JPS63169800A - Apparatus for processing lead wires of component inserted into board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a lead wire processing device for a board insertion component inserted into a board of, for example, an electric/electronic device. The present invention relates to a processing device for board insertion parts that can detect whether or not it has been inserted.

[Conventional technology]

Generally, after electrical/electronic components with lead wires such as resistors, capacitors, transistors, etc. are inserted into a printed circuit board, etc., the lead wires are bent or cut using processing equipment (hereinafter referred to as cutting). However, during this cutting process, whether or not the lead wire is securely inserted into the board is detected by an electrically conductive means.

A lead wire cutting device is shown in FIG. 6 as a processing device equipped with a conventional electrical conduction means.

In the figure, l is a board with through holes IA and IA, 2 is a capacitor inserted on the upper side of the board 1, and a pair of lead wires 2A and 2A of the capacitor 2 are connected to through holes IA and IA of board l. inserted into the tip of each tip 2 A
1 is adapted to protrude from the bottom of the substrate 1.

Reference numeral 3 constitutes a Riet wire cutting device, and is a hollow chip discharge pipe made of a conductive metal material disposed below the substrate l. A fixed blade 3A for cutting the lead wire 2A together with the cutter blade 5 is provided to protrude inward. The chip discharge pipe 3 is moved up and down below the substrate 1 by a lifting device (not shown).

4 is located midway in the axial direction of the chip discharge pipe 3 and is indicated by an arrow A;
A cutting operation field is rotatably supported in the direction B, and a cutter blade 5 is provided at the upper end of the cutting operation field 4 to engage with the fixed blade 3A of the chip discharge pipe 3 and cut each lead wire 2A. It protrudes laterally.

Reference numeral 6 denotes insertion detection means for detecting whether the lead wire 2A is inserted into the through hole IA of the board l, and one end 7A of the insertion detection means 6 is located near the fixed blade 3A to discharge chips. A conductive wire 7 on one side electrically connected to the pipe 3, a contact terminal 9 protruding toward the inner circumferential side of the chip discharge pipe 3 via an insulating member 8, and an end 10A on one side of the contact terminal 9. The electrically connected other side conductive wire 10 and the other side end 7B of each weekly conductive wire 7.10
, and a detection unit 11 connected to the IOB including a power supply.

The cutting device according to the prior art is configured as described above,
When cutting the lead wire 2A of the capacitor 2 inserted into the board 1, the chip discharge pipe 3 is moved to the board 1 using a lifting device.
After inserting the distal end 2A of the lead wire 2A into the discharge pipe 3, the cutting operation field 4 is rotated in the direction of arrow A to engage the cutter blade 5 and the fixed blade 3A. It looks like this. When cutting, the lead wire 2A is pressed against the fixed blade 3A side by the cutter blade 5, and the chip discharge pipe 3 to which the through-through wire 7 is connected and the other side conductive wire 10
By contacting the contact terminal 9 to which is connected,
As a result of electrical conduction between the respective lead wires 7 and 10, the lead wire 2A is detected by the detection unit 11 to be connected to the through hole I of the substrate 1.
It is designed to detect whether or not it is inserted into A.

[Problem that the invention seeks to solve]

According to the above-mentioned conventional technology, an insulating structure must be adopted in order to assemble the other conductive wire 10 of the detection means 6 to the chip discharge pipe 3, and the structure of the detection means 6 is complicated. This may result in a poor contact between the lead wire 2A and the tip of the other conductive wire 10, or chips from the cut lead wire 2A may be removed from the fixed blade 3A.
This has the disadvantage that it may adhere for some reason between the contact terminal 9 and the contact terminal 9, leading to false detection or short-circuit accidents.

The present invention has been developed in view of the above-mentioned drawbacks of the prior art.The problems to be solved by the present invention are that the structure is simple, and there are no electrical accidents such as poor contact accidents or short-circuit accidents caused by chips. Therefore, it is an object of the present invention to provide a lead wire processing device for board insertion parts that can reduce equipment costs and has excellent reliability.

[Means for solving problems]

Means of the present invention configured to solve the above-mentioned problems includes a support body that receives the lead wire of a board insertion component, and a support body that is rotatably provided on the support body, and a a processing operation field that applies bending or cutting to the lead wire;
A sensor is provided in the processing operation field and detects an impact received by the processing operation field when processing the lead wire.

(Function) A sensor installed in the processing operation area of the lead wire processing equipment detects the impact received by the processing operation area when the lead wire is bent or cut, and the lead wire touches the board. Whether or not the lead wire is inserted is detected without contacting the lead wire.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 1 to 5. Note that the same reference numerals are given to the same components as those of the prior art described above, and the explanation thereof will be omitted.

21 in the figure is a chip discharge pipe constituting the lead wire cutting device of this embodiment, and the chip discharge pipe 21 is made of a hollow cylindrical body with a fixed blade 21A formed at the upper end of the inner peripheral surface. In this respect, it is similar to that in the prior art, but the contact terminal 9 in the prior art is not inserted.

Reference numeral 22 denotes a long cutting field in which a cutter blade 23 is fixed to a tip end 22A in the longitudinal direction, and the proximal end becomes a pushing part 22B, and the cutting field 22 is slightly bent when cutting the lead i2A. It has a certain degree of rigidity. The cutting operation field 22 is pivotally supported on the outer periphery of the chip discharge pipe 21 via a support shaft 24 inserted at a position close to the cutter blade 23 so as to be rotatable in the directions of arrows A and B.

Reference numeral 25 denotes a strain sensor as an insertion detection means according to this embodiment, and the strain sensor 25 is connected to the pushing part 2 of the cutting operation ring 22.
2B and the support shaft 24, and is fixed to the upper surface of the operating rod 22. The strain sensor 25 is connected via wires 26 and 26 to a detection section 27 consisting of an operational amplifier 27A and resistors R1 to R3, which are specifically shown in FIG. It is designed to be detected.

This embodiment is constructed as described above, and the cutting operation ring 22
The cutting process itself, in which the lead wire 2A is cut at N between the fixed blade 21A and the cutter 23 that engage with each other by rotating the lead wire 2A in the direction of arrow A, is not substantially different from that in the prior art. .

According to this embodiment, a strain sensor 25 is provided midway in the longitudinal direction of the cutting operation ring 22, and the strain sensor 25 measures the stress and strain generated in the cutting operation ring 22 due to the impact received when cutting the lead wire 2A. It is configured to detect. As shown in FIGS. 4 and 5, according to the output waveform of the strain sensor 25, if the lead wire 2A is not cut, that is, if the lead wire 2A is not inserted into the through hole IA of the substrate 1, or If the cutter blade 23 misses because the tip end 2A of the inserted wire 2A is bent, the change in voltage will be extremely small as shown by arrow 8 in FIG.

On the other hand, when the cutter blade 23 cuts the lead wire 2A, the voltage changes extremely greatly, as shown by the arrow in FIG. Thus, according to the embodiment, the lead wire 2A is inserted into the through hole IA of the substrate 1 in the correct state,
When the cutter blade 23 reliably cuts the lead wire 2A, the stress strain generated in the cutting operation ring 22 is measured by the strain sensor 2.
5, it is possible to detect whether the lead wire 2A is inserted in the correct state.

Moreover, the strain sensor 25 which is the insertion detection means of the embodiment
According to the invention, insertion into the board 1 can be detected in a non-contact state with respect to the lead wire 2A, thereby reliably preventing accidents such as poor contact and short circuits due to chips in the conventional technology, and dramatically increasing detection accuracy. I can do it.

In this embodiment, the capacitor 2 with a lead wire 2A is taken as an example, but the present invention can be applied to detecting the insertion of various electrical/electronic components having lead wires, such as resistors and diodes. In addition, as an insertion detection means, a strain sensor 2 is used.
For example, a piezoelectric sensor may be used instead of 5.

Further, although this embodiment has been exemplified by a lead wire cutting device that cuts the lead wire 2A, the present invention can also be applied to a processing device that performs bending processing on the lead wire 2A.

(Effects of the Invention) According to the present invention configured as detailed above, the processing operation rod is provided with a sensor that detects the impact received when bending or cutting the lead wire, and Since the presence or absence of the
Reliability can be significantly increased.

[Brief explanation of the drawing]

1 to 5 show one embodiment of the present invention, FIG. 1 is a front view of a lead wire cutting device, and FIG. 2 is a section II in FIG. 1.
-II An enlarged sectional view in the direction of the arrow, FIG. 3 is a circuit diagram configuring the detection means, FIG. 4 is a diagram showing the output waveform of the strain sensor when the lead wire is inserted and when it is not inserted, and FIG. An enlarged diagram of the opening indicated by the arrow in the figure, and FIG. 6 is a front view of a lead wire cutting device according to the prior art. l... Board, 2A... Lead wire, 21... Chip discharge pipe, 22... Cutting operation, 21A... Fixed blade, 2
3... Cutter blade, 25... Strain sensor.

Claims (1)

[Claims] a support body that receives a lead wire of a component to be inserted into a board; a processing operation rod that is rotatably provided on the support body and that bends or cuts the lead wire between the support body; A lead wire processing device for a board insertion component, comprising a sensor provided on a processing operation rod to detect an impact received by the processing operation rod during processing of the lead wire.