate part, and thermal energy obtained by a heating means provided in the mold is transferred from a heat storage part to the heating space via a heat flow path using a pressurizing means such as a piston. A runnerless injection molding apparatus characterized in that the gate part can be locally heated by heating the gate part.
に穿ち、この貯熱部内に間欠的に前後動するピストンを
加圧手段として組み込み、ゲート部の加熱空間と通ずる
熱流路は、ランナー部の外周に配設される支持ホルダー
内に穿設して成ることを特徴とする特許請求の範囲第1
項記載のランナーレス射出成形装置。(2) The heat storage part for thermal energy in the mold is bored into a cylindrical shape, and a piston that moves back and forth intermittently is installed in this heat storage part as a pressurizing means, and the heat flow path communicating with the heating space of the gate part is Claim 1, characterized in that it is formed by being bored in a support holder disposed on the outer periphery of the runner part.
Runnerless injection molding equipment as described in Section 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP624887A JPS63176123A (en) | 1987-01-16 | 1987-01-16 | Runnerless injection molding equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP624887A JPS63176123A (en) | 1987-01-16 | 1987-01-16 | Runnerless injection molding equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63176123A true JPS63176123A (en) | 1988-07-20 |
JPH0466169B2 JPH0466169B2 (en) | 1992-10-22 |
Family
ID=11633189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP624887A Granted JPS63176123A (en) | 1987-01-16 | 1987-01-16 | Runnerless injection molding equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63176123A (en) |
-
1987
- 1987-01-16 JP JP624887A patent/JPS63176123A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0466169B2 (en) | 1992-10-22 |
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