JP2016122737A - Connection method by molding metal terminal and circuit board, and connection body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection method capable of easily and surely performing a connection by molding between a terminal connection pattern that is provided on a circuit board, and a metal terminal.SOLUTION: A flexible circuit board 60 and a metal terminal 90 are accommodated within metal molds 150 and 200 and in that case, the terminal connection pattern that is provided on the flexible circuit board 60 and the metal terminal 90 are connected. The inside of a cavity C of the metal molds 150 and 200 formed in a portion including a connection part of the flexible circuit board 60 and the metal terminal 90 is filled with a molten resin and the resin is solidified, thereby molding a case in which the metal terminal 90 and the flexible circuit board 60 are connected and integrated. Within the cavity C of the metal molds 150 and 200, a molten resin flow blocking protrusion 203 is provided for blocking a flow of the molten resin in a direction away from the connection part of the metal terminal 90 and the flexible circuit board 60, and inflow of the molten resin to the cavity C around the connection part of the metal terminal 90 and the flexible circuit board 60 is promoted.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a connection method by molding a metal terminal and a circuit board, and a connection body formed by the connection method.

  Conventionally, for example, as shown in Patent Document 1 (FIGS. 5, 6, and 7), a flexible circuit board (80) formed with a circuit pattern (81) and a terminal plate (90) are prepared, The flexible circuit board (80) and the terminal plate (90) are accommodated in a mold, and at that time, a terminal pattern (83) and a terminal plate (90) provided in a part of the circuit pattern (81) The mold cavity formed at a portion including at least the portion connected to the terminal plate (90) around the flexible circuit board (80) is filled with a molten resin and solidified. A connection method (insert molding connection method) for connecting the terminal plate (90) and the flexible circuit board (80) by forming the case (50) has been used.

  The gate for injecting the molten resin into the cavity is generally provided at a position facing the opposite side of the surface that contacts the terminal plate (90) of the flexible circuit board (80). If molten synthetic resin is injected into the cavity from this gate position, the injected molten synthetic resin is filled while pressing the flexible circuit board (80) against the terminal board (90). That is, if this method is used, the flexible circuit board (80) can be pressed against the terminal plate (90) at the same time while the molten resin is filled into the cavity, and the two can be reliably connected. The molten synthetic resin that is filled into the cavity from the gate and presses the flexible circuit board (80) against the terminal board (90) is then placed on the surface of the flexible circuit board (80) that contacts the terminal board (90). The case wraps around and fills the periphery of the connecting portion with the molten synthetic resin, and wraps around the cavity other than the connecting portion to form a case.

JP 2007-96059 A

  However, the molten synthetic resin that is filled into the cavity from the gate and presses the flexible circuit board (80) against the terminal board (90) is then contacted with the terminal board (90) of the flexible circuit board (80). Since the molten synthetic resin must wrap around from the outside of the outer periphery of the flexible circuit board (80) when wrapping around, the gap between the outer periphery and the inner wall of the cavity is narrow, or the flexible circuit board (80) A mold for narrowing a gap between a plurality of terminal boards (90) protruding from the outer periphery of the metal plate and further sandwiching a connecting portion between the flexible circuit board (80) and the terminal board (90) from above and below. Because the pressing part provided in the cavity is in the cavity, etc., its flow resistance (force that hinders flow, filling resistance) increases, and flow resistance Filling of the molten resin into other small parts (parts other than the connecting part) is promoted, and from these reasons, the molten resin is filled around the connecting part of the flexible circuit board (80) and the terminal board (90). There was a risk that the amount would be reduced and the connection strength between them could not be obtained sufficiently. Such a phenomenon becomes remarkable when the viscosity of the molten resin to be filled is low.

  The present invention has been made in view of the above-mentioned points, and its purpose is to connect a metal terminal and a circuit board by molding so that the connection between the terminal connection pattern formed on the circuit board and the metal terminal can be easily and reliably formed. It is to provide a method and connection.

In the present invention, a circuit board formed with a circuit pattern and a metal terminal are prepared, and the circuit board and the metal terminal are accommodated in a mold, and at that time, provided in a part of the circuit pattern. By connecting the terminal connection pattern and the metal terminal, filling the molten resin into the cavity of the mold formed in a portion including at least the portion connected to the metal terminal around the circuit board and solidifying the mold In the connection method by molding the metal terminal and the circuit board for connecting the metal terminal and the circuit board, the flow of the molten resin toward the direction away from the connection portion between the metal terminal and the circuit board is inhibited in the cavity of the mold. A protrusion for preventing molten resin from flowing is provided, whereby the inflow of molten resin into the cavity around the connecting portion between the metal terminal and the circuit board is promoted.
Since the projection for preventing molten resin flow is provided in the cavity of the mold, the molten resin is introduced into the cavity around the connection part of the metal terminal and the circuit board, and the molten resin is introduced into the other part of the cavity. Compared to the introduction of Thereby, the connection between the terminal connection pattern formed on the circuit board and the metal terminal can be easily and reliably performed.

In the present invention, the circuit board is a flexible circuit board having flexibility, and a connecting portion between the flexible circuit board and the metal terminal housed in the mold is a pressing portion provided on the mold from above and below. On the other hand, a gate for injecting the molten resin of the mold is provided between the pressing portion of the cavity and the molten resin flow prevention protrusion.
Since the gate for injecting the molten resin is provided between the pressing portion of the cavity and the protruding portion for preventing molten resin flow, the molten resin can be actively directed to the pressing portion side having a large flow resistance. The molten resin can be preferentially introduced into the cavity around the connection portion between the metal terminal and the circuit board.

Further, according to the present invention, the terminal connection pattern is formed in the vicinity of one end side of the circuit board, and a portion in the vicinity of one end of the metal terminal is connected to the terminal connection pattern, while the gate of the mold is connected to the circuit board. The terminal connection pattern is provided at a position opposite to the surface opposite to the surface on which the terminal connection pattern is provided.
As a result, while the terminal connection pattern of the circuit board is pressed against the metal terminal by the molten resin, at the same time, the molten resin is introduced into the cavity around the connection portion of the metal terminal and the circuit board, and the other part of the cavity is melted. Compared to the introduction of resin, it can be accelerated.

  Moreover, this invention exists in the connection body by the shaping | molding of the metal terminal and circuit board which are manufactured using the connection method by shaping | molding of the said metal terminal and a circuit board.

  ADVANTAGE OF THE INVENTION According to this invention, the connection by the shaping | molding between the terminal connection pattern formed in the circuit board and a metal terminal can be performed easily and reliably.

1 is a perspective view of a sliding electronic component 1. FIG. 1 is an exploded perspective view of a sliding electronic component 1. FIG. It is a cross-sectional view (AA cross-sectional view of FIG. 1) of the slide-type electronic component 1. 3 is a perspective view of a flexible circuit board 60 and metal terminals 90. FIG. FIG. 3 is an enlarged cross-sectional view of a main part of a connection portion of a flexible circuit board 60 and a metal terminal 90 by a case 10 (an enlarged cross-sectional view taken along a line BB in FIG. 2). It is a principal part expansion perspective view of a connection part. It is the principal part expansion perspective view which looked at the connection part from the lower side. FIG. 10 is an explanatory diagram of a manufacturing method of the case 10.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 is a perspective view of a sliding electronic component 1 configured using a case 10 to which the present invention is applied, FIG. 2 is an exploded perspective view of the sliding electronic component 1, and FIG. 3 is a cross-sectional view of the sliding electronic component 1. It is AA sectional drawing of FIG. As shown in these drawings, the slide-type electronic component 1 includes a case 10 made of synthetic resin, a movable body 80 slidably housed in the housing portion 12 of the case 10, and the housing portion 12 of the case 10. The cover 100 is provided. A slider 85 (see FIG. 3) is attached to the lower surface of the moving body 80. Further, a circuit board (hereinafter referred to as “flexible circuit board”) 60 is insert-molded in the case 10, and the surface thereof is exposed on the bottom surface of the storage portion 12. In the following description, “up” refers to the direction from the bottom surface side of the case 10 toward the flexible circuit board 60, and “down” refers to the opposite direction. A direction orthogonal to the longitudinal direction (slide direction A) of the case 10 is referred to as a “width direction”.

  The case 10 is a long rectangular box shape with an open upper surface, and is a pair of side walls that are erected from both the left and right sides of the bottom portion 11 and extend in parallel along the sliding direction (horizontal direction) A. 13, a storage portion 12 for storing a main body portion 81 of the moving body 80 described below is formed between the side walls 13. A flexible circuit board 60 is insert-molded on the upper surface of the bottom portion 11 of the case 10 (inner bottom surface of the storage portion 12) so that the upper surface is exposed in the storage portion 12. The flexible circuit board 60 is configured by providing predetermined circuit patterns 63, 65, and 67 as detection means on the upper surface of a flexible synthetic resin film 61 in the sliding direction A. Further, from one end of the case 10 in the sliding direction A (the end on the right side in FIG. 1 and FIG. 2), three ends connected to the flexible circuit board 60 by the method of the present invention. The other end of the metal terminal (terminal plate) 90 protrudes outward from the case 10 and is bent downward.

  4 is a perspective view of the flexible circuit board 60 and the metal terminal 90 that are insert-molded in the case 10, and FIG. 5 is an enlarged cross-sectional view of the main part of the connection portion of the flexible circuit board 60 and the metal terminal 90 by the case 10 (FIG. 2). FIG. 6 is an enlarged perspective view of the main part of the connecting portion, and FIG. 7 is an enlarged perspective view of the main portion of the connecting portion as viewed from below.

  First, as shown in FIG. 4, the flexible circuit board 60 has three linear circuit patterns 63, 65, 67 in the longitudinal direction of the upper surface of the synthetic resin film 61 formed in a strip shape. A terminal connection pattern 69 is formed and connected to each of the circuit patterns 63, 65, and 67 at one end. The circuit pattern 63 is a sliding pattern composed of a conductor pattern having a small resistance value, the circuit pattern 65 is a sliding pattern composed of a resistor pattern having a large resistance value, and the circuit pattern 67 is a connected pattern composed of a conductor pattern having a small resistance value. This is a pattern for use (a circuit pattern for drawing the end of the circuit pattern 65 toward the terminal connection pattern 69). These circuit patterns 63, 65 and 67 and the terminal connection pattern 69 constitute a part of the detection means. Each terminal connection pattern 69 is a conductor pattern having a small resistance value, and is formed from one end of each circuit pattern 63, 65, 67 to one end of the synthetic resin film 61. Between each terminal connection pattern 69, a resin introduction hole 71 composed of a small hole is formed.

  The metal terminal 90 is a substantially band-shaped metal plate, and has a substrate contact portion 91 on one side and a terminal portion 93 on the other side. The width dimension of the board contact portion 91 is larger than the width dimension of the terminal portion 93 and is formed substantially the same as the width dimension of the terminal connection pattern 69. Before the case 10 is formed, the metal terminals 90 are not bent, and the tips of the terminal portions 93 are extended as they are and connected to a connecting plate (not shown) to be integrated.

  And the board | substrate contact part 91 of each metal terminal 90 is covered and fixed by the synthetic resin which comprises the case 10 in the state contact | abutted and connected on each terminal connection pattern 69 of the flexible circuit board 60. The That is, as shown in FIGS. 5 to 7, the terminal pressing portion 15 is formed in a band shape over the entire width direction of one end side of the flexible circuit board 60 in contact with each metal terminal 90. The bottom portion 11 is formed in the lower portion, whereby the connecting portion between the flexible circuit board 60 (terminal connection pattern 69) and the metal terminal 90 is sandwiched and fixed from above and below. On the upper surface of the terminal pressing portion 15, in order to reinforce the connecting portion, a resin pile portion 17 having a higher height is provided. In addition, a substrate presser / migration prevention unit 19 that protrudes in a rectangular flat plate shape is formed on the side surface of the terminal presser unit 15 facing the storage unit 12 side. The substrate presser / migration prevention unit 19 is formed in close contact with the surface of the synthetic resin film 61 between the terminal connection patterns 69 of the flexible circuit board 60. Since the terminal connection pattern 69 has a portion where the silver pattern is exposed to connect the metal terminal 90, there is a possibility that the adjacent terminal connection pattern 69 may be short-circuited by migration. 19 prevents it. On the other hand, rectangular holes 21 reaching the flexible circuit board 60 are formed at positions (three locations) corresponding to the terminal connection patterns 69 on the bottom surface 11 side of the case 10. The hole 21 is formed by a pressing portion 201 provided in the mold 200 described below. Further, at the position of the bottom portion 11 on the side farther from the metal terminal 90 than the hole portion 21, a long hole-shaped concave portion 23 is formed so as to cross the bottom portion 11 in the width direction. The recess 23 is formed by a molten resin flow prevention protrusion 203 provided on the mold 200 described below, and the bottom surface thereof does not reach the lower surface of the flexible circuit board 60. Furthermore, a gate connection portion 25 is formed at a position between the hole portion 21 and the recess portion 23 in the bottom portion 11. The gate connection portion 25 is formed by a portion where the tip of the gate G provided in the mold 200 described below was connected.

  Next, a method for manufacturing the case 10 will be described. First, what contact | abutted the board | substrate contact part 91 of the metal terminal 90 on each terminal connection pattern 69 of the flexible circuit board 60, respectively is shown by the 1st, 2nd metal mold | die 150,200, as shown in FIG. Clamp and store from above and below. At this time, as described above, the metal terminal 90 is not bent, and the tip of each terminal portion 93 is extended as it is and connected to a connecting plate (not shown) to be integrated. At this time, the first and second molds 150 and 200 form a cavity C having the same shape as the case 10. Further, the upper surface of the vicinity of the tip of each substrate contact portion 91 is in contact with the pressing portion 151 provided on the first mold 150, and is opposite to the flexible circuit board 60 in contact with the vicinity of the tip of each substrate contact portion 91. The pressing portion 201 provided in the second mold 200 abuts on the surface, whereby the connecting portion between the flexible circuit board 60 and the metal terminal 90 is pressed and sandwiched from above and below. The pressing part 151 of the first mold 150 is formed by one plane in the width direction over the three substrate contact parts 91, while the pressing part 201 of the second mold 200 includes three pressing parts 201. Each part corresponding to each of the substrate contact portions 91 is formed in a quadrangular prism shape.

  Further, a molten resin flow prevention protrusion 203 is provided on the bottom surface of the cavity C of the second mold 200 on the side farther from the metal terminal 90 than the pressing part 201. The molten resin flow prevention protrusion 203 is formed in a long length in the cavity C in the width direction (in a direction intersecting the flow direction of the molten resin described below), and an upper end surface 203a thereof is a flexible circuit board. The both ends in the width direction are opposed to both end surfaces in the width direction of the cavity C via a predetermined gap. Further, a gate G for injecting molten resin is provided on the bottom surface between the pressing portion 201 and the molten resin flow prevention projection 203 in the cavity C of the second mold 200.

  When the molten resin is injected into the cavity C from the gate G, the molten resin is first sprayed on the lower surface of the flexible circuit board 60 and then proceeds in the left-right direction. At this time, most of the molten resin directed toward the connection portion between the flexible circuit board 60 and the metal terminal 90 first passes through the gap between the pressing portions 201 and then the outer periphery of the flexible circuit board 60 and the inner surface of the cavity C. It goes around to the upper surface side through the gap, and fills the cavity C on the first mold 150 side with the molten resin.

  On the other hand, most of the molten resin heading in the direction opposite to the connection portion between the flexible circuit board 60 and the metal terminal 90 is a gap E between the upper end surface 203a of the molten resin flow prevention protrusion 203 and the lower surface of the flexible circuit board 60, And it introduce | transduces into the downstream through the clearance gap between the left-right both ends of the protrusion 203 for molten resin flow prevention, and the width direction both end surfaces of the cavity C. That is, a predetermined large flow resistance is given to the molten resin going to the side opposite to the connecting portion by the molten resin flow prevention protrusion 203.

  As described above, since the flow resistance of the molten resin toward the side opposite to the connection portion is increased by the molten resin flow prevention protrusion 203 provided in the cavity C of the mold 200, the metal terminal 90 and the flexible The introduction of the molten resin into the cavity C around the connection portion of the circuit board 60 can be promoted as compared with the introduction of the molten resin into the other portion of the cavity C. The resin can be filled smoothly and quickly. As a result, the terminal connection pattern 69 formed on the flexible circuit board 60 and the metal terminal 90 can be easily and reliably connected by molding.

  In other words, in the above embodiment, since the gate G for injecting the molten resin is provided between the pressing portion 201 of the cavity C and the molten resin flow prevention protrusion 203, the gate G originally has a large flow resistance on the side of the pressing portion 201. The molten resin can be directed positively, whereby the molten resin can be preferentially introduced into the cavity C around the connection portion between the metal terminal 90 and the flexible circuit board 60.

  Furthermore, since the molten resin flow prevention protrusion 203 is provided, the gate G is provided at a position opposite to the surface of the flexible circuit board 60 on which the terminal connection pattern 69 is provided. While the terminal connection pattern 69 of the flexible circuit board 60 is pressed against the metal terminal 90, the molten resin is introduced into the cavity C around the connection part of the metal terminal 90 and the flexible circuit board 60 at the same time. Compared with the introduction of the molten resin into, it can be promoted.

  Then, after the molten resin filled in the cavity C is cured, the first and second molds 150 and 200 are removed and further connected to the tip of the terminal portion 93 of the metal terminal 90 protruding from the case 10. When the connecting portion is cut and then the terminal portion 93 is bent downward at a substantially right angle, the case 10 shown in FIG. 2 is completed. As a result, the bottom portion 11 is formed on the lower surface side of the flexible circuit board 30, and the terminal pressing portion 15 is formed on the substrate contact portion 91 of the metal terminal 90 so as to cover it. Here, the case 10 is also a connection body formed by molding the metal terminal 90 and the flexible circuit board 60.

  Returning to FIG. 1 to FIG. 3, the moving body 80 is a synthetic resin molded product, and includes a substantially rectangular main body 81 and a lever 83 protruding from the center of the upper surface of the main body 81. . As shown in FIG. 3, a flat plate-like base portion 87 of a slider 85 made of an elastic metal plate that constitutes the detection means is fixed to the lower surface of the main body portion 81. The base portion 87 is fixed by inserting a small projection (not shown) protruding from the lower surface of the main body portion 81 into a small hole (not shown) provided in the base portion 87 and thermally crimping the tip of the small projection. Two sliding booklets 89 project in parallel from one side of the base 87, and are configured so that the vicinity of the roots of these sliding booklets 89 are folded back and positioned below the base 87. The protective protrusion 88 (see FIG. 3), which is a small protrusion protruding from the lower surface of the base 87, is used for storage, movement, and the like before the movable body 80 with the slider 85 attached is assembled into the case 10. In this case, the slider 85 is provided to prevent the slider 85 from coming into contact with another member and deforming.

  The cover 100 is formed in a shape that covers the storage portion 12 of the case 10 by bending a metal plate into a box shape with its lower surface released. That is, the cover 100 bends the side surface portion 103 substantially vertically downward from the left and right sides (both sides along the longitudinal direction) of the substantially rectangular upper surface portion 101 having a dimension and shape that covers the storage portion 12 of the case 10. A bent portion 105 protrudes from the lower end side of the side surface portion 103, and a rectangular lever insertion hole 107 extending in the sliding direction A is provided at the center of the upper surface portion 101.

  And in order to assemble this slide type variable resistor 1, the main-body part 81 of the moving body 80 is accommodated in the accommodating part 12 of the case 10, and the cover 100 is covered on it. At that time, both side surface portions 103 of the cover 100 cover the outer side surfaces of the both side walls 13 of the case 10. When the bent portions 105 of the cover 100 are bent to the lower surface side of the bottom portion 11 of the case 10, the case 10 and the cover 100 are fixed integrally to complete the sliding electronic component 1. The above assembling procedure is an example, and it goes without saying that the assembly may be performed using other various assembling procedures.

  Then, if the lever 83 of the moving body 80 is moved in the sliding direction A, the pair of sliding booklets 89 of the slider 85 slide on the circuit patterns 63 and 65, so that the resistance between the metal terminals 90 is increased. The value changes. In the above-described embodiment, the linear direction is shown as the slide movement direction, but the slide movement direction is a concept including various directions other than the linear direction, such as an arc direction and other curved directions.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in the above embodiment, a flexible circuit board is used as the circuit board, but a hard circuit board may be used instead. Further, the connection body used to connect the metal terminal and the circuit board may be various molded products other than the case. Further, the shape and the number of the protrusions for preventing molten resin flow are not limited to the shape and the number shown in the above embodiment, and may be other various shapes, structures, and numbers.

1 Sliding electronic component 10 Case (connector)
DESCRIPTION OF SYMBOLS 15 Terminal holding part 17 Resin pile part 19 Board | substrate holding | suppressing and migration prevention part 23 Recessed part 25 Gate connection part 60 Flexible circuit board (circuit board)
63, 65, 67 Circuit pattern 69 Terminal connection pattern 80 Moving body 85 Slider 90 Metal terminal 100 Cover 150 First mold (mold)
151 Pressing part 200 Second mold (mold)
201 Pressing part 203 Protrusion part for preventing molten resin flow C Cavity G Gate

Claims (4)

Prepare a circuit board formed with a circuit pattern and metal terminals,
The circuit board and the metal terminal are housed in a mold, and at that time, the terminal connection pattern provided in a part of the circuit pattern and the metal terminal are connected,
A metal terminal that connects the metal terminal and the circuit board by filling and solidifying a molten resin in a cavity of the mold formed in a part including at least a part connected to the metal terminal around the circuit board. And connection method by molding circuit board,
Provided in the cavity of the mold is a molten resin flow prevention protrusion that inhibits the flow of the molten resin in a direction away from the connection portion between the metal terminal and the circuit board, thereby connecting the metal terminal and the circuit board. A connection method by molding a metal terminal and a circuit board, wherein the inflow of molten resin into a cavity around the portion is promoted. A method of connecting the metal terminal and the circuit board according to claim 1 by molding,
The circuit board is a flexible circuit board having flexibility,
The connecting portion between the flexible circuit board and the metal terminal housed in the mold is pressed and sandwiched by pressing parts provided on the mold from above and below,
On the other hand, a method of connecting a metal terminal and a circuit board by forming a gate for injecting molten resin of the mold between the pressing portion of the cavity and the protrusion for preventing molten resin flow . A method of connecting the metal terminal and the circuit board according to claim 2 by molding,
The terminal connection pattern is formed in the vicinity of one end side of the circuit board, and the vicinity of one end of the metal terminal is connected to the terminal connection pattern,
On the other hand, the gate of the metal mold is provided at a position opposite to the surface opposite to the surface on which the terminal connection pattern of the circuit board is provided.   A connection body formed by molding a metal terminal and a circuit board manufactured using the method for connecting a metal terminal and a circuit board according to claim 1, 2 or 3.

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