JPS63142700A - Electronic component lead cutter - Google Patents
Electronic component lead cutterInfo
- Publication number
- JPS63142700A JPS63142700A JP61288821A JP28882186A JPS63142700A JP S63142700 A JPS63142700 A JP S63142700A JP 61288821 A JP61288821 A JP 61288821A JP 28882186 A JP28882186 A JP 28882186A JP S63142700 A JPS63142700 A JP S63142700A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- cutting device
- electrode
- component lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 238000007740 vapor deposition Methods 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000012212 insulator Substances 0.000 description 18
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910017566 Cu-Mn Inorganic materials 0.000 description 1
- 229910017871 Cu—Mn Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Shearing Machines (AREA)
- Wire Processing (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子部品リード切断装置に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component lead cutting device.
ＩＣなどの電子部品をプリント基板に自動的に挿入する
自動挿入機では、電子部品を挿入した後、挿入状態の良
否を検出、確認するとともにプリント基板裏面に突出る
余剰リードを切断する作業が行なわれる。Automatic insertion machines that automatically insert electronic components such as ICs into printed circuit boards detect and confirm whether the electronic components are inserted properly after inserting them, and also cut off excess leads that protrude from the back of the printed circuit board. It will be done.
これらの作業は一つの工程にまとめて行われることが望
ましいが、これまで別工程で行なわれていた。It is desirable that these operations be carried out in one process, but until now they have been carried out in separate processes.
上述したように電子部品の自動挿入機では挿入、状態の
確認と余剰リードの切断が共に重要な作業となるが、こ
れらは通常別工程で行なわれ単純化がなされていないの
で製造工程が複雑となり、製品のコストに影響を及ぼす
嫌いがあった。As mentioned above, in an automatic electronic component insertion machine, insertion, checking the condition, and cutting off excess leads are both important operations, but these are usually done in separate processes and have not been simplified, making the manufacturing process complicated. , there was a dislike that affected the cost of the product.
本発明の目的は、部品挿入状態のチェックと余剰リード
の切断とを兼用する電子部品リード切断装置を提供する
ことにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component lead cutting device that doubles as checking the state of component insertion and cutting surplus leads.
本発明は、プリント基板に挿入された電子部品の余剰リ
ードを切断する電子部品切断装置において、前記余剰リ
ードを切断するカッターの一方に金属も刃先部を設け、
これと噛合う他方には前記余剰リードと接触する複数の
電極を備える絶縁体の刃先部が設けられ、前記電極には
この電極より前記余剰リードに検出信号を送る検出回路
が接続してあることを特徴とし、リードの有無のチェッ
クや部品定数の測定、およびリードの切断が一台の装置
で行なえるようにして目的の達成を計ったものである。The present invention provides an electronic component cutting device for cutting surplus leads of an electronic component inserted into a printed circuit board, in which a cutter for cutting the surplus leads is provided with a metal cutting edge on one side,
The other side that meshes with this is provided with an insulating cutting edge having a plurality of electrodes that come into contact with the surplus lead, and a detection circuit that sends a detection signal from this electrode to the surplus lead is connected to the electrode. This purpose was achieved by allowing a single device to check the presence or absence of leads, measure component constants, and cut the leads.
、）、本発明の電子部品リード切断装置では、リードを
、７切断するカッターに一方には金属の刃先部を用い、
他方には絶縁体の刃先部に複数の電極を設けたものを用
い、プリント基板の裏面に突出た余剰リードを切断する
とき上記の電極にこのリードが接触するようにし、検出
回路より電極を通して余剰リードに信号電流が流れるよ
うにしであるので、切断する前にリードの挿入状況や取
付は部品の極性および部品定数などをチェックすること
ができ。), In the electronic component lead cutting device of the present invention, a cutter for cutting the lead has a metal cutting edge on one side,
On the other hand, an insulator with multiple electrodes attached to the cutting edge is used, so that when cutting the excess leads protruding from the back of the printed circuit board, the leads come into contact with the above electrodes, and the excess leads are passed through the detection circuit through the electrodes. Since the signal current flows through the leads, it is possible to check the insertion status of the leads, installation, component polarity, component constants, etc. before cutting.
切断作業とチェック作業とを同一工程で行なうことによ
り作業が単純化され製品コストの低下を計ることができ
る。By performing the cutting work and the checking work in the same process, the work can be simplified and product costs can be reduced.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の電子部品リード切断装置の一実施例の
絶縁体を用いるカッターの斜視図を示す。FIG. 1 shows a perspective view of a cutter using an insulator, which is an embodiment of the electronic component lead cutting apparatus of the present invention.
図において１は絶縁体刃先、２は電極で絶縁体刃先１の
先端に設置されている。３は導電片で電極２より取出さ
れる。４は導電片３の端子、５は絶縁体刃先１の母材を
示す。In the figure, 1 is an insulator cutting edge, and 2 is an electrode, which is installed at the tip of the insulating cutting edge 1. 3 is a conductive piece taken out from the electrode 2. Reference numeral 4 indicates a terminal of the conductive piece 3, and reference numeral 5 indicates a base material of the insulator cutting edge 1.
第２図は第１図Ａ部の拡大図を示すもので、絶縁体刃先
１、電極２および導電片３の関係が拡大して示されてい
る。FIG. 2 shows an enlarged view of section A in FIG. 1, and shows the relationship among the insulator cutting edge 1, the electrode 2, and the conductive piece 3 in an enlarged manner.
これらの図で絶縁体刃先１には高強度のジルコニアが用
いられ、母材５にはセラミックスが用いられている。In these figures, high-strength zirconia is used for the insulator cutting edge 1, and ceramics is used for the base material 5.
導電片３は印刷、あるいは蒸着方式により母材５の上に
形成されている。The conductive piece 3 is formed on the base material 5 by printing or vapor deposition.
また電極２は、第３図〜第５図に示すような三つの方式
によって形成されている。Further, the electrode 2 is formed by three methods as shown in FIGS. 3 to 5.
第３図は絶縁体刃先１の断面図を示し、厚さＢの部分を
ＩＣのリードピッチΩに合せて掘削し、ここに電極２を
銀ろう接合、またはＣｕ −Ｍ ｎ接合で形成したもの
である。刃先の幅りはＩＣのリード数を考慮して定めら
れる。Figure 3 shows a cross-sectional view of the insulator cutting edge 1, in which a portion with a thickness of B is excavated in accordance with the IC lead pitch Ω, and an electrode 2 is formed here by silver soldering or Cu-Mn bonding. It is. The width of the cutting edge is determined in consideration of the number of IC leads.
第４図は第３図と同じような絶縁体刃先１の上面にＩＣ
のリードピッチに合せてＱに示す間隔でタングステン蒸
着などの金属蒸着、あるいは厚膜印刷により電極１２を
形成したものである。Figure 4 shows an IC on the top surface of the insulator cutting edge 1 similar to Figure 3.
The electrodes 12 are formed by metal vapor deposition such as tungsten vapor deposition or thick film printing at intervals shown by Q in accordance with the lead pitch of .
第５図は金属刃先１３を絶縁体１４で絶縁し、その上に
第１図と同様に間隔Ｑで電極１５を接合ｔだものである
。In FIG. 5, a metal cutting edge 13 is insulated with an insulator 14, and electrodes 15 are bonded thereon at a distance Q as in FIG. 1.
このようにして製作された刃先を有するカッターを一対
にして用いることにより、センサと切断機能を兼ねた電
子部品切断装置が得られることになる。By using a pair of cutters having blade edges manufactured in this manner, an electronic component cutting device having both a sensor and cutting function can be obtained.
第６図は第１図〜第５図に示されるようなカッター刃先
を用いてリードを切断する場合を示すもので、第１図〜
第５図と同一部分には同一符号を用いている。Figure 6 shows the case where the lead is cut using the cutter edge as shown in Figures 1 to 5.
The same reference numerals are used for the same parts as in FIG. 5.
図において６は金属刃先で、絶縁体刃先１と噛合ってＩ
Ｃ？のり−ド８を切断する。８′はＩＣ７の反対側のリ
ード、９は切断されたリード片である。１０はプリント
基板、１１．１１’は検出回路を示す。検出回路１１．
１１’の一方の端子と金属刃先６は共に接地されている
。In the figure, 6 is a metal cutting edge that meshes with the insulator cutting edge 1.
C? Cut the glue board 8. 8' is a lead on the opposite side of the IC 7, and 9 is a cut lead piece. 10 is a printed circuit board, and 11.11' is a detection circuit. Detection circuit 11.
One terminal of 11' and the metal cutting edge 6 are both grounded.
この実施例の電子部品リード切断装置では、絶縁体刃先
１と金属刃先６とを噛合せて余剰リードを切断する場合
、図に示すようにＩＣ７のリード８はプリント基板１０
に正常に挿入されているが、リード８′の方はプリント
基板１０の間で屈曲して挿入されないような場合が生じ
たとすると、正常に挿入されたリード８に対してリード
８が絶縁体刃先１と金属刃先６の間に挟まれたとき、電
極２と接触するから検出回路１１より導電片３．リード
８．金属刃先６を通る電流■が流れ、検出回路１１はリ
ード８が正常に挿入されていることを判定し、切断指令
を出力してリード８を切断することになる。In the electronic component lead cutting device of this embodiment, when the insulator cutting edge 1 and the metal cutting edge 6 are engaged to cut excess leads, the leads 8 of the IC 7 are connected to the printed circuit board 10 as shown in the figure.
However, if the lead 8' is bent between the printed circuit boards 10 and cannot be inserted, the lead 8 may be inserted against the insulator cutting edge. When the conductive piece 3. Lead 8. A current {circle around (2)} flows through the metal cutting edge 6, and the detection circuit 11 determines that the lead 8 is inserted normally, and outputs a cutting command to cut the lead 8.
一方、リード８′に対しては、絶縁体刃先１の電極と金
属刃先６との間を導通させることができないから検出回
路１１′には電流が流れず挿入不良が判定されることに
なる。On the other hand, with respect to the lead 8', since electrical continuity cannot be established between the electrode of the insulator cutting edge 1 and the metal cutting edge 6, no current flows to the detection circuit 11', and a defective insertion is determined.
電子部品の挿入が良好に行なわれ、両側の絶縁体刃先１
と金属刃先６とが共に電子部品のリードを挟む情態にな
れば、検出回路１１および１１′の動作により、その電
子部品が有極性部品であれば極性を判定し、抵抗、コン
デンサ等の部品であればその定数も測定することができ
るので、設計値との照合を行なうことが可能となる。The electronic parts were inserted well, and the insulator cutting edge 1 on both sides
If the lead of the electronic component is pinched by both the metal cutting edge 6 and the lead of the electronic component, the detection circuits 11 and 11' will operate to determine the polarity of the electronic component if it is a polar component, and if it is a resistor, capacitor, etc. Since the constant, if any, can be measured, it is possible to check it with the design value.
以上、本実施例を用いることにより次のような効果が得
られる。As described above, by using this embodiment, the following effects can be obtained.
（１）プリント基板に挿入される電子部品のり−Ｆ・／
・の挿入状態をチェックする作業と余剰リードの切断作
業とが同一装置で行なえるので製造工程を短縮すること
ができる。(1) Electronic component glue inserted into printed circuit board -F//
The manufacturing process can be shortened because the work of checking the insertion state of the lead and the work of cutting off the excess lead can be performed with the same device.
（２）検出回路で電子部品を検出する場合、リードを直
接圧着して検出するので、光センサ方式などに比べ優れ
た検出精度が得られる。(2) When detecting an electronic component with a detection circuit, the lead is directly crimped and detected, so superior detection accuracy can be obtained compared to an optical sensor method or the like.
（３）検出用の電極はリードを切断する絶縁体刃先と一
体になっているので機構が簡単で広範囲の検出、測定が
可能となる。(3) Since the detection electrode is integrated with the insulator cutting edge that cuts the lead, the mechanism is simple and a wide range of detection and measurement is possible.
本発明によれば、部品挿入状態のチェックと余剰リード
の切断とを兼用する電子部品リード切断装置を提供する
ことができる。According to the present invention, it is possible to provide an electronic component lead cutting device that doubles as checking the component insertion state and cutting surplus leads.
第１図は本発明の電子部品リード切断装置の一実施例の
絶縁体を用いるカッターの斜視図、第２図は第１図のＡ
部拡大図、第３図、第４図および第５図はそれぞれ電極
を銀ろう接合する場合、金属蒸着または厚膜印刷する場
合、および金属刃先と絶縁体を用いる場合の刃先の断面
図、第６図はリード切断時の説明図である。
１・・・絶縁体刃先、２・・・電極、３・・・導電片、
６・・・金属Ｗｉ極、７・・・ＩＣｌ３，８′・・・リ
ード、１０・・・プリント基板、１１．１１’・・・検
出回路。FIG. 1 is a perspective view of a cutter using an insulator in an embodiment of the electronic component lead cutting device of the present invention, and FIG. 2 is a perspective view of a cutter shown in FIG.
3, 4, and 5 are cross-sectional views of the cutting edge when electrodes are bonded with silver solder, when metal vapor deposition or thick film printing is performed, and when using a metal cutting edge and an insulator, respectively. FIG. 6 is an explanatory diagram at the time of lead cutting. 1... Insulator cutting edge, 2... Electrode, 3... Conductive piece,
6... Metal Wi pole, 7... ICl3, 8'... Lead, 10... Printed circuit board, 11.11'... Detection circuit.
Claims (1)
切断する電子部品リード切断装置において、前記余剰リ
ードを切断するカッターの一方に金属の刃先部を設け、
これと噛合う他方には前記余剰リードと接触する複数の
電極を備える絶縁体の刃先部が設けられ、前記電極には
該電極より前記余剰リードに検出信号を送る検出回路が
接続してあることを特徴とする電子部品リード切断装置
。 ２、前記電極が銀ろう付および接着により形成されてい
る特許請求の範囲第１項記載の電子部品リード切断装置
。 ３、前記電極が金属蒸着により形成されている特許請求
の範囲第１項記載の電子部品リード切断装置。 ４、前記電極が厚膜印刷により形成されている特許請求
の範囲第１項記載の電子部品リード切断装置。 ５、前記電極が被切断物と同じ間隔で配列されている特
許請求の範囲第１項記載の電子部品リード切断装置。 ６、前記検出回路は前記プリント基板に挿入されるリー
ドの有無をチェックする機能を有する特許請求の範囲第
１項記載の電子部品リード切断装置。 ７、前記検出回路は前記プリント基板に挿入される有極
部品の極性を判定する機能を有する特許請求の範囲第１
項記載の電子部品リード切断装置。 ８、前記検出回路は前記電子部品の定数を測定する機能
を有する特許請求の範囲第１項記載の電子部品リード切
断装置。[Claims] 1. In an electronic component lead cutting device for cutting surplus leads of an electronic component inserted into a printed circuit board, one of the cutters for cutting the surplus leads is provided with a metal cutting edge,
The other side that meshes with this is provided with an insulating cutting edge having a plurality of electrodes that come into contact with the surplus lead, and a detection circuit that sends a detection signal from the electrode to the surplus lead is connected to the electrode. An electronic component lead cutting device featuring: 2. The electronic component lead cutting device according to claim 1, wherein the electrode is formed by silver soldering and adhesion. 3. The electronic component lead cutting device according to claim 1, wherein the electrode is formed by metal vapor deposition. 4. The electronic component lead cutting device according to claim 1, wherein the electrode is formed by thick film printing. 5. The electronic component lead cutting device according to claim 1, wherein the electrodes are arranged at the same spacing as the object to be cut. 6. The electronic component lead cutting device according to claim 1, wherein the detection circuit has a function of checking the presence or absence of a lead inserted into the printed circuit board. 7. Claim 1, wherein the detection circuit has a function of determining the polarity of a polarized component inserted into the printed circuit board.
The electronic component lead cutting device described in Section 1. 8. The electronic component lead cutting device according to claim 1, wherein the detection circuit has a function of measuring a constant of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61288821A JPS63142700A (en) | 1986-12-05 | 1986-12-05 | Electronic component lead cutter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61288821A JPS63142700A (en) | 1986-12-05 | 1986-12-05 | Electronic component lead cutter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63142700A true JPS63142700A (en) | 1988-06-15 |
Family
ID=17735172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61288821A Pending JPS63142700A (en) | 1986-12-05 | 1986-12-05 | Electronic component lead cutter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63142700A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103394618A (en) * | 2013-07-30 | 2013-11-20 | 东莞市酷柏电子设备有限公司 | Device for cutting electronic component pins and absorbing the cut pins |
| CN109692924A (en) * | 2018-12-29 | 2019-04-30 | 温州易正科技有限公司 | A kind of pin cutter device of diode |
-
1986
- 1986-12-05 JP JP61288821A patent/JPS63142700A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103394618A (en) * | 2013-07-30 | 2013-11-20 | 东莞市酷柏电子设备有限公司 | Device for cutting electronic component pins and absorbing the cut pins |
| CN109692924A (en) * | 2018-12-29 | 2019-04-30 | 温州易正科技有限公司 | A kind of pin cutter device of diode |
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