JPS63172149U - - Google Patents

Info

Publication number

JPS63172149U

JPS63172149U JP6564587U JP6564587U JPS63172149U JP S63172149 U JPS63172149 U JP S63172149U JP 6564587 U JP6564587 U JP 6564587U JP 6564587 U JP6564587 U JP 6564587U JP S63172149 U JPS63172149 U JP S63172149U

Authority

JP

Japan

Prior art keywords

gold

mounting base

lead frame

semiconductor device

leads

Prior art date

1987-04-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 4
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
• 229910052737 gold Inorganic materials 0.000 claims description 3
• 239000010931 gold Substances 0.000 claims description 3
• 229910052709 silver Inorganic materials 0.000 claims description 3
• 239000004332 silver Substances 0.000 claims description 3
• 239000002184 metal Substances 0.000 claims description 2
• 229910052751 metal Inorganic materials 0.000 claims description 2
• 238000007747 plating Methods 0.000 claims description 2
• 239000002585 base Substances 0.000 claims 2
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
• 238000002788 crimping Methods 0.000 claims 1

Cited By (2)