JPS63169567A - Probe for probe card - Google Patents

Probe for probe card

Info

Publication number
JPS63169567A
JPS63169567A JP139287A JP139287A JPS63169567A JP S63169567 A JPS63169567 A JP S63169567A JP 139287 A JP139287 A JP 139287A JP 139287 A JP139287 A JP 139287A JP S63169567 A JPS63169567 A JP S63169567A
Authority
JP
Japan
Prior art keywords
probe
probes
probe card
card
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP139287A
Other languages
Japanese (ja)
Inventor
Yuichi Takahashi
裕一 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP139287A priority Critical patent/JPS63169567A/en
Publication of JPS63169567A publication Critical patent/JPS63169567A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To easily correct the position shift of a probe for a probe card even if the probe shifts in position by using shape memory alloy for the probe. CONSTITUTION:A figure (a) shows that an inspection hole 3 is formed in the center part of the substrate 2 of the probe card 1 and probes 4 for the probe card which are made of shape memory alloy are arrayed and fixed penetrating the flank side of the substrate 2. Then the card 1 is set on an inspecting device and the probes 4 are brought into contact with electrodes 6 of an electronic device 5 shown in a figure (b) to perform specific inspection. The probes 4 deforms as the number of times of inspection increases and the tip parts of the probes 4 shift in position. For the purpose, the whole card 1 is heated up to temperature at which the shapes of the probes 4 are restored to the original shape, and thus the probes 4 are easily corrected to their positions.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、集積回路ウェハ、サーマルヘッド、イメージ
センサ等の電子デバイスの電気的特性検査装置に用いら
れるプローブカードに係わり、特に前記電子デバイスの
電極に接触させる探針に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a probe card used in an apparatus for testing the electrical characteristics of electronic devices such as integrated circuit wafers, thermal heads, and image sensors. It relates to a probe that is brought into contact with an electrode.

〔従来の技術〕[Conventional technology]

従来、集積回路ウェハ、サーマルヘッド、イメージセン
サ等の電子デバイスの電気的特性検査は、プローブカー
ドを用いて電子デバイスの電極にプローブカードの探針
を接触させて、該探針から引出された導線が接触されて
いる検査装置によって所定の検査を行っている。また、
電子デバイスをセットするステージが自動的に間欠移動
され、それに応じてプローブカード用探針が電子デバイ
スに対して接触したり離れたりするというa構を有する
自動検査装置が普及しており、1台の装置により多数回
の検査が容易にできるようになっている。
Conventionally, the electrical characteristics of electronic devices such as integrated circuit wafers, thermal heads, and image sensors have been tested by using a probe card to bring the probe of the probe into contact with the electrode of the electronic device, and then inspecting the conductive wire drawn out from the probe. A predetermined inspection is being performed by an inspection device that is in contact with the person. Also,
Automatic inspection equipment with a structure in which the stage on which the electronic device is set is automatically moved intermittently, and the probe for the probe card comes into contact with or separates from the electronic device accordingly, is in widespread use. This equipment makes it easy to perform multiple tests.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら、上記従来のプローブカード用探針は、多
数回にわたる電極との接触により或いは取り扱いの誤操
作により、容易に塑性変形してしまい探針の位置ずれが
生じて検査が不能になるという問題を生じていた。この
場合、探針の位置ずれを修正する必要があるが、従来よ
り用いられているタングステン等の材料の場合には、非
常に細い探針1本一本を曲げることにより位置ずれを修
正するか、探針を交換するという非常に煩雑な手作業を
要すると共に、検査コストを増大させるという問題を生
じていた。
However, the above-mentioned conventional probe card probes are easily plastically deformed due to repeated contact with the electrodes or due to incorrect handling, resulting in a problem in that the probes become misaligned and inspection becomes impossible. was. In this case, it is necessary to correct the positional deviation of the probe, but in the case of conventionally used materials such as tungsten, it is necessary to correct the positional deviation by bending each very thin probe one by one. However, this method requires very complicated manual work to replace the probe, and also increases inspection costs.

本発明は上記問題を解決するものであって、プローブカ
ード用探針の材料として形状記憶合金を用いることによ
り、探針の位置ずれが生しても、探針の加熱により容易
に元の位置に探針を修正することが可能なプローブカー
ド用探針を提供することを目的とする。
The present invention solves the above problem, and by using a shape memory alloy as the material of the probe for a probe card, even if the probe is misaligned, it can be easily returned to its original position by heating the probe. An object of the present invention is to provide a probe for a probe card that allows the probe to be modified.

〔問題点を解決するための手段〕[Means for solving problems]

そのために本発明のプローブカード用探針は、電子デバ
イスの電極に接触可能な多数の探針を存するプローブカ
ードにおいて、咳探針を形状記憶合金により形成したこ
とを特徴とするものである。
To this end, the probe for a probe card of the present invention is characterized in that the cough probe is formed of a shape memory alloy in a probe card having a large number of probes capable of contacting the electrodes of an electronic device.

〔作用〕[Effect]

本発明においては、検査回数の増大に伴いプローブカー
ド用探針の変形により、プローブカード用探針先端部の
位置ずれが生し、検査が不能になったり、検査の信転性
が低下した場合には、プローブカード全体を探針の形状
が元の形状に回復する温度まで加熱して探針の位置修正
を行うものである。
In the present invention, when the tip of the probe card tip becomes misaligned due to deformation of the probe card probe as the number of tests increases, the test becomes impossible or the reliability of the test decreases. In this method, the position of the probe is corrected by heating the entire probe card to a temperature at which the shape of the probe returns to its original shape.

〔実施例〕 以下、本発明の実施例について図面を参照しつつ説明す
る。
[Examples] Examples of the present invention will be described below with reference to the drawings.

第1図は本発明に係わるプローブカードの概略構成例を
示す斜視図、第2図はプローブカードにより検査される
電子デバイスを示す斜視図、第3図は本発明のプローブ
カード用探針の断面図である。
FIG. 1 is a perspective view showing a schematic configuration example of a probe card according to the present invention, FIG. 2 is a perspective view showing an electronic device to be tested by the probe card, and FIG. 3 is a cross-section of a probe for a probe card according to the present invention. It is a diagram.

第1図において、プローブカード1の基板2の中央部に
は、検査孔3が形成され、基板2の側面側を貫通して多
数のプローブカード用探針4が検査孔3に配列、固定さ
れている。
In FIG. 1, an inspection hole 3 is formed in the center of a substrate 2 of a probe card 1, and a large number of probe card probes 4 are arranged and fixed in the inspection hole 3 by penetrating the side surface of the substrate 2. ing.

該プローブカード用探針4は、所定の形状を予め記憶さ
せておき、その後に応力により変形が加えられても所定
の温度まで加熱すれば、元の記憶・させた形状に戻ると
いう形状記憶合金を用いたもので、形状記憶合金の例と
しては、NiTi、CuZnAl、CuAlN1等があ
り、また、元の形状に戻る温度と実際の検査時との温度
差が適当な値にあるものを選定する。このような形状記
憶合金をワイヤー状に加工し、その後所定の長さに切断
し、先端部の曲げ加工、研磨を行って第3図に示す形状
にする。そして、この形状を高温からの焼き入れにより
記憶させた後、検査する電子デバイスの電極の配置に応
じた配列になるように、プローブカード基板2に固定し
、探針4を導線を介して結線してプローブカードlを作
成するものである。
The probe 4 for the probe card is made of a shape memory alloy that stores a predetermined shape in advance and returns to its original memorized shape by heating to a predetermined temperature even if it is deformed by stress afterwards. Examples of shape memory alloys include NiTi, CuZnAl, CuAlN1, etc. Also, select one that has an appropriate temperature difference between the temperature at which it returns to its original shape and the temperature at the time of actual inspection. . Such a shape memory alloy is processed into a wire shape, then cut into a predetermined length, and the tip portion is bent and polished to form the shape shown in FIG. After this shape is memorized by hardening at a high temperature, it is fixed to the probe card board 2 so that the arrangement corresponds to the arrangement of the electrodes of the electronic device to be inspected, and the probes 4 are connected via conductive wires. Then, a probe card l is created.

このようにして作成したプローブカード1を、検査装置
にセットし、第2図で示す電子デバイス5の電極6にプ
ローブカード用探針4を接触させて所定の検査を行う。
The probe card 1 thus produced is set in an inspection device, and a predetermined inspection is performed by bringing the probe card probe 4 into contact with the electrode 6 of the electronic device 5 shown in FIG. 2.

検査回数の増大に伴いプローブカード用探針4の変形に
より、プローブカード用探針4先端部の位置ずれが生じ
、検査が不能になったり、検査の信鯨性が低下した場合
には、プローブカード1全体をプローブカード用探針4
の形状が元の形状に回復する温度まで加熱して探針の位
置修正を行うものである。
If the tip of the probe card probe 4 becomes misaligned due to deformation of the probe card probe 4 as the number of inspections increases, and inspection becomes impossible or reliability of the inspection decreases, the probe Probe card probe 4
The position of the probe is corrected by heating it to a temperature that restores the shape to its original shape.

例えば、TiとNiとの比が原子数比で49゜s:so
、sのT1Ni合金からなる線径125μmのワイヤー
を第3図に示す形状に加工した後、熱処理により形状を
記憶させた場合について説明する。この時の元の状態に
戻り始める温度は75度C1完全に元に戻る温度は92
度Cであった。
For example, the ratio of Ti and Ni is 49°s:so in terms of atomic ratio.
A case will be described in which a wire with a wire diameter of 125 μm made of a T1Ni alloy of . At this time, the temperature at which it begins to return to its original state is 75 degrees C1, and the temperature at which it completely returns to its original state is 92 degrees Celsius.
It was degree C.

この探針を第2図で示した電子デバイス5の電極6の配
置に対応するように、プローブカード基板2上に樹脂に
より固定してプローブカード1を作成し、このプローブ
カード1を用いて第2図で示した電子デバイス5に対し
てオーバードライブ幅0.1mmで4500回の接触を
おこなった所、最初の位置から平均37μm電極からず
れた探針4が3本存在した。これらの探針をプローブカ
ードごと95度Cに加熱した所、電極との位置ずれは平
均0.5μmに修正され、はぼ完全に最初の位置に戻り
、正常な検査ができるようになった。
This probe is fixed with resin on the probe card board 2 so as to correspond to the arrangement of the electrodes 6 of the electronic device 5 shown in FIG. 2 to create a probe card 1. When the electronic device 5 shown in FIG. 2 was contacted 4500 times with an overdrive width of 0.1 mm, there were three probes 4 that were deviated from the electrode by an average of 37 μm from the initial position. When these probes were heated to 95 degrees Celsius together with the probe card, the misalignment with the electrodes was corrected to an average of 0.5 μm, and they almost completely returned to their initial positions, allowing normal testing.

〔発明の効果〕 以上説明したように、本発明によれば、プローブカード
用探針の材料として形状記憶合金を用いることにより、
探針の変形により位置ずれが生じても、プローブカード
全体の加熱により容易に元の位置に探針を修正すること
ができ、従来のように、探針1本−木を曲げることによ
り位置ずれを修正するという緻密な作業や、高価な探針
を交換するという煩雑な手作業が不用となり、簡単な構
成により容易にプローブカード用探針の位置を修正する
ことができ、コストの低減および検査効率の向上を図る
ことができる。
[Effects of the Invention] As explained above, according to the present invention, by using a shape memory alloy as the material of the probe for a probe card,
Even if a positional shift occurs due to deformation of the probe, the probe can be easily corrected to its original position by heating the entire probe card. This eliminates the need for precise work to correct the probe and the complicated manual work of replacing expensive probes.The simple configuration allows the position of the probe card probe to be easily corrected, reducing costs and improving inspection. Efficiency can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係わるプローブカードの概略構成例を
示す斜視図、第2図はプローブカードにより検査される
電子デバイスを示す斜視図、第3図は本発明のプローブ
カード用探針の断面図である。 1・・・プローブカード、2・・・基板、4・・・プロ
ーブカード用探針、5・・・電子デバイス、6・・・電
極。 出 願 人  富士ゼロックス株式会社代理人弁理士 
 白 井 博 樹(外2名)第1図 一正板 第2図 1iB図
FIG. 1 is a perspective view showing a schematic configuration example of a probe card according to the present invention, FIG. 2 is a perspective view showing an electronic device to be inspected by the probe card, and FIG. 3 is a cross-section of a probe for a probe card according to the present invention. It is a diagram. DESCRIPTION OF SYMBOLS 1... Probe card, 2... Substrate, 4... Probe card probe, 5... Electronic device, 6... Electrode. Applicant: Fuji Xerox Co., Ltd. Representative Patent Attorney
Hiroki Shirai (2 others) Fig. 1 Main board Fig. 2 1iB

Claims (1)

【特許請求の範囲】[Claims] (1)電子デバイスの電極に接触可能な多数の探針を有
するプローブカードにおいて、該探針を形状記憶合金に
より形成したことを特徴とするプローブカード用探針。
(1) A probe card for a probe card having a large number of probes capable of contacting electrodes of an electronic device, characterized in that the probes are made of a shape memory alloy.
JP139287A 1987-01-07 1987-01-07 Probe for probe card Pending JPS63169567A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP139287A JPS63169567A (en) 1987-01-07 1987-01-07 Probe for probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP139287A JPS63169567A (en) 1987-01-07 1987-01-07 Probe for probe card

Publications (1)

Publication Number Publication Date
JPS63169567A true JPS63169567A (en) 1988-07-13

Family

ID=11500219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP139287A Pending JPS63169567A (en) 1987-01-07 1987-01-07 Probe for probe card

Country Status (1)

Country Link
JP (1) JPS63169567A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749356A (en) * 1991-09-03 1995-02-21 At & T Corp Wafer inspecting device
JP2011009240A (en) * 2010-10-01 2011-01-13 Shimadzu Corp Atmospheric pressure chemical ionization mass spectrometer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749356A (en) * 1991-09-03 1995-02-21 At & T Corp Wafer inspecting device
JP2011009240A (en) * 2010-10-01 2011-01-13 Shimadzu Corp Atmospheric pressure chemical ionization mass spectrometer

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