JPS63164487A - Method of inspecting data for forming pattern film for printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a method for inspecting data for creating a pattern film for forming a printed wiring board, and in particular, this invention relates to a method for inspecting data for creating a pattern film for forming a printed wiring board, and in particular, the present invention relates to a method for inspecting data for creating a pattern film for forming a printed wiring board. This invention relates to a method of inspecting data for creating a pattern film when a pattern consisting of pads is printed.

(Prior Art) In order to form a necessary conductor circuit on a printed wiring board, no matter what method is used, there must be something that will become the basis of the conductor circuit. Usually, the source of this conductive circuit is a material corresponding to the conductive circuit, that is, a patterned film on which a pattern is drawn. To create this pattern film, it is necessary to create a pattern design drawing, which is the basis of the pattern film, from a given circuit diagram. In other words, in order to form the conductor circuits necessary for printed wiring boards, it is necessary to first create a pattern design drawing from the circuit diagram, and then create a pattern film from this pattern design drawing.
By using this pattern film, it is finally possible to form the conductor circuits necessary for printed wiring boards.

This procedure is necessary because it is difficult to form a conductor circuit directly on a printed wiring board using the circuit diagram as is, and the size of the components mounted on the printed wiring board and the printed wiring This is because an efficient conductor circuit must be designed taking into account the shape of the board itself.

If you want to create a pattern design drawing from the above-mentioned circuit diagram and then create a pattern film from this pattern design diagram, if you use the current technology, you can use an electronic IH machine etc. to create the circuit diagram. It is possible to immediately form a patterned film just by inputting data. However, in order to carry out such work, it is necessary to introduce and use a fairly sophisticated computer system, which is especially important now that there is a growing demand for high-mix, low-volume production of this type of printed wiring board. This is not practical in terms of cost and efficiency of use of the computer system. In other words, it is not impossible to directly form the pattern film used to form the necessary conductor circuits on a printed wiring board from a given circuit diagram using a large computer system. Overall, such methods are too costly and currently offer no benefit when producing printed wiring boards, which are basic components.

Conventional methods for creating such patterned films have generally been as follows. First, one worker creates a pattern design drawing from a given circuit diagram, taking into account the arrangement of parts and the layout of the pattern.

After checking and correcting this pattern blueprint,
Data for creating a pattern film is created from this pattern design drawing using a CAD system (usually a system that includes a digitizer), and a pattern film is created based on this data for creating a pattern film.

In the pattern formed on this pattern film, check whether each land and line is formed correctly.
It also checks to see if these are unnecessarily close or in contact, that is, to check for errors. However, conventional inspection of such patterned films is
The pattern film creation data, which is the basis of the pattern film, is once divided into the land and line of the pattern and digitized, and any two of these land or line data are selected and paired, and then A method has been proposed for inspecting whether data for pattern film production is good or bad by inspecting whether the state between a selected pair of data is within a set range.

For example, the applicants of the present invention have proposed a method in this regard: 1.
This has already been proposed in the ¥61-84810 patent.

However, in recent years, printed wiring boards have become smaller, lighter, and thinner, and various electronic components that make up electronic circuits are made by drilling holes in the printed wiring board and inserting the legs (leads) of the components into them. To attach one part (D
The use of surface mount devices (SMD), which attach components without making holes on printed wiring boards, is increasing, and the printed wiring boards used to mount these electronic components are also becoming more sophisticated than before. High density, high precision, and high quality are required.

Along with this, the patterns on pattern films for forming conductor circuits required for conventional printed wiring boards have been formed from lands and lines, or have been required for printed wiring boards for Hazing surface mount components. In addition to lands and lines, pads for attaching the surface mount components have been formed in patterns on pattern films for forming conductor circuits.

As a result, the pattern film creation data is
In addition to the conventional land data consisting of the center coordinates and radius of the land and line data indicating the coordinates of the end point of the line and its radius, it is now formed from pad data indicating the coordinates of the end point of the pad and its radius. . However, since the line data and the pad data are made up of the same data, that is, data indicating coordinates and their radius, it is not possible to clearly distinguish lines and pads from the data.

For this reason, the inspection method already proposed above is sufficient for data for creating a pattern film for patterns consisting of lands and lines, but in addition to lands and lines, there are Regarding the inspection of pattern film creation data for patterns including pads, no support was provided for the pads, and the pad portions had not been inspected.

After all, inspection of the pattern film of a printed wiring board on which at least one surface mount component is mounted, that is, a printed wiring board having pads for mounting the surface mount component, is carried out manually, such as by visual inspection, after the completion of pattern film creation. Alternatively, by using the inspection method already proposed above, only the pattern portion consisting of lands and lines can be inspected. Not only does this take a considerable amount of time, but in some cases there may be an oversight and a complete check may not be performed. In any case, if there is an error in the completed pattern film, it is necessary to correct the aforementioned CAD data, that is, the pattern film creation data, and then create the pattern film again, which increases the design time and This led to higher costs for the final product, the printed wiring board.

(Problems to be solved by the invention) The undeveloped JJJ was created in view of the above-mentioned actual situation, and the problem to be solved is the problem of conductor circuits formed on surface-mount printed wiring boards. This is due to low reliability and poor efficiency when inspecting data for creating a pattern film, which is the basis for a pattern film.

The object of the present invention (1) is to solve various problems when inspecting pattern film creation data that is the basis of pattern films for surface mount printed wiring boards, and to solve the problems that have already been solved. It is an object of the present invention to provide a method by which data for creating a pattern film can be inspected efficiently and at low cost using some simple equipment. In particular, the present invention provides a printed wiring board pattern that facilitates inspection of data for creating a pattern film for surface-mounted printed wiring boards, reduces inspection time, and improves the reliability of finished products. The purpose of this invention is to provide a method for inspecting film production data.

(Means for Solving the Problems) The means taken by the present invention to solve the above problems are as follows: ``Form a pattern consisting of lands, lines, and pads on a printed wiring board from a given circuit diagram. After creating a pattern design drawing for the printed wiring board, forming data for creating a pattern film from this pattern, and inspecting and correcting the correctness of this data for creating a pattern film, the pattern on the printed wiring board is In creating a pattern film for forming a pattern film, the data for creating the pattern film is divided into land data consisting of the center coordinates and radius of the land, coordinates of the end points of the lines and pads, their radii, and the continuity of these end points. data indicating that the printed wiring board is unmasked, and line data consisting of the solder mask film forming data for forming the solder mask on the printed wiring board. Calculate the area, perform arithmetic processing to determine whether the line data is within the non-masked area, and divide the line data into true line data that is not within the non-masked area and pad data that is within the non-masked area. At the same time as disassembling and forming a new pattern, the pattern design drawing is disassembled into predetermined sections, and the land data, true line data, and pad data that fall within this section are stored for each section, and the pattern design drawing that falls within this section is stored. Selecting a set of one runt data, true line data or pad data and another land data, true line data or putt data falling within the same section and calculating the distance between the two; A method for use in a printed wiring board, characterized in that an error portion of +1η pattern film creation data is detected by calculating whether the calculated distance is within a predetermined value. ``Method for inspecting data for creating pattern film.''

That is, the inspection method according to the present invention does not limit the pattern on the pattern film to only lands and lines and simply decompose the data for creating the pattern film into land and line data and digitize it. After dividing the data into land and line data and digitizing it, the line data is divided into true line data and pad data from data for creating a solder mask film for forming a solder mask on a printed wiring board. It is then converted into numerical values. After that, by dividing the pattern design drawing as appropriate, any two of these lands, true lines, and pad data are divided into certain divided sections.
By selecting two pieces of data and pairing them, and checking whether the state of the pair of data IX:1 thus selected is within a set range or not across all pairs of divided sections 1σ.

This is to inspect whether the pattern film creation data is good or bad.

In the present invention, pattern film creation data is divided into land data, true line data, and pad data;
There is meaning in doing I3. The pattern film creation data is formed from parameters indicating the land or line, the center coordinates of the land and its radius, the coordinates of both end points of the line and its radius, and true lines and pads are treated as the same line. This is because these cannot be distinguished. Therefore, in order to distinguish between true lines and pads, we decided to use data for creating a solder mask film for forming an insulating film (solder mask) to cover a pattern on a printed wiring board.

In other words, pads for mounting surface mount components are not necessarily covered by the solder mask due to their characteristics, so the unmasked area of the printed wiring board is calculated from the solder mask creation data, and the line data is not covered by the solder mask. True line data that is not within the mask area,
It is formed by separating the pad data in the non-masked area. In addition, by inspecting the runt data, true line data, and pad data that have been disassembled and formed in this way, each within a certain range obtained by dividing the pattern design drawing as appropriate, it is possible to improve the inspection efficiency. By significantly reducing the number of required data pair combinations, it can fully cope with the current situation where the frequency of mounting surface-mounted components on printed wiring boards has increased in recent years, and the circuit patterns thereof have become more complex. This is to conduct an inspection.

Next, the principle of the present invention will be schematically explained using the drawings.

The principle used in this invention is as follows. The basic idea of this invention is that the pattern (conductor circuit) on the printed wiring board as shown in FIG. is a semicircular or angular band (true line, pad). If you think of a pattern in this way, no matter how complex the pattern is, the above circle (land)
A pattern can be reliably realized by the combination of and obi (true line, pad).

For example, to explain the case where a pattern as shown in Fig. 4 is formed on a printed wiring board, first, this pattern is used as a place where a terminal of an electronic component is inserted or a through hole is formed. land (40) and
Pads (60) as places where terminals of electronic components are connected, and these lands (40) or pads (60).
0) as a pattern that electrically connects the true line (
50). In this case, the true line (5
0), the straight part remains as one true line (
50), and if this true line (50) is bent, another true line (50) is drawn from the bent part.
0) is extended.

If a part of the example pattern circuit diagram shown in FIG. 4 is enlarged and divided as described above, it will become as shown in FIG. 5. In the case of this 5th f; d, it consists of two lands (40), one pad (60), and three true lines (50), but of course the pattern Inside is 1 land (40), pad (60)
Or it may be composed of a true line (50).

These lands (40), true lines (50), and pads (60) are shown separately in the sixth figure.
(A) to (C) in the figure. When defining this land (40), a true line (50), and a pad (60), the center coordinates of the land (40) and the land (
40) The radius of the land (40) itself is used to quantify the land (40), and for the true line (50), the coordinates of the end points of the true line (50) and the true line of origin (50)
The true line (50) is quantified based on the data indicating the thickness or width of ) and the connection of both end points. In addition, for the pad (60), data indicating the coordinates of the end point of the pad (60) and the thickness or radius of the pad (60)
0) is digitized. In other words, in the present invention, each data defining the land (4o), the true line (50), and the pad (6o) is used as data consisting of vector quantities.

When inspecting pattern film creation data using the above vector data, the normal state is defined as shown in (a) to (8) in Figures 7, 8, and 9. tS7 diagram shows the case where the land (40) and the true line (5o) are located normally, and the center of the land (40) and one end point of the true line (50) This is the case when the centers of Figure 8 shows a case where the true line (5o) and the true line (50) are located normally, and the end point of one true line (50) and the end point of the other true line (5D) are aligned. This is the case when the (A) in FIG. 9, (B) in FIG. 9, and (8) in FIG. Figure (a) and 9th
In the figure (b), the true line (50) and the pad (60) intersect in the horizontal direction, and the true line (50) and the pad (60) intersect in the horizontal direction.
0) does not protrude in the vertical direction. 9th V
In A (c), the true line (50) and the pad (60) intersect perpendicularly, and the true line (50) or the pad (60)
) is not penetrated.

In other words, the true line (50) and the pad (60) are in a normal state if their center lines are parallel and orthogonal, respectively.

- If their center lines are parallel, R1 is the radius of the end point (51) of the true line (50), R2 is the radius of the end point (61) of the pad (60), and Ll is the distance between the front center lines, then R2≧ R, +L.

A normal state is when the following conditions are met.

・If their center lines intersect perpendicularly, both end points (51) of the true line (50) and the pad (60
) and the center line connecting both end points (61) is R2・
If L, then R2≧R, +L.

Or R2≧R,+L unit If any of the following conditions are met, the condition is normal.

Of course, if there is a sufficient distance between any two of the land (40), true line (50), or pad (60), it is considered normal.

In contrast, (a) to (8) in Figure 10 are lands (4
0), a typical example is shown in which a pair of true lines (50) or pads (60) are not properly positioned. (A) in Figure 10 shows the land (4o) and the true line (5o).
0) or too close to pad (60), :5
(mouth) in Figure 16 is the true line (50) and the true line (5
0), and FIG. 1O shows a state in which the land (40) and the true line (50) or pad (60) interfere with each other. All of these conditions cause short circuits in each conductor circuit when formed as a pattern on a printed wiring board.

By combining the land (40) data, true line (50) data, and pad (60) data created using the vector quantities described above, the pattern can be determined by capturing the overall image of the pattern formed on the printed wiring board. This makes it easy to inspect film production data.

Furthermore, in recent pattern films for printed wiring boards that require high-density packaging, any two combinations of land (40), true line (50), and pad (60) cannot be used as is. Since f is a huge amount, the standard pattern design drawing is divided into predetermined sections, and only the combinations of land (40), true line (50), and pad (60) that fall within one divided range are created. By taking this into consideration, the number of combinations of land (40), true line (50) and pad (60) that must be inspected is reduced. In this way, if any two of the lands (40), true lines (50) or pads (60) are too close or short, the adjacent lands (40), true lines (50) or pads (60) ), and the land (40), which is far apart, and the true line (5
0) or the pair of pads (60) would be virtually wasted.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a drawing corresponding to the claims, and shows the steps according to the present invention in order.

This FIG. 1 corresponds to steps (C) to (E) in FIG. 2. The steps shown in Figure 2 are as follows:
This figure shows the procedure for forming a pattern film (30) as shown in Fig. 13 from the circuit diagram (10) as exemplified in Fig. 1. In step (A), necessary electronic components are formed. Circuit diagram of combined electrical connections (10)
is created using normal design methods. From the circuit diagram (10) created in this way, a pattern is created in step (B) while taking into consideration the size and position of the electronic components, the size of the printed layout board, and the layout of various electronic components placed on it. Create a blueprint (20). Thereafter, in order to easily form the pattern film (30) through arithmetic processing, predetermined data (pattern film creation data) is created from the pattern design drawing (28) in the hand 111' [(C), and this is Inspect in (D). Then, based on the results obtained based on this inspection, the data is corrected in step (E), and finally, an automatic drawing device is used to form the pattern film (:lO), which is the final purpose, from this corrected data. That's what I do.

As mentioned above, the method of the present invention is an improvement of the steps (C) to (E) of the above steps shown in FIG. Explained in detail, using diagrams.

First, in step (a) of Fig. 1, the circuit diagram (10)
From the pattern design drawing (20) created based on, each land (
40) and line (true line (50) or pad (
60)) is digitized using a digitizer or the like. In this case, each land (40) and line (true line (5)
0) or pad (60)) is the land data consisting of the center coordinates (41) and radius of the land (40) and the line (true line (50) or pad (60)) as described above.
0)), the coordinates of the end points (51) and (61), their radii, and line data consisting of data indicating that these end points are continuous and are converted into numerical values.

Next, in the 1st r: 3m hand 11t (b), from the data for creating a solder mask film for forming a solder mask for covering the pattern on the printed wiring board, the pattern on the printed wiring board is not covered. Calculate the non-masked area (70). Then, in step 1 (c), arithmetic processing is performed to determine whether the line data obtained in step (a) is within the non-masked area. Thereby, it is possible to separate and form true line data that is not in the non-masked area (70) and pad data that is in the non-masked area (70).

The pattern design drawing (20
) is conceptually decomposed into predetermined sections, and the runt data, true line data, or pad data that falls within these sections is stored in step (d) in FIG. In this case, by assigning a sequence number to each section, the arithmetic processing described below can be performed efficiently. Conceptually decomposing the pattern design diagram (2o) into predetermined sections means that the pattern design diagram (2o) is conceptually decomposed into predetermined sections.
This does not mean drawing lines directly on the pattern film (30 ) may be decomposed into predetermined sections.

In this way, the pattern design drawing (20) etc. is conceptually divided into predetermined sections by separating one land data, true line data or pad data, and another land data, true line data or pad data. When selecting one set of data, if the total number of land data, true line data, or pad data is large, the number of combinations of the two becomes enormous, so this is done to avoid this.

The land (40), the true line (50) and the pad (60) are quantified to fit within the predetermined section in this way.
, select any set of these, and set these −
The distance between a set of data is calculated by [(e),
In this case, if true line data is included as data of the - set, both end points (50) of this true line (50) are included.
1) and the center point 6 (
41), or both end points (51) of the true line (50),
Alternatively, the distance between the pad (60) and both end points (61) is calculated. Σ, the distance between land (40) and land (40) can be calculated using their center coordinates (41
) can be easily done by calculating the distance.

Step (e) is to perform arithmetic processing on each distance calculated in this way to determine whether it is within a predetermined range, and then, in step (f), a similar arithmetic process is performed on each data. Step (g) is performed for each group and for all groups in each divided section.

Details of the above steps (e) to (g) will be explained with reference to FIG.

First, in step (2), one section as the inspection range is selected. Then, in the first step ■, check whether all sections have been inspected.

If all the sections have been inspected, the process moves to step 0 and the inspection job is completed, but if not, the process moves to step (2).

In step (2), a set of data within one section is selected. It is checked in step (2) whether this - set of data is the last one, and if it is, the process returns to step (2), and if it is not, it is moved to step (2).

In this step (2), it is checked whether the set of data selected in step (2) consists of genuine line data and genuine line data. If it consists of genuine line data and true line data, move to the next step ■ and check whether there is an intersection between the two.0 If there is an intersection between the two, the )
and (b), and (a) in Fig. 15 is a normal state (each end point (51) coincides);
(B) in the figure shows an abnormal state (endpoints (51) do not match).

If these two true line data intersect, step (2) is to check whether the state is in (a) or (b) in FIG. 15. That is, in this step (2), if any of the end points (51) match, each true line (50
) is bent normally, so we move on to step (3) to perform the first inspection. Furthermore, if there is no match among the end points (51) in this step (2), it means that the true lines (50) do not intersect normally, and the process moves to step (Ω) where an error is registered.

If it is determined in step (2) that there is no intersection, the relationship between the two true line data will be in the state (c) or (d) of FIG. 15. In Figure 15 (
Condition 8) is when both true lines (50) are too close together, and condition (d) in Figure 15 is when both true lines (50) are too close together.
50) are normally separated. A determination as to whether this true line (50) is normally separated is made based on whether it is longer or shorter than a preset distance fLI. The setting of the value of this distance is determined as appropriate depending on the shape of the printed wiring board or the degree of refinement required for each true line (50). After dividing the cases in this step ■, the distance mentioned above in step ■! ! After checking whether it is longer or shorter than the value of Lt, the process moves to step (2) or 0.

On the other hand, in step (2) above, if the set of data selected in step (2) is not genuine line data and genuine line data, the process moves to step (2).

In this step (2), it is checked whether the set of data selected in step (2) consists of land data and true line data. If it consists of land data and true line data, proceed to the next step [
phase] and check whether there is an intersection between the two. The case where the two intersect refers to the states (a) and (b) in Fig. 16, and (a) in Fig. 16 is the normal state (the center coordinates (41) of the land (40) and The end point (51) of the true line (50) coincides with the first line), the first
FIG. 6 (b) shows an abnormal state (the center coordinates (41) of the land (40) and the end point (51) of the true line (50) do not match).

If there is this intersection, is the state shown in (a) in Figure 16 (
Step (2) is to check whether the condition is (b). That is, in this step ■, the center coordinates (41
) and the end point (51) of the true line (50) match, then
Since the land (40) and the true line (50) are in a normal state, the process moves to step (2) to perform the first inspection. Also, in this step O, land (40
) center coordinates (41) and the end point (5
1), the land (40) and the true line (50) do not intersect normally, so the process moves to step O and an error is registered. In this case, the inspection is performed by setting the maximum distance between the land (40) and the true line (50) in advance, and determining whether the calculated distance is larger or smaller based on this distance. Land (4
0) and the true line (50) when formed as a pattern on a printed wiring board, it is sufficient that there is electrical continuity, and the intersection of the land (40) and the true line (50) is a perfect match. There is no need for it, and here is the minimum deviation distance a
There are reasons why nt may be set.

If it is determined in step [stock] that there is no intersection, the relationship between the land data and the true line data will be in the state (c) or (d) of FIG. 16. The state (c) in FIG. 16 is a case where the land (40) and the true line (50) are too close to each other, and the first
The state (d) in Figure 6 is between the land (40) and the true line (5).
0) is a case where the swelling is normal. A determination as to whether this true line (50) is normally separated is made based on whether it is longer or shorter than a preset distance value. The value of this distance fL3 is determined as appropriate depending on the shape of the printed wiring board, the degree of refinement of each true line (50), and the like. This step [
After the cases are divided in [phase], it is checked in step @ whether the distance a is longer or shorter than the value of the above-mentioned distance a, and then the process moves to step ■ or 0.

On the other hand, in step ■ above, step ■
If the set of data selected in step (2) is not true line data and land data, the process moves to step (2).

In this step (2), it is checked whether the set of data selected in step (2) consists of land data and land data. If it consists of land data and land data, move to the next step [phase]. In this step [phase], both lands (40)
is in the state of (a) or (b) in Fig. 17, and (a) in Fig. 17 is an abnormal state (center coordinates (41) of both lands (40)). are too close together), and (b) in FIG. 17 shows a normal state (the center coordinates (41) of both lands (40) are separated by a predetermined distance rai or more). At this step [phase] 8, the central seat W (41) of both lands (40) is at a predetermined distance f
It is checked whether it is longer or shorter than the value of tu, and the process moves to step 2 or step O.

On the other hand, in step O above, step ■
If the set of data selected in is not land data and land data, the process moves to step [phase].

In this step (2), it is checked whether the set of data selected in step (2) consists of true line data and pad data.

If it consists of true line data and pad data, the process moves to the next step O, and it is checked whether or not there is an intersection between the two. When there is intersection between the two, the 18th
This refers to the states (a), (b), (c), (d), and (e) in the figure, and (a), (b), and (c) in Figure 18.
is a normal condition.

(D) and (E) in FIG. 18 show abnormal states. In other words, (a) and (b) are the true line (50
) and the pad (60) intersect in the horizontal direction and do not protrude from the true line (50) in the width direction of the pad (60). ) intersect perpendicularly and the true line (50
) does not penetrate through the pad (60) in the width direction. In addition, the state (d) is a state in which the true line (50) protrudes in the width direction of the pad (60), and (
In the state (E), the true line (50) penetrates through the pad (60) in the width direction.

In the case where there is an intersection between these true line data and pad data, (a), (b), (c), (d) in Fig. 18,
Step O is to check which state is in (e) and (e). In other words, at this step 0, the true line (5
0) and pad (60) are in any of the states shown in (a), (b), or (c) in Figure 18, they are in a normal state, so proceed to step (3) for the next inspection. It is a transition. Also, in this step O, the true line (50
) and the pad (60) are in the state of (d) or (e) in FIG. 18, they do not intersect normally, so the process moves to step O and an error is registered.

If it is determined in step O that they do not intersect, the relationship between the true line (50) and the pad (60) is the 18th. This means that it is in the position m shown in (f) or (g) in the figure. The state shown in FIG. 18 is when the true line (50) and the pad (60) are too close to each other,
The state shown in (g) in the figure is the true line (50) and the pad (6).
0) are normally separated. This genuine line (
50) and the pad (60) are normally separated from each other by a preset distance! It is done depending on whether it is longer or shorter than the value of LS, and then step ■ or step 0
It will move to .

On the other hand, in step ■ above, step ■
If the set of data selected in is not genuine line data and pad data, the process moves to step O.

In this step O, it is checked whether the set of data selected in step (2) consists of pad data and pad data. If it consists of pad data and pad data, the process moves to the next step O. In this step O, it is inspected whether one pad (60) is in the state of (a) or (b) in FIG. 19, and the state of (a) in FIG. (60
) are too close together, and (b) in Figure 19
This state is when both pads (60) are normally separated. In this step O, it is checked whether the distance between both pads (60) is longer or shorter than a predetermined distance afLr, and the process moves to step 2 or step O.

Then, in the above step O, if the set of data selected in step ① is not pad data and pad data, tests other than the above five cases are performed, so the land (40) and This means inspecting the condition of the pad (60). That is, in this step O, the land (40) and pad (60) are arranged as shown in FIG.
It is checked whether the state is in the state of (a) or (b).The state of (a) in Fig. 20 is when the land (40) and pad (60) are too close to each other. Yes, second
The state of (b) in Figure 0 is the land (40) and pad (60).
This is the case when the two are normally separated from each other. In this step O, it is checked whether the distance between the land (40) and the pad (60) is longer or shorter than the value of the predetermined distance statement, and step
Or it moves to step 0.

By performing the above calculation processing, the inspection according to the present invention ends when Step O is reached. However, if there is an error registered in Step 0, this error data can be used to create a pattern film. This is to correct the data. This is move 11 shown in Figure 1.
1'1 (h).

Note that it is preferable to return to step (a) again and sequentially perform the above-mentioned inspection on the pattern film creation data corrected by this means (h).

Based on the pattern film creation data completely corrected as described above, the pattern film (30) shown in FIG. 13 is finally formed. In other words, by adopting the present invention, the pattern film (30
) need only be formed - times.

(Effects of the Invention) As detailed above, the present invention has the following features: ``Creating a pattern design diagram for forming a pattern consisting of lands, lines, and pads on a printed wiring board from a given circuit diagram; After forming data for creating a pattern film from this pattern design drawing and inspecting and correcting the correctness of this data for creating a pattern film, in creating a pattern film for forming the pattern on the printed wiring board, The pattern film creation data includes land data consisting of the center coordinates and radius of the land, line data consisting of the coordinates and radius of the end points of the line and pad, and data indicating that these end points are continuous. A non-masked area of the printed wiring board that is not masked is calculated from data for creating a solder mask film for forming a solder mask of the printed wiring board.

Arithmetic processing is performed to determine whether the line data is in the non-masked area, and the line data is newly decomposed into true line data that is not in the non-masked area and pad data that is in the non-masked area. At the same time, the pattern design drawing is divided into predetermined sections, and the land data, true line data, and pad data that fall within this section are stored for each section, and one piece of land data that falls within this section, Select a set of true line data or pad data and one other runt data, true line data or putt data that falls within the same section, calculate the distance between the two books, and calculate the calculated distance. The feature is that the error amount of the pattern film creation data is calculated by calculating whether or not it is within a set constant value. Solve the low reliability and inefficiency when inspecting the pattern film forming data that is the basis of the pattern film for conductor circuits formed on printed wiring boards, and use the simple equipment that already exists. Therefore, it is possible to provide a method for inspecting pattern film forming data efficiently and at low cost.

In particular, one aspect of the present invention is a method for inspecting pattern film creation data for printed wiring boards that facilitates the checking of pattern film creation data, reduces checking time, and improves the reliability of the finished product. can be provided.

[Brief explanation of the drawing]

FIG. 1 is a flowchart showing the procedure for explaining the method according to the present invention, FIG. 2 is a flowchart showing the procedure from creating a pattern film from a circuit diagram, and FIG.
The figure is a flowchart showing a procedure for inspecting pattern film creation data. Furthermore, FIG. 4 is a plan view showing a part of the pattern film after completion, FIG. 5 is a plan view showing a part of FIG. (
A) to (C) are plan views showing the schematic configuration of the land, true line, and pad, Figure 7 is a plan view showing the land and true line in the normal position, and Figure 8 is the true line and true line. Figures 9(a) to 9(c) are plan views showing the correct line and pad position, respectively. FIG. 11 is a plan view showing a state in which a set of lands, true lines or pads are not properly positioned.Furthermore, FIG. 11 is a plan view showing an example of a circuit diagram,
The figure shows a pattern design diagram formed based on the circuit diagram in Figure 11, Figure 13 is a plan view of a pattern film formed from the pattern design diagram in Figure 12, and Figure 14 covers the pattern on the printed wiring board. 15 is a plan view illustrating the relationship between the true lines and the true line, FIG. 16 is a plan view illustrating the relationship between the land and the true line, and FIG. 17 is a plan view illustrating the relationship between the lands and the true line. The figure is a plan view illustrating the relationship between the lands, FIG. 18 is a plan view illustrating the relationship between the true line and the pad, FIG. 19 is a plan view illustrating the national insurance of the pad and the pad, and FIG. FIG. 3 is a plan view illustrating the relationship between lands and pads. Explanation of symbols 1 (1-... circuit diagram, 20- pattern design diagram, 30-...
Pattern film, 40 land, 41--center coordinates of land, SO--true line, 51--end point of true line, 60--pad, 61--end point of pad, 70--non- mask area. (that's all)

Claims (1)

[Claims] A pattern design drawing for forming a pattern consisting of lands, lines, and pads on a printed wiring board is created from a given circuit diagram, and data for creating a pattern film is created from this pattern design drawing. After inspecting and correcting the correctness of this pattern film creation data, when creating a pattern film for forming a pattern on the printed wiring board, the pattern film creation data is changed to the center coordinates of the land. and a radius, and line data consisting of the coordinates of the end points of the line and pad, their radii, and data indicating that these end points are continuous, and are formed on the printed wiring board. calculating a non-masked area of the printed wiring board from data for creating a solder mask film for forming a solder mask, and calculating whether or not the line data is within the non-masking area; The line data is newly decomposed and formed into true line data that is not in the non-masked area and pad data that is in the non-masked area, and the pattern design drawing is decomposed into predetermined sections, and The land data, true line data, and pad data entering the section are stored for each section, and one land data, true line data, or pad data entering the section and another land data entering the same section are stored. data, true line data, or pad data, calculates the distance between them, and performs arithmetic processing to determine whether the calculated distance is within a set constant value. A method for inspecting data for creating a pattern film for a printed wiring board, characterized in that an error portion of the data for creating the film is detected.