JPS61149371U - - Google Patents
Info
- Publication number
- JPS61149371U JPS61149371U JP3247585U JP3247585U JPS61149371U JP S61149371 U JPS61149371 U JP S61149371U JP 3247585 U JP3247585 U JP 3247585U JP 3247585 U JP3247585 U JP 3247585U JP S61149371 U JPS61149371 U JP S61149371U
- Authority
- JP
- Japan
- Prior art keywords
- terminal portion
- solder
- wiring board
- printed wiring
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図はリードピン付き可撓性印刷配線板端子
部の横断面図で、１は絶縁フイルム、２は接着剤
、３は銅回路、４は接着剤、５はオーバーレイ層
、８は端子露出面、９は半田層、１０は半田メツ
キしたリードピン、１１は合成樹脂モールド層を
示す。
第２図はリール状リードピンの一例で、１２は
挿入ピン、１３はピンフレームを示す。
第３図は本発明の実装状態図で、２１はコネク
ター、２２は端子、２３は可撓性印刷配線板、２
４はリードピン、２５は硬質印刷線板を示す。
又第４図ａ，ｂ，ｃは従来技術による接続部を示
す図で、３１は絶縁フイルム南３２は接着剤、３
３は銅回路、３４は接着剤、３５はオーバーレイ
層、３６は差し込みピン、３７は半田、３８は端
子部、３９は半田、４０は銅回路、４１は接着剤
を示す。
Fig. 1 is a cross-sectional view of the terminal section of a flexible printed wiring board with lead pins, where 1 is an insulating film, 2 is an adhesive, 3 is a copper circuit, 4 is an adhesive, 5 is an overlay layer, and 8 is an exposed terminal surface. , 9 is a solder layer, 10 is a solder-plated lead pin, and 11 is a synthetic resin mold layer. FIG. 2 shows an example of a reel-shaped lead pin, with reference numeral 12 indicating an insertion pin and 13 indicating a pin frame. FIG. 3 is a mounting state diagram of the present invention, in which 21 is a connector, 22 is a terminal, 23 is a flexible printed wiring board, 2
4 represents a lead pin, and 25 represents a hard printed wire board. Further, FIGS. 4a, b, and c are diagrams showing connection parts according to the prior art, where 31 is an insulating film, 32 is an adhesive, and 3 is an insulating film.
3 is a copper circuit, 34 is an adhesive, 35 is an overlay layer, 36 is an insertion pin, 37 is solder, 38 is a terminal portion, 39 is solder, 40 is a copper circuit, and 41 is an adhesive.
Claims (1)
され、前記端子部をバネ弾性を有する半田メツキ
したリードピンではさみ込みし、該リードピンを
前記半田層と加熱溶着した後、端子部を樹脂モー
ルドにより被覆したことを特徴とするリードピン
付き可撓性印刷配線板。 A solder layer is formed on the conductor terminal portion of the flexible printed wiring board, the terminal portion is sandwiched between solder-plated lead pins having spring elasticity, and the lead pin is heat-welded to the solder layer, and then the terminal portion is bonded with resin. A flexible printed wiring board with lead pins, characterized by being covered with a mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3247585U JPS61149371U (en) | 1985-03-06 | 1985-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3247585U JPS61149371U (en) | 1985-03-06 | 1985-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61149371U true JPS61149371U (en) | 1986-09-16 |
Family
ID=30534022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3247585U Pending JPS61149371U (en) | 1985-03-06 | 1985-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61149371U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5730785U (en) * | 1980-07-25 | 1982-02-18 |
-
1985
- 1985-03-06 JP JP3247585U patent/JPS61149371U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5730785U (en) * | 1980-07-25 | 1982-02-18 |
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