JPS63172149U - - Google Patents
Info
- Publication number
- JPS63172149U JPS63172149U JP6564587U JP6564587U JPS63172149U JP S63172149 U JPS63172149 U JP S63172149U JP 6564587 U JP6564587 U JP 6564587U JP 6564587 U JP6564587 U JP 6564587U JP S63172149 U JPS63172149 U JP S63172149U
- Authority
- JP
- Japan
- Prior art keywords
- gold
- mounting base
- lead frame
- semiconductor device
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000002585 base Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 238000002788 crimping Methods 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6564587U JPS63172149U (US07488766-20090210-C00029.png) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6564587U JPS63172149U (US07488766-20090210-C00029.png) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172149U true JPS63172149U (US07488766-20090210-C00029.png) | 1988-11-09 |
Family
ID=30902912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6564587U Pending JPS63172149U (US07488766-20090210-C00029.png) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172149U (US07488766-20090210-C00029.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014099534A (ja) * | 2012-11-15 | 2014-05-29 | Dainippon Printing Co Ltd | リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法 |
| JP2015153987A (ja) * | 2014-02-18 | 2015-08-24 | 株式会社デンソー | モールドパッケージ |
-
1987
- 1987-04-28 JP JP6564587U patent/JPS63172149U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014099534A (ja) * | 2012-11-15 | 2014-05-29 | Dainippon Printing Co Ltd | リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法 |
| JP2015153987A (ja) * | 2014-02-18 | 2015-08-24 | 株式会社デンソー | モールドパッケージ |
