JPS63165132A - Composite material consisting of graphite and copper - Google Patents
Composite material consisting of graphite and copperInfo
- Publication number
- JPS63165132A JPS63165132A JP31549486A JP31549486A JPS63165132A JP S63165132 A JPS63165132 A JP S63165132A JP 31549486 A JP31549486 A JP 31549486A JP 31549486 A JP31549486 A JP 31549486A JP S63165132 A JPS63165132 A JP S63165132A
- Authority
- JP
- Japan
- Prior art keywords
- graphite
- copper
- linear expansion
- insert material
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 62
- 229910002804 graphite Inorganic materials 0.000 title claims description 60
- 239000010439 graphite Substances 0.000 title claims description 60
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 43
- 229910052802 copper Inorganic materials 0.000 title claims description 43
- 239000010949 copper Substances 0.000 title claims description 43
- 239000002131 composite material Substances 0.000 title claims description 20
- 239000000463 material Substances 0.000 claims description 47
- 238000005219 brazing Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000009792 diffusion process Methods 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 2
- 230000035882 stress Effects 0.000 description 9
- 238000001816 cooling Methods 0.000 description 6
- 238000005477 sputtering target Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野）
本発明は、例えばスパッタリングターゲットやＸ１ｍ発
生用ターゲット等に使用される黒鉛と銅からなる複合材
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite material made of graphite and copper used, for example, in sputtering targets, targets for X1m generation, and the like.
黒鉛と銅の熱膨張率は互いに大きく異なっている。例え
ば銅の線膨張係数は約１８Ｘ １０４であるのに対し、
黒鉛のｍ膨張係数は約７Ｘ１０４である。The thermal expansion coefficients of graphite and copper are significantly different from each other. For example, the coefficient of linear expansion of copper is approximately 18×104, while
The m-expansion coefficient of graphite is approximately 7X104.
このため、黒鉛と銅をａ％瀧（約６００〜１０００℃）
で硬ろう付けや拡散接合等の方法で接合すると、冷却過
程において黒鉛と銅の熱膨張差によって相対的な寸法差
を生じ、残留応力が発生する。このため黒鉛と銅からな
る複合材は、その寸法が小さければ残留応力の影響は小
さく接合は可能であるが、実用的な大きさになると残留
応力の影響によって黒鉛に大きな引張り応力を生じる。For this reason, graphite and copper are mixed at a% temperature (about 600 to 1000℃).
If they are joined using methods such as hard brazing or diffusion bonding, a relative dimensional difference will occur due to the difference in thermal expansion between graphite and copper during the cooling process, and residual stress will occur. For this reason, if the composite material made of graphite and copper is small, the influence of residual stress is small and bonding is possible, but when it reaches a practical size, the influence of residual stress causes large tensile stress in the graphite.
黒鉛は引張り応力に弱いため、接合後にクラックが入り
、破壊してしまう。例えば、直径２００ ｍの円盤形テ
ストピースを９００℃で接合し、室温まで冷却すると、
銅板の直径は約４ａｌ収縮するが、黒鉛の直径は約１ａ
ｎＬか収縮しない。その結果、黒鉛と銅は厚み方向に撓
み、黒鉛に放射状のクランクが発生してついには破壊に
至る。Graphite is weak against tensile stress, so it cracks and breaks after joining. For example, when a disk-shaped test piece with a diameter of 200 m is joined at 900°C and cooled to room temperature,
The diameter of the copper plate shrinks by about 4al, but the diameter of graphite shrinks by about 1a.
nL or no contraction. As a result, the graphite and copper bend in the thickness direction, causing radial cranks to occur in the graphite, eventually leading to its destruction.
このため現状では、黒鉛と銅を結合するための手段とし
て、ボルト締め等による機械的締結や、樹脂系接着剤に
よる接合、あるいはインジウムや半田等を使用した軟ろ
う付けに頼っている。For this reason, at present, as means for joining graphite and copper, we rely on mechanical fastening such as bolting, joining with resin adhesives, or soft brazing using indium, solder, or the like.
しかしながら上述した従来技術では、次のような問題点
がある。However, the above-mentioned conventional technology has the following problems.
例えば機械的な締結方法では、高温に熱せられた時の膨
張あるいは冷却に伴う収縮等の熱的衝撃によって締結力
が低下しやすい。また、エポキシ系やナイロン系接着剤
などの樹脂系接着剤では接着強度に難があり、しかも耐
熱性がない。また真空中での使用において不純物ガスを
発生する等の問題がある。一方、軟ろう付けでは接合強
度が低いとともに、耐熱性に劣るといった問題があった
。For example, in a mechanical fastening method, the fastening force tends to decrease due to thermal shock such as expansion when heated to high temperature or contraction due to cooling. Furthermore, resin adhesives such as epoxy adhesives and nylon adhesives have difficulty in adhesive strength and lack heat resistance. Further, there are problems such as generation of impurity gas when used in a vacuum. On the other hand, soft brazing has problems such as low joint strength and poor heat resistance.
上記問題点を解決するために本発明の複合材は、黒鉛と
銅（ｒ！４合金も含む）との間に互いに熱膨張率の異な
る金属からなる２枚のインサート材を厚み方向に重ねて
介在させる。そして黒鉛側に位置する第１のインサート
材は、その線膨張係数α１が銅の線膨張係数αＣＵより
も小さく、かつ黒鉛の線膨張係数αＣよりも大きい金属
からなる。また銅側に位置する第２のインサート材は、
その線膨張係数α２が黒鉛の線膨張係数αＣと同等もし
くは黒鉛の線膨張係数αＣよりも小さく、かつ上記第１
のインサート材の線膨張係数α１よりも小さい金属から
なる。これら２種類のインサート材を介し、過当な荷重
を負荷した状態で６００℃ないし１０００℃まで加熱す
ることにより、上記黒鉛と銅を硬ろう付けまたは拡散接
合によって互いに結合させるようにしたものである。In order to solve the above problems, the composite material of the present invention is made by stacking two insert materials made of metals with different coefficients of thermal expansion between graphite and copper (including R!4 alloy) in the thickness direction. intervene. The first insert material located on the graphite side is made of a metal whose linear expansion coefficient α1 is smaller than the linear expansion coefficient αCU of copper and larger than the linear expansion coefficient αC of graphite. The second insert material located on the copper side is
The linear expansion coefficient α2 is equal to or smaller than the linear expansion coefficient αC of graphite, and the first
It is made of a metal whose coefficient of linear expansion α1 is smaller than that of the insert material. The graphite and copper are bonded to each other by hard brazing or diffusion bonding by heating to 600°C to 1000°C with an excessive load applied through these two types of insert materials.
銅と黒鉛を硬ろう付けや拡散接合等のような高温で接合
すると、銅の熱膨張率が黒鉛よりも大きいため、冷却中
に銅が黒鉛よりも大きく収縮する。When copper and graphite are bonded together at high temperatures, such as by hard brazing or diffusion bonding, the coefficient of thermal expansion of copper is greater than that of graphite, so copper contracts more than graphite during cooling.
このため何の対策も講じていない場合には黒鉛中に過大
な引張り応力が生じ、ついには破壊に至る。For this reason, if no measures are taken, excessive tensile stress will occur in the graphite, eventually leading to its destruction.
しかるに本発明の複合材は、上述した線膨張係数α１．
α２をもつ金属製インサート材を２段階に分けて黒鉛と
銅との間に挿入しておくことによって、冷却過程で黒鉛
に作用する熱応力を効果的に低減させることができるよ
うになり、実用的な大きさの黒鉛と銅からなる複合材の
＾温接合が可能となった。However, the composite material of the present invention has the above-mentioned linear expansion coefficient α1.
By inserting a metal insert material with α2 between graphite and copper in two stages, it is now possible to effectively reduce the thermal stress that acts on graphite during the cooling process. It has become possible to bond a composite material made of graphite and copper with a size of
（実施例）
第１図に示された本発明の第１実施例の複合材１は、口
径３０ｍの円盤状のテストピースであり、−面側に黒鉛
２が、また他面側に銅３が設けられている。そして黒鉛
２と銅３との間には、黒鉛２側に第１のインサート材４
が、また銅３側に第２のインサート材５が介在させられ
ている。更には、黒鉛２と第１のインサート材４との間
に硬ろう材６が設けられている。また、各インサート材
４゜５１！ｌｌ、および１ｉｉ３と第２のインサート材
５との間にもそれぞれ硬ろう材７．８が設けられている
。(Example) The composite material 1 of the first example of the present invention shown in FIG. is provided. A first insert material 4 is placed between the graphite 2 and the copper 3 on the graphite 2 side.
However, a second insert material 5 is also interposed on the copper 3 side. Furthermore, a hard brazing material 6 is provided between the graphite 2 and the first insert material 4. Also, each insert material is 4゜51! A hard brazing material 7.8 is also provided between ll and ll and the second insert material 5, respectively.
これらの硬ろう材６，７．８は、いずれもニッケル製で
あり、その厚さは例えば５ないし５００μｍ位が適当で
ある。硬ろう材６．７．８は、必要とされる耐熱性に応
じてニッケルの代りに銀あるいは銅系の金属を採用して
もよい。この実施例の場合、黒鉛２の厚さは一例として
７ａｌＮ銅３の厚さは４ｊ１１１、インサート材４．５
の厚さはいずれも０．５履とした。These hard soldering materials 6, 7.8 are both made of nickel, and their thickness is suitably about 5 to 500 μm, for example. The hard solder material 6.7.8 may be made of silver or copper metal instead of nickel depending on the required heat resistance. In this example, the thickness of the graphite 2 is 7alN, the thickness of the copper 3 is 4j111, and the thickness of the insert material is 4.5.
The thickness of each was set to 0.5 shoes.
黒鉛２側に位置する第１のインサート材４はチタン製で
あり、その線膨張係数α１はおおむね８Ｘ１０４である
。ただし、チタンの代りにバナジウム等のように線膨張
係数がＩＱＸ １０”以下の金属を使用してもよい。銅
３側に位置する第２のインサート材５はモリブデン製で
あり、その線膨張係数α２はおおむね６Ｘ１０’である
。ただし、モリブデンの代りにタングステン等のような
線膨張係数が６Ｘ１０４以下の金属を使用してもよい。The first insert material 4 located on the graphite 2 side is made of titanium, and its linear expansion coefficient α1 is approximately 8×104. However, instead of titanium, a metal with a linear expansion coefficient of IQX 10" or less, such as vanadium, may be used. The second insert material 5 located on the copper 3 side is made of molybdenum, and its linear expansion coefficient α2 is approximately 6×10′. However, instead of molybdenum, a metal having a linear expansion coefficient of 6×10 4 or less, such as tungsten, may be used.
いずれにしても、インサート材４，５には硬ろう材６゜
７．８よりも耐熱性の高い金属が使用される。In any case, the insert materials 4 and 5 are made of a metal having higher heat resistance than the hard soldering material 6°7.8.
上記インサート材４，５と硬ろう材６．７．８を、黒鉛
２と銅３との間に上記の配列で重ねたのち、適当な荷重
を付加しながら、硬ろう材６，７゜８が溶融する温度ま
で加熱・保持することにより。After stacking the insert materials 4, 5 and the hard solder metal 6, 7, 8 in the above arrangement between the graphite 2 and the copper 3, apply an appropriate load to the hard solder metal 6, 7.8. By heating and holding it to a temperature where it melts.
黒鉛２と銅３．およびインサート材４．５の硬ろう付け
を同時に行なう。Graphite 2 and copper 3. And the hard brazing of the insert material 4.5 is performed at the same time.
上記複合材１に使われている第１のインサート材４の線
膨張係数α１は、黒鉛２の線膨張係数αＣよりも多少大
きい。このため、高温に加熱された状態で接合すると、
常温まで冷却された時に黒鉛２に多少の圧縮応力が生じ
る。黒鉛２は引張り方向の力には弱いが圧縮に対しては
ある程度の強度を発揮するため、このように適度な圧縮
応力の付与は黒鉛２を割れにくくする上で有効である。The linear expansion coefficient α1 of the first insert material 4 used in the composite material 1 is somewhat larger than the linear expansion coefficient αC of the graphite 2. For this reason, if joined while heated to a high temperature,
When the graphite 2 is cooled to room temperature, some compressive stress is generated in the graphite 2. Graphite 2 is weak against force in the tensile direction, but exhibits a certain degree of strength against compression, so applying an appropriate compressive stress in this manner is effective in making graphite 2 difficult to crack.
また、銅３側に設けられた第２のインサート材５の線膨
張係数α２は黒鉛２の線膨張係数αＣ以下としており、
この第２のインサート材５を＃＃３に接合させているか
ら、高温で接合された銅３が常温に戻る際に収縮しよう
としても、その熱応力が黒鉛２側に影響することを緩和
できる。このように２段階のインサート材４．５を介在
させることで、黒鉛２に生じる引張り応力の低減化が図
れるようになり、黒鉛２のクランクの発生と破壊を防止
できるものである。なお、黒鉛２の線膨張係数をαＣ，
第１のインサート材４の線膨張係数をα１、第２のイン
サート材５の線膨張係数をα２、銅３の線膨張係数をα
ＣＵとした場合、黒鉛２のクラック発生の防止に効果の
ある各材料の線膨張係数の概略値の関係は次の通りであ
る。Further, the linear expansion coefficient α2 of the second insert material 5 provided on the copper 3 side is set to be less than the linear expansion coefficient αC of the graphite 2,
Since this second insert material 5 is bonded to ##3, even if the copper 3 bonded at high temperature tries to shrink when it returns to room temperature, the influence of the thermal stress on the graphite 2 side can be alleviated. . By interposing the two-stage insert material 4.5 in this manner, the tensile stress generated in the graphite 2 can be reduced, and the generation and destruction of graphite 2 can be prevented. Note that the linear expansion coefficient of graphite 2 is αC,
The linear expansion coefficient of the first insert material 4 is α1, the linear expansion coefficient of the second insert material 5 is α2, and the linear expansion coefficient of the copper 3 is α
In the case of CU, the relationship between the approximate values of the coefficient of linear expansion of each material effective in preventing the occurrence of cracks in graphite 2 is as follows.
α２≦ａｃ ＜ｃｘｌ ＜ ＜ａｃ ＋３ ｘ１０４
） ＜ ＜ａｃｕまた、黒鉛２の厚みをｔＣ１第１のイ
ンサート材４の厚みをｔｌ、第２のインサート材５の厚
みをｔ２、銅３の厚みをｔｃｕとした場合、各々の厚さ
は以下の範囲が適している。α2≦ac <cxl <<ac +3 x104
) << acu In addition, if the thickness of the graphite 2 is tC1, the thickness of the first insert material 4 is tl, the thickness of the second insert material 5 is t2, and the thickness of copper 3 is tcu, each thickness is as follows. range is suitable.
ｔｃ≧２１１１１
０．１ｍｍ≦ｔ１≦３ｊＩｌｌ
Ｏ０ｌａｗ≦ｔ２≦３ａｍ
ｔｃｕ≧１Ｍ
上記複合材１は、硬ろう付けによって黒鉛２と銅３およ
びインサート材４．５が高い強度で接合されており、し
かも耐熱性に浸れている。従って上記複合材１は、例え
ば炭素のスパッタリングターゲットやＸ線発生用ターゲ
ットとしての要求を充分ｍ足する。tc≧21111 0.1mm≦t1≦3jIll O0law≦t2≦3am tcu≧1M The above composite material 1 has graphite 2, copper 3, and insert material 4.5 joined with high strength by hard brazing, and is heat resistant. I'm immersed in sex. Therefore, the composite material 1 sufficiently satisfies the requirements as, for example, a carbon sputtering target or an X-ray generation target.
例えばスパッタリングターゲットはスパッタリング中に
表面が高温に加熱されるために黒鉛が使用され、その反
対側に冷却効率の良い銅が使用されている。また、スパ
ッタリング・スピードを速くするためには優れた耐熱性
が要求される。上記複合材１は、こうしたスパッタリン
グターゲットとして充分使用に耐える耐熱性を有してい
る。For example, a sputtering target uses graphite because its surface is heated to a high temperature during sputtering, and copper, which has good cooling efficiency, is used on the opposite side. Furthermore, excellent heat resistance is required to increase the sputtering speed. The composite material 1 has sufficient heat resistance to be used as such a sputtering target.
また上記複合材１は、長波長の炭素の特性Ｘ線を得るた
めのターゲットとしても好適である。Ｘ線ターゲットは
黒鉛側に電子線が照射される時に温度が数百℃まで上昇
するために、その反対側は水冷等によって冷却する必要
がある。しかもターゲットは高速回転させられているた
め、高い接合強度が必要となる。これらの要求を上記複
合材１は満足することができる。The composite material 1 is also suitable as a target for obtaining long wavelength characteristic X-rays of carbon. When the graphite side of the X-ray target is irradiated with an electron beam, the temperature rises to several hundred degrees Celsius, so the opposite side needs to be cooled with water or the like. Moreover, since the target is rotated at high speed, high bonding strength is required. The composite material 1 can satisfy these requirements.
第２図は本発明の第２実施例を示し、この複合材１は外
径が２００ ｍのリング状に形成されている。FIG. 2 shows a second embodiment of the invention, in which the composite material 1 is formed into a ring shape with an outer diameter of 200 m.
その積層構造は第１実施例と同様であるが、黒鉛２の厚
さは７ｍ、銅３の厚さは４１Ｍ１．インサート材４．５
の厚さはそれぞれ１履である。第１実施例で述べたと同
様に、第１のインサート材４は、チタン（またはバナジ
ウム等）からなり、第２のインサート材５はモリブデン
（またはタングステン等）からなる。また、図示してい
ないが黒鉛２と銅３およびインサート材４．５の間には
、第１実施例と同様の硬ろう材６．７．８が介在されて
いる。The laminated structure is the same as that of the first embodiment, but the thickness of the graphite 2 is 7 m, and the thickness of the copper 3 is 41 M1. Insert material 4.5
The thickness of each is one shoe. As described in the first embodiment, the first insert material 4 is made of titanium (or vanadium, etc.), and the second insert material 5 is made of molybdenum (or tungsten, etc.). Further, although not shown, a hard brazing material 6.7.8 similar to that of the first embodiment is interposed between the graphite 2, the copper 3, and the insert material 4.5.
この実施例では直径２００ ｍと大形のスパッタリング
ターゲットであるにもかかわらず、高い耐熱性を示し、
従来品の２．５倍のエネルギーをスパッタリング時に内
筒しても全く問題を生じることなく使用でき、被スパツ
タリング物への高性能の成膜が可能であった。Although this example is a large sputtering target with a diameter of 200 m, it exhibits high heat resistance.
It was possible to use 2.5 times the energy of the conventional product in the inner tube during sputtering without causing any problems, and it was possible to form a high-performance film on the object to be sputtered.
なお上記各実施例では硬ろう付げによって各部材を接合
するようにしているが、本発明はａ％湯温度下行なわれ
る拡散接合によって黒鉛２と銅３およびインサート材４
．５を接合する場合にも同様に適用できる。In each of the above embodiments, each member is joined by hard brazing, but in the present invention, graphite 2, copper 3, and insert material 4 are joined by diffusion bonding at a temperature of a% hot water.
．． The same can be applied to the case of joining 5.
本発明によれば、黒鉛と鋼を硬ろう付けや拡散接合で接
合した場合に冷却過程で黒鉛にクラックが生じることを
防止でき、実用的な大きさの黒鉛と銅からなる複合材が
得られる。この複合材は耐熱性に浸れかつ接合強度が高
く、しかも真空雰囲気中で使用されても不純物ガスを発
生しないため、スパッタリングターゲットやＸ線発生用
ターゲットとして優れた性能を発揮する。According to the present invention, when graphite and steel are joined by hard brazing or diffusion bonding, cracks can be prevented from occurring in the graphite during the cooling process, and a composite material made of graphite and copper of a practical size can be obtained. . This composite material has excellent heat resistance and high bonding strength, and does not generate impurity gases even when used in a vacuum atmosphere, so it exhibits excellent performance as a sputtering target or an X-ray generation target.
第１図は本発明の第１実施例を示す複合材の断面図、第
２図は本発明の第２実施例を示す複合材の断面図である
。
１・・・複合材、２・・・黒鉛、３・・・銅、４・・・
第１のインサート材、５・・・第２のインサート材、６
，７゜８・・・硬ろう材。
出願人代理人 弁理士 鈴江武彦
１棧合１オ
第１図
第２図FIG. 1 is a cross-sectional view of a composite material showing a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of a composite material showing a second embodiment of the present invention. 1... Composite material, 2... Graphite, 3... Copper, 4...
First insert material, 5... Second insert material, 6
,7゜8... Hard brazing material. Applicant's Representative Patent Attorney Takehiko Suzue 1.1 O. Figure 1 Figure 2
Claims (1)
２枚のインサート材を厚み方向に重ねて介在させ、黒鉛
側に位置する第１のインサート材はその線膨張係数が銅
の線膨張係数よりも小さくかつ黒鉛の線膨張係数よりも
大きい金属からなり、また銅側に位置する第２のインサ
ート材はその線膨張係数が黒鉛の線膨張係数と同等もし
くは黒鉛の線膨張係数よりも小さくかつ上記第１のイン
サート材の線膨張係数よりも小さい金属からなり、これ
ら２種類のインサート材を介して上記黒鉛と銅を硬ろう
付けまたは拡散接合によって互いに結合させたことを特
徴とする黒鉛と銅からなる複合材。Two insert materials made of metals with different coefficients of thermal expansion are interposed between graphite and copper, stacked in the thickness direction, and the first insert material located on the graphite side has a linear expansion coefficient that is equal to that of copper. The second insert material is made of a metal that is smaller than the coefficient of linear expansion and larger than the coefficient of linear expansion of graphite, and the second insert material located on the copper side has a coefficient of linear expansion that is equal to or smaller than the coefficient of linear expansion of graphite. Graphite and copper are made of a metal having a coefficient of linear expansion smaller than that of the first insert material, and the graphite and copper are bonded to each other by hard brazing or diffusion bonding via these two types of insert materials. A composite material made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61315494A JPH07100358B2 (en) | 1986-12-26 | 1986-12-26 | Composite material consisting of graphite and copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61315494A JPH07100358B2 (en) | 1986-12-26 | 1986-12-26 | Composite material consisting of graphite and copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63165132A true JPS63165132A (en) | 1988-07-08 |
| JPH07100358B2 JPH07100358B2 (en) | 1995-11-01 |
Family
ID=18066045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61315494A Expired - Lifetime JPH07100358B2 (en) | 1986-12-26 | 1986-12-26 | Composite material consisting of graphite and copper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07100358B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009039037A (en) * | 2007-08-09 | 2009-02-26 | Yanmar Co Ltd | Combine |
| US9536851B2 (en) * | 2014-09-05 | 2017-01-03 | Infineon Technologies Ag | Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187546A (en) * | 1984-03-06 | 1985-09-25 | 株式会社東芝 | Graphite-copper joining member and manufacture thereof |
| JPS61183180A (en) * | 1985-02-06 | 1986-08-15 | 株式会社東芝 | Hot load resistant composite structure |
-
1986
- 1986-12-26 JP JP61315494A patent/JPH07100358B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187546A (en) * | 1984-03-06 | 1985-09-25 | 株式会社東芝 | Graphite-copper joining member and manufacture thereof |
| JPS61183180A (en) * | 1985-02-06 | 1986-08-15 | 株式会社東芝 | Hot load resistant composite structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009039037A (en) * | 2007-08-09 | 2009-02-26 | Yanmar Co Ltd | Combine |
| US9536851B2 (en) * | 2014-09-05 | 2017-01-03 | Infineon Technologies Ag | Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07100358B2 (en) | 1995-11-01 |
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