JPS6316457U - - Google Patents
Info
- Publication number
- JPS6316457U JPS6316457U JP1986110404U JP11040486U JPS6316457U JP S6316457 U JPS6316457 U JP S6316457U JP 1986110404 U JP1986110404 U JP 1986110404U JP 11040486 U JP11040486 U JP 11040486U JP S6316457 U JPS6316457 U JP S6316457U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- surface area
- semiconductor device
- inclined groove
- fixed side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 230000013011 mating Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986110404U JPS6316457U (US07714131-20100511-C00038.png) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986110404U JPS6316457U (US07714131-20100511-C00038.png) | 1986-07-18 | 1986-07-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6316457U true JPS6316457U (US07714131-20100511-C00038.png) | 1988-02-03 |
Family
ID=30989374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986110404U Pending JPS6316457U (US07714131-20100511-C00038.png) | 1986-07-18 | 1986-07-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6316457U (US07714131-20100511-C00038.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02211655A (ja) * | 1989-02-10 | 1990-08-22 | Mitsubishi Electric Corp | 自動車用混成集積回路装置 |
JP2015050366A (ja) * | 2013-09-03 | 2015-03-16 | ウシオ電機株式会社 | 半導体レーザ装置 |
JP2015056608A (ja) * | 2013-09-13 | 2015-03-23 | 株式会社東芝 | 半導体パッケージおよび半導体装置 |
JP2016100152A (ja) * | 2014-11-20 | 2016-05-30 | 本田技研工業株式会社 | 燃料電池用樹脂枠付き電解質膜・電極構造体 |
-
1986
- 1986-07-18 JP JP1986110404U patent/JPS6316457U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02211655A (ja) * | 1989-02-10 | 1990-08-22 | Mitsubishi Electric Corp | 自動車用混成集積回路装置 |
JP2015050366A (ja) * | 2013-09-03 | 2015-03-16 | ウシオ電機株式会社 | 半導体レーザ装置 |
JP2015056608A (ja) * | 2013-09-13 | 2015-03-23 | 株式会社東芝 | 半導体パッケージおよび半導体装置 |
JP2016100152A (ja) * | 2014-11-20 | 2016-05-30 | 本田技研工業株式会社 | 燃料電池用樹脂枠付き電解質膜・電極構造体 |