JPS63169706A - Method of fitting terminal - Google Patents
Method of fitting terminalInfo
- Publication number
- JPS63169706A JPS63169706A JP103187A JP103187A JPS63169706A JP S63169706 A JPS63169706 A JP S63169706A JP 103187 A JP103187 A JP 103187A JP 103187 A JP103187 A JP 103187A JP S63169706 A JPS63169706 A JP S63169706A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- hole
- mold
- conductive layer
- molten resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 12
- 238000000605 extraction Methods 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 230000008602 contraction Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、例えば小屋の可変抵抗器の抵抗体の両端等に
固定される端子の取付方法に係る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of attaching terminals to be fixed to both ends of a resistor of a variable resistor in a shed, for example.
第２図（イ）、（ロ）、ｅ→は従来例の説明図で、可変
抵抗器の抵抗基板に端子を取付ける工程図である。FIGS. 2(a), 2(b), and e→ are explanatory diagrams of a conventional example, and are process diagrams for attaching terminals to a resistance board of a variable resistor.
まず、第２図（イ）の平面図に示すように、絶縁基板１
上に印刷技術により同心円状の抵抗層２と集電層２′と
を設け、該抵抗層２および集電層２′の図面下側３ケ所
に端子取出し部２ａを形成する。次に同図（ロ）に示す
ように、各端子取出し部２ａの上面にマスキングにより
導電層５を形成し、さらに同図（・今に示すように金属
製の端子３を重ね、リベット４で鋲着していた。First, as shown in the plan view of FIG. 2(a), an insulating substrate 1
A concentric resistance layer 2 and a current collection layer 2' are provided thereon by printing technology, and terminal extraction portions 2a are formed at three locations on the lower side of the resistance layer 2 and current collection layer 2' in the drawing. Next, as shown in the same figure (b), a conductive layer 5 is formed by masking on the upper surface of each terminal extraction part 2a, and then metal terminals 3 are overlapped and rivets 4 are placed as shown in the same figure (now). It was tacked on.
ところで、抵抗器の小型化が進み、抵抗基板Ｉが小さく
なると、狭少な場所で端子３を鋲着するには困難を来し
ていた。However, as resistors become smaller and the resistor substrate I becomes smaller, it becomes difficult to rivet the terminals 3 in a narrow space.
本発明は上記の如き従来の欠点を解消せんとするもので
あり、本発明の目的は、狭少な場所でも確実に取付けし
得る端子の取付方法を提供せんとするものである。The present invention aims to solve the above-mentioned conventional drawbacks, and an object of the present invention is to provide a method for attaching a terminal that can be reliably attached even in a narrow space.
本発明は上記の如き目的を達成するために、導電層を形
成した端子取出し部に孔を設けると共Ｋ、端子に打抜き
孔を形成して該孔の周縁に折曲部を形成し、前記端子の
折曲部を前記端子取出し部の孔に嵌合後、成形用金型内
で、該金をに設けた押えピンにより、前記端子取出し部
の導電層と端子との積層構造を保持せしめ、しかる後、
前記金型に溶融樹脂を充填し、該樹脂の収縮を利用して
端子取出し部に設けた導電層と端子とを接触、固定する
ようになっている。In order to achieve the above-mentioned objects, the present invention provides a hole in the terminal extraction portion on which a conductive layer is formed, a punched hole in the terminal, and a bent portion on the periphery of the hole. After the bent part of the terminal is fitted into the hole of the terminal extraction part, the laminated structure of the conductive layer of the terminal extraction part and the terminal is held in a mold by a presser pin provided on the gold plate. , then,
The mold is filled with molten resin, and the shrinkage of the resin is used to bring the terminal into contact with the conductive layer provided at the terminal extraction portion and to fix it.
本発明によれば、端子取出し部に孔を設けると共に、端
子に打抜き孔を形成して核孔の周縁に折曲部を形成し、
前記端子の折曲部を前記端子取出し部の孔に嵌合後、成
形用金型内で、該金型に設けた押えピンにより、前記端
子取出し部の導電層と端子との積層構造を保持せしめ、
しかる後に前記金型に溶融樹脂を充填するようにしたの
で、溶融樹脂は端子の孔、基板の孔を介して端子接続部
分を取り囲むように充填され、該溶融樹脂の冷却固化に
伴う収縮が端子接続部分の接触圧を高める働きをするの
で、端子接触部分の接触の信頼性は十分であり、且つ、
収め工程がないので、狭少な場所でも確実に端子を取付
けることが出来る。According to the present invention, a hole is provided in the terminal extraction portion, a punched hole is formed in the terminal, and a bent portion is formed at the periphery of the core hole,
After the bent part of the terminal is fitted into the hole of the terminal extraction part, the laminated structure of the conductive layer of the terminal extraction part and the terminal is held in a mold by a presser pin provided in the mold. Seshime,
After that, the mold is filled with molten resin, so that the molten resin is filled so as to surround the terminal connection part through the hole of the terminal and the hole of the board, and the contraction caused by the cooling and solidification of the molten resin causes the shrinkage of the molten resin. Since it works to increase the contact pressure of the connecting part, the contact reliability of the terminal contact part is sufficient, and
Since there is no installation process, terminals can be installed reliably even in narrow spaces.
以下に本発明の方法を添付の図面に基づ、き説明する。 The method of the present invention will be explained below based on the accompanying drawings.
第１図（イ）〜（ホ）は端子の取付方法の工程図である
。FIGS. 1(A) to 1(E) are process diagrams of a terminal attachment method.
まず、第１図（イ）の平面図に示すように、抵抗基板１
１上に印刷技術により同心円状の抵抗層１２と集電層１
２′とを設け、該抵抗層１２及び集電層１２′の図面下
側３ケ所に端子取出し部１２ａを形成する。次に同図（
ロ）に示すように、各端子取出し部１２ａの上面にマス
キングにより導電層１５を形成する。First, as shown in the plan view of FIG.
1, a concentric resistance layer 12 and a current collecting layer 1 are formed by printing technology.
2', and terminal extraction portions 12a are formed at three locations below the resistance layer 12 and current collecting layer 12' in the drawing. Next, the same figure (
As shown in (b), a conductive layer 15 is formed on the upper surface of each terminal extraction portion 12a by masking.
次に同図（／今の断面図に示すように端子１３に穿設し
た孔１４の周縁に設けた折曲部１６を端子取出し部１２
ａに設けた孔１７にさしこんで、端子１３を各導電層１
５上に重ね合せる。Next, as shown in the cross-sectional view of the same figure (/), the bent part 16 provided at the periphery of the hole 14 drilled in the terminal 13 is inserted into the terminal extraction part 12.
a, and insert the terminal 13 into each conductive layer 1.
Lay it on top of 5.
そして、同図に）の要部断面図に示すように、金型１８
内に相対向して突設した２本一対の押えピン１９によっ
て抵抗基板１１と端子１３と挾持し、該端子１３、導電
層１５、および端子取出し部１２ａの積層構造を支持固
定するとともに、金型１８のキャビティ２０に溶融樹脂
２１を充填する。As shown in the cross-sectional view of the main part of the mold 18
The resistor board 11 and the terminals 13 are held by a pair of holding pins 19 that are protruded from each other and are opposed to each other. The cavity 20 of the mold 18 is filled with molten resin 21 .
このように端子接続部分の積層構造は押えピン１９によ
って保持されているので、溶融樹脂２１の不安定な流動
の悪影響を受けることはない。Since the laminated structure of the terminal connection portion is thus held by the holding pin 19, it is not adversely affected by the unstable flow of the molten resin 21.
また、溶融樹脂２１は端子１３の孔１４及び抵抗基板１
１の孔１７を介して端子接続部分を取り囲むようになる
ので、樹脂２１の冷却固化に伴う収縮が端子接続部分の
接触圧を高める働きをする。Further, the molten resin 21 is applied to the holes 14 of the terminals 13 and the resistance board 1.
Since the resin 21 surrounds the terminal connection portion through the hole 17 of No. 1, the contraction of the resin 21 as it cools and solidifies serves to increase the contact pressure of the terminal connection portion.
同図（ホ）は、アウトサート成形を行った後の状態を示
す斜視図であって、溶融樹脂２１の収縮により各端子１
３は抵抗層１２及び集電層１２′の各端子取出し部１２
ａの導電層１５に確実に接続されている。FIG. 5(E) is a perspective view showing the state after outsert molding, in which each terminal 1 due to contraction of the molten resin 21.
3 is each terminal extraction part 12 of the resistance layer 12 and current collection layer 12'
It is reliably connected to the conductive layer 15 of a.
なお、前記押えピン１９により生じた端子露出部２２に
適宜手段により密閉して水蒸気等から保護している。Note that the terminal exposed portion 22 created by the presser pin 19 is sealed by appropriate means to protect it from water vapor and the like.
以上説明したように、本発明によれば、アウトサート成
形時に、端子、導電層、および端子取出し部の積層構造
を金型内に突出させた押えピンによって保持した状態で
、溶融樹脂を金型のキャビティ内に充填するよ５Ｋした
ので、溶融樹脂は端子の孔、基板の孔を介して端子接続
部分を取り囲むように充填され、該溶融樹脂の冷却固化
に伴う収縮が端子接続部分の接触圧を高める働きをする
ので、端子接続部分の接触の信頼性は十分であり、且つ
絞め工程がないので、狭少な場所でも確実に端子を取付
げることか出来る。As explained above, according to the present invention, during outsert molding, the molten resin is held in the mold while the laminated structure of the terminal, the conductive layer, and the terminal extraction part is held by the presser pin protruding into the mold. Since the molten resin was charged at 5K to fill the cavity of the terminal, the molten resin was filled to surround the terminal connection part through the hole in the terminal and the hole in the board, and the contraction caused by the cooling and solidification of the molten resin caused the contact pressure of the terminal connection part to increase. Since the contact reliability of the terminal connection part is sufficient, and there is no tightening process, the terminal can be reliably attached even in a narrow space.
第１図（イ）〜（ホ）は本発明の端子取付方法の工程図
、第２図は従来の端子取付方法の工程図を示す。
１１・・・・・・抵抗基板、１２・・・・・・抵抗層、
１２′川・・・集電層、１２ａ・・・・・・端子取出し
部、１５・・・用導電層、１３・・・・・・端子、１４
．１７・・・・・・孔、１６・・・・・・折曲部、１８
・・・・・・金型、１９・・・・・・押えピン、２０・
・・・・・キャビティ、２１・・・・・・樹脂。
第１図
ｔイノ
（ｒｙ）ｌ
／Ａノ
第２図
ｔメツ
＾フッ
θ＼ノFIGS. 1A to 1E are process diagrams of the terminal attaching method of the present invention, and FIG. 2 is a process diagram of the conventional terminal attaching method. 11... Resistance substrate, 12... Resistance layer,
12' River... Current collecting layer, 12a... Terminal extraction portion, 15... Conductive layer for, 13... Terminal, 14
．． 17... Hole, 16... Bend part, 18
...Mold, 19...Press pin, 20.
...Cavity, 21...Resin. Figure 1
(ry)l /Aノ2nd figure tmetsu ^fu θ\ノ
Claims (1)
子に打抜き孔を形成して該孔の周縁に折曲部を形成し、
前記端子の折曲部を前記端子取出し部の孔に嵌合後、成
形用金型内で、該金型に設けた押えピンにより、前記端
子取出し部の導電層と端子との積層構造を保持せしめ、
しかる後、前記金型に樹脂を充填し、該樹脂の収縮を利
用して端子取出し部に設けた導電層と端子とを接触、固
定したことを特徴とする端子の取付方法。A hole is provided in the terminal extraction portion on which the conductive layer is formed, a punched hole is formed in the terminal, and a bent portion is formed at the periphery of the hole,
After the bent part of the terminal is fitted into the hole of the terminal extraction part, the laminated structure of the conductive layer of the terminal extraction part and the terminal is held in a mold by a presser pin provided in the mold. Seshime,
Thereafter, the mold is filled with a resin, and the contraction of the resin is utilized to bring the terminal into contact with the conductive layer provided in the terminal extraction portion and to fix the terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP103187A JPS63169706A (en) | 1987-01-08 | 1987-01-08 | Method of fitting terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP103187A JPS63169706A (en) | 1987-01-08 | 1987-01-08 | Method of fitting terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63169706A true JPS63169706A (en) | 1988-07-13 |
Family
ID=11490194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP103187A Pending JPS63169706A (en) | 1987-01-08 | 1987-01-08 | Method of fitting terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63169706A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016122737A (en) * | 2014-12-25 | 2016-07-07 | 帝国通信工業株式会社 | Connection method by molding metal terminal and circuit board, and connection body |
-
1987
- 1987-01-08 JP JP103187A patent/JPS63169706A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016122737A (en) * | 2014-12-25 | 2016-07-07 | 帝国通信工業株式会社 | Connection method by molding metal terminal and circuit board, and connection body |
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