JPS63169011A - Leadless chip component - Google Patents
Leadless chip componentInfo
- Publication number
- JPS63169011A JPS63169011A JP62000911A JP91187A JPS63169011A JP S63169011 A JPS63169011 A JP S63169011A JP 62000911 A JP62000911 A JP 62000911A JP 91187 A JP91187 A JP 91187A JP S63169011 A JPS63169011 A JP S63169011A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- layer
- chip
- sintered body
- external electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 19
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 38
- 239000003990 capacitor Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000000919 ceramic Substances 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 15
- 238000005476 soldering Methods 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はチップ抵抗器あるいはチップコンデンサー等の
ようなリードレスチップ部品、特にその外部電極端子を
改良したリードレスチップ部品に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to leadless chip components such as chip resistors or chip capacitors, and particularly to leadless chip components with improved external electrode terminals.
近年電子じ器の軽薄短小化に対する要求が増大してくる
に従い、これら電子機器の電子回路の高密度化が必要不
可欠な要件となっている。In recent years, as the demand for lighter, thinner, and smaller electronic devices has increased, it has become an essential requirement to increase the density of electronic circuits in these electronic devices.
このような高密度化傾向の電子回路に使用される部品と
してリードレスチップ部品があるが、上記要求に伴われ
てそれらの必要性がますます増大している。Leadless chip components are used in electronic circuits that tend to become more dense, and the need for them is increasing in line with the above requirements.
このような状況の下にあって、例えば酸化ルテニウム系
のグレーズ抵抗体をアルミナ基板上に形成してチップ化
したチップ抵抗器や、チタン酸バリウム等の誘電体セラ
ミックを貴金属系の内部電極と交互に積層して焼結する
ことにより構成したチップコンデンサーに代表されるリ
ードレスチップ部品の需要が飛躍的に増大して来ている
。Under these circumstances, for example, chip resistors in which a ruthenium oxide-based glaze resistor is formed on an alumina substrate, and dielectric ceramics such as barium titanate are used alternately with noble metal-based internal electrodes. The demand for leadless chip components, such as chip capacitors constructed by laminating and sintering leadless chips, has been increasing dramatically.
従来、このようなり−ドレスチップ部品の外部電極端子
は、チップ部品素子の相対する両端部に設けた銀または
銀と他の貴金属との混合物とガラスとの焼結体から構成
されている。Conventionally, the external electrode terminals of such a dressed chip component are composed of a sintered body of glass and silver or a mixture of silver and other noble metals provided at opposite ends of the chip component element.
このようなリードレスチップ部品の代表例として積層型
のセラミックチップコンデンサーの断面図を第２図に示
す。FIG. 2 shows a cross-sectional view of a multilayer ceramic chip capacitor as a typical example of such a leadless chip component.
第２図において１はセラミック誘電体であり、２は内部
電極層であり、これらは図示する如く交互に積層し、焼
結することにより固片状のコンデンサー素子が構成され
ている。そしてこのようなコンデンサー素子の両端には
、図示する如く外部電極端子３が設けである。従来この
外部電極端子３は図示するように、通常銀−ガラスから
なる焼結体層３ａを形成し、通常その上にニッケル金属
層３ｂを被覆し、更にその上にはんだ金属層３ｃを被覆
してａＦＪｍ造にしである。In FIG. 2, 1 is a ceramic dielectric and 2 is an internal electrode layer, which are alternately laminated and sintered as shown in the figure, thereby constructing a solid piece-shaped capacitor element. As shown in the figure, external electrode terminals 3 are provided at both ends of such a capacitor element. Conventionally, as shown in the figure, this external electrode terminal 3 has a sintered body layer 3a usually made of silver-glass, usually coated with a nickel metal layer 3b, and further coated with a solder metal layer 3c. It is made of aFJm.
上記ニッケル金属層３ｂは、銀−ガラス焼結体Ｗ１３ａ
のみを有するセラミックチップコンデンサーを、目的と
する電子機器にはんだ付けすると、銀−ガラス焼結体層
３ａから銀が溶出してはんだ中に侵入する、いわゆる銀
くわれが生ずるのを防止するために設けである。ところ
がこのニッケル金属層３ｂを設けただけで電子機器にこ
のセラミックチップコンデンサーをはんだイリけしよう
とすると、ニッケル金属層３ｂのはんだ付は性が悪いた
め、はんだ付は作業が困難になる。このため、予めはん
だ金属層３Ｃをニッケル金属層３ｂ上に設けておくこと
により、そのはんだ付は性を改良している。The nickel metal layer 3b is a silver-glass sintered body W13a
In order to prevent so-called silver cracks from occurring, in which silver is eluted from the silver-glass sintered body layer 3a and enters the solder when a ceramic chip capacitor having a ceramic chip is soldered to the intended electronic device. It is a provision. However, when trying to solder this ceramic chip capacitor to an electronic device by simply providing the nickel metal layer 3b, the soldering process becomes difficult because the nickel metal layer 3b has poor soldering properties. Therefore, by providing the solder metal layer 3C on the nickel metal layer 3b in advance, the soldering properties are improved.
しかしながら、上述したセラミックチップコンデンサー
に代表されるリードレスチップ部品の外部電極端子の構
成では、ニッケル金属層３ｂのはんだ付は性が劣るため
、その表面に設けたはんだ金属層３Ｃを比較的厚くかつ
均一に被覆して設けなければならなかった。However, in the structure of the external electrode terminal of a leadless chip component such as the ceramic chip capacitor mentioned above, the solderability of the nickel metal layer 3b is poor, so the solder metal layer 3C provided on the surface is relatively thick and It had to be uniformly coated.
ところがはんだ金属Ｔｉ３ｃを厚くめっきすると、はん
だ金属がセラミックチップコンデンサー素子の表面の不
要部分にも析出付着して、いわゆるはみ出し不良が発生
し易くなる問題を有している。However, when the solder metal Ti3c is plated thickly, there is a problem in that the solder metal deposits and adheres to unnecessary portions of the surface of the ceramic chip capacitor element, making it easy to cause so-called extrusion defects.
またかかるセラミックチップコンデンサーを、目的とす
る電子機器に装着するときにはかかるチップ部品を通常
筒状のマガジン内に多数積み重ね充填した状態で、マガ
ジンの下方からビンでチップ部品を押し上げて、１個毎
に電子機器のプリント基板に装着する方法がとられてい
る。Furthermore, when installing such ceramic chip capacitors into a target electronic device, a large number of such chip parts are usually piled up in a cylindrical magazine, and the chip parts are pushed up with a bottle from the bottom of the magazine, one by one. One method is to attach it to the printed circuit board of electronic equipment.
このとき上述したはんだ金ｌ５３ｅが厚く被覆し設けら
れていると、はんだ金属層３Ｃの表面が軟化し、マガジ
ン内でチップ部品どうしが相互に接着してしまうことが
あり、このためプリント基板に目的とする１個のチップ
部品が取り付けられず、相互接着したままで２個または
３個と不必要なチップ部品も同時に取り付けられるとい
う不都合を生ずることがあった。At this time, if the solder metal layer 153e described above is thickly coated, the surface of the solder metal layer 3C may become soft and the chip components may adhere to each other within the magazine. This may result in the inconvenience that one chip component is not attached, and two or three unnecessary chip components are also attached at the same time while remaining glued to each other.
従って本発明の目的は、上述した問題点を解決すること
にあり、チップ部品のプリント基板へのはんだ付は性を
改良すると共に、装着時の相互接着による不都合をなく
した外部電極端子を有するリードレスチップ部品を提供
することにある。Therefore, an object of the present invention is to solve the above-mentioned problems, and to improve the soldering properties of chip components to a printed circuit board, and to eliminate the inconvenience caused by mutual adhesion during mounting, the leads have external electrode terminals. Our goal is to provide chipless parts.
本発明は外部電極端子が銀−ガラス焼結体からなる層を
有し、かつ上記銀−ガラス焼結体層の表面に楊−ニッケ
ル合金層を被覆したリードレスチップ部品である。The present invention is a leadless chip component in which the external electrode terminal has a layer made of a silver-glass sintered body, and the surface of the silver-glass sintered body layer is coated with a Yang-nickel alloy layer.
上記錫−ニッケル今金層としては錫６０〜８０重１Ａ％
およびニッケル４０〜２０型名４％からなる合金を使用
する。The above tin-nickel metal layer is made of 60 to 80% tin and 1A% by weight.
An alloy consisting of nickel 40-20 type name 4% is used.
本発明によれば、銀−ガラス焼結体層の上に上述した如
く屯−ニッケル合金の層を設けたことにより、従来のよ
うなはんだ金”Ｑ ＪＦｉを予め設けておかなくても、
プリント基板へのはんだ付は性は良好となり、また実装
時にマガジン内に複数のチップ部品を積み重ねてもチッ
プ部品の外部電極端子どうしの接着による不都合が生じ
ることがない。According to the present invention, by providing the layer of the tun-nickel alloy as described above on the silver-glass sintered body layer, it is not necessary to previously provide the solder gold "QJFi" as in the conventional case.
The soldering properties to the printed circuit board are good, and even when a plurality of chip components are stacked in a magazine during mounting, there is no problem caused by adhesion of the external electrode terminals of the chip components.
なお５ｑ−ニッケル合金の組成において、錫が６０重量
％より少なくなると、即ちニッケルが４０重ｑ％より大
となると、はんだ付けするときのはんだによる濶れが悪
くなり、はんだ付は性が悪くなるので好ましくない。ま
た錫が８０重量％より多くなり、ニッケルが２０重ｒｃ
％より少なくなると、はんだ付は作業時蚤こ銀−ガラス
焼結体層からの銀くわれが多くなるので、好ましくない
。In addition, in the composition of the 5q-nickel alloy, if the tin content is less than 60% by weight, that is, if the nickel content is greater than 40% by weight, the solder will not swell during soldering, and the soldering properties will deteriorate. So I don't like it. Also, tin is more than 80% by weight, and nickel is 20% by weight.
If it is less than %, it is undesirable because more silver will be chipped from the sintered silver-glass layer during soldering.
以下に本発明によるリードレスチップ部品の一例である
セラミックチップコンデンサーについて図面を参照して
説明する。第１図はセラミックチップコンデンサーの断
面図である。A ceramic chip capacitor, which is an example of a leadless chip component according to the present invention, will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a ceramic chip capacitor.
第１ｃ２Ｉにおいて４はセラミック誘電体であり、５は
内部電極層であり、６は外部電極端子であり、外部電極
端子６は銀−ガラス焼結体ｐ６ｍと、その表面に錫−ニ
ッケル合金１’Ｈ６ｂを被覆した構成になっている。In the first c2I, 4 is a ceramic dielectric, 5 is an internal electrode layer, 6 is an external electrode terminal, and the external electrode terminal 6 is made of a silver-glass sintered body p6m and a tin-nickel alloy 1' It has a structure coated with H6b.
以上のように構成されたチップコンデンサーの製造は次
の如くして行なう。The chip capacitor constructed as described above is manufactured as follows.
第１図に示すように、チタン酸バリウムまたは酸化チタ
ン等を主成分とするセラミック誘電体４と、パラジウム
または白金等の貴金属の内部型ｆ４層５を交互に積層し
て焼結することにより固片状のセラミックコンデンサー
素子を作る。As shown in FIG. 1, ceramic dielectrics 4 mainly composed of barium titanate or titanium oxide, etc., and internal mold f4 layers 5 of noble metals, such as palladium or platinum, are alternately laminated and sintered to solidify. Make a flaky ceramic capacitor element.
このコンデンサー素子の相対する両端部に外部電極端子
６を形成するが、その方法は先ず銀または銀−パラジウ
ム等の金、属扮をガラスフリットと共にペースト状にし
、これをコンデンサー素子の相対する両端部にぷ択的に
塗布して８００〜９００℃の温度で焼成し、銀−ガラス
焼結体からなる電極層を形成する。External electrode terminals 6 are formed on opposite ends of the capacitor element. First, gold or metal such as silver or silver-palladium is made into a paste form with glass frit, and then this is applied to the opposite ends of the capacitor element. The electrode layer is selectively applied and fired at a temperature of 800 to 900°C to form an electrode layer made of a silver-glass sintered body.
次にこの銀−ガラス焼結体層６ａの表面に、例えばバレ
ルめつき法によって錫−ニッケル合金層６ｂを析出させ
て、外部電極端子６を構成した。Next, a tin-nickel alloy layer 6b was deposited on the surface of this silver-glass sintered body layer 6a by, for example, a barrel plating method to form an external electrode terminal 6.
上記暢−ニッケル合金Ｊｉ’＋１６ ｂは銀−ガラス焼
結体層６ａを保獲し、耐熱性を向上させ、はんだ付は時
の銀のマイブレーヨン、いわゆる銀くわれを防止すると
共に、はんだ付は性を改良する。The above-mentioned smooth-nickel alloy Ji'+16b retains the silver-glass sintered body layer 6a, improves heat resistance, and prevents silver mirayon, so-called silver cracking, during soldering. improves sex.
上記実施例のセラミックチップコンデンサーの外部電極
端子６の錫−ニッケル合金層６ｂは長期保存をしたとき
変色することがあるので、この変色防止のために、錫−
ニッケル合金層６ｂの表面に薄くはんだ金属層を被覆し
てもよい。The tin-nickel alloy layer 6b of the external electrode terminal 6 of the ceramic chip capacitor of the above embodiment may change color when stored for a long period of time.
The surface of the nickel alloy layer 6b may be coated with a thin solder metal layer.
かかるはんだ金１層は不均一なものでも良好なはんだ付
は性が得られることが判った。It has been found that even if the single layer of solder metal is non-uniform, good soldering properties can be obtained.
本実施例ではセラミックチップコンデンサーを例として
示したが、本発明はかかるコンデンサーに限定されず、
銀−ガラス焼結体からなる外部電極端子を有するその他
のリードレスチップ部品についても適用しうろことは明
らかである。Although a ceramic chip capacitor was shown as an example in this embodiment, the present invention is not limited to such a capacitor.
It is obvious that the present invention can also be applied to other leadless chip components having external electrode terminals made of silver-glass sintered bodies.
本発明によるり−ドレスチップ部品は、銀−ガラス焼結
体によって構成された層の表面に錫−ニッケル合金層を
ＪｔＥｍ形成したことにより、銀−ガラス焼結体層のは
んだ付は時の銀くわれを防止できると共に、他の部品へ
のはんだ付は性も改良される。また従来の如く厚いはん
だ金属層を設ける必要がないため、はんだめっきによる
はみ出し不良は全くなくなり、更にかかるチップ部品を
マガジン内に積重し、プリント基板等に実装するとき、
チップ部品の外部電極端子における相互の接着は生じな
く、従って従来の如く２個以上のチップ部品が同時に装
着されるという不良事故をなくすることができる。The silver-dressed chip component according to the present invention has a tin-nickel alloy layer formed on the surface of the layer composed of the silver-glass sintered body, so that the soldering of the silver-glass sintered body layer is easy In addition to preventing bending, soldering properties to other parts are also improved. In addition, since there is no need to provide a thick solder metal layer as in the past, there is no problem with protrusion due to solder plating, and when such chip components are stacked in a magazine and mounted on a printed circuit board, etc.
Mutual adhesion does not occur at the external electrode terminals of the chip components, and therefore, it is possible to eliminate defects caused by attaching two or more chip components at the same time as in the prior art.
第１図は本発明の一実施例であるセラミックチップコン
デンサーの断面図であり、第２図は従来のセラミックコ
ンデンサーの断面図である。
４−ｍ−セラミック誘電体、５−一一内部電極層、６一
−−外部電極端子、６ａ−−−銀一ガラス焼結体層、５
ｂ−−−ｉ−ニッケル合金層。FIG. 1 is a sectional view of a ceramic chip capacitor according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional ceramic capacitor. 4-m-ceramic dielectric, 5-11 internal electrode layer, 61--external electrode terminal, 6a--silver glass sintered body layer, 5
b---i-Nickel alloy layer.
Claims (1)
、かつ上記銀−ガラス焼結体層の表面に錫−ニッケル合
金層を被覆したことを特徴とするリードレスチップ部品
。 ２、錫−ニッケル合金層が錫６０〜８０重量％およびニ
ッケル４０〜２０重量％の合金からなる特許請求の範囲
第１項記載のリードレスチップ部品。[Claims] 1. The external electrode terminal has a layer made of a silver-glass sintered body, and the surface of the silver-glass sintered body layer is coated with a tin-nickel alloy layer. Leadless chip components. 2. The leadless chip component according to claim 1, wherein the tin-nickel alloy layer comprises an alloy containing 60 to 80% by weight of tin and 40 to 20% by weight of nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62000911A JPS63169011A (en) | 1987-01-06 | 1987-01-06 | Leadless chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62000911A JPS63169011A (en) | 1987-01-06 | 1987-01-06 | Leadless chip component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63169011A true JPS63169011A (en) | 1988-07-13 |
Family
ID=11486859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62000911A Pending JPS63169011A (en) | 1987-01-06 | 1987-01-06 | Leadless chip component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63169011A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020102548A (en) * | 2018-12-21 | 2020-07-02 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6223436B2 (en) * | 1980-01-18 | 1987-05-22 | Gen Motors Corp |
-
1987
- 1987-01-06 JP JP62000911A patent/JPS63169011A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6223436B2 (en) * | 1980-01-18 | 1987-05-22 | Gen Motors Corp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020102548A (en) * | 2018-12-21 | 2020-07-02 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
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