JPS63169730A - ボンダ−用ツ−ル保持機構 - Google Patents
ボンダ−用ツ−ル保持機構Info
- Publication number
- JPS63169730A JPS63169730A JP212387A JP212387A JPS63169730A JP S63169730 A JPS63169730 A JP S63169730A JP 212387 A JP212387 A JP 212387A JP 212387 A JP212387 A JP 212387A JP S63169730 A JPS63169730 A JP S63169730A
- Authority
- JP
- Japan
- Prior art keywords
- leaf spring
- tool
- fixed
- free state
- bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP212387A JPS63169730A (ja) | 1987-01-08 | 1987-01-08 | ボンダ−用ツ−ル保持機構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP212387A JPS63169730A (ja) | 1987-01-08 | 1987-01-08 | ボンダ−用ツ−ル保持機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63169730A true JPS63169730A (ja) | 1988-07-13 |
JPH0474864B2 JPH0474864B2 (enrdf_load_html_response) | 1992-11-27 |
Family
ID=11520574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP212387A Granted JPS63169730A (ja) | 1987-01-08 | 1987-01-08 | ボンダ−用ツ−ル保持機構 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63169730A (enrdf_load_html_response) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5190205A (en) * | 1990-10-31 | 1993-03-02 | Kabushiki Kaisha Shinkawa | Bonding head assembly |
WO2016072266A1 (ja) * | 2014-11-06 | 2016-05-12 | オムロン株式会社 | 吸着ヘッドおよびそれを備える貼付装置 |
-
1987
- 1987-01-08 JP JP212387A patent/JPS63169730A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5190205A (en) * | 1990-10-31 | 1993-03-02 | Kabushiki Kaisha Shinkawa | Bonding head assembly |
WO2016072266A1 (ja) * | 2014-11-06 | 2016-05-12 | オムロン株式会社 | 吸着ヘッドおよびそれを備える貼付装置 |
JP2016088576A (ja) * | 2014-11-06 | 2016-05-23 | オムロン株式会社 | 吸着ヘッドおよびそれを備える貼付装置 |
CN106715276A (zh) * | 2014-11-06 | 2017-05-24 | 欧姆龙株式会社 | 吸附头以及具备该吸附头的粘贴装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0474864B2 (enrdf_load_html_response) | 1992-11-27 |
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