JPS63164283U - - Google Patents
Info
- Publication number
- JPS63164283U JPS63164283U JP5680587U JP5680587U JPS63164283U JP S63164283 U JPS63164283 U JP S63164283U JP 5680587 U JP5680587 U JP 5680587U JP 5680587 U JP5680587 U JP 5680587U JP S63164283 U JPS63164283 U JP S63164283U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- wiring board
- printed wiring
- clamping
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Supports For Pipes And Cables (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Description
第１図はこの考案の一実施例によるリード線の
クランプ構造を示す斜視図、第２図はクランプす
るために必要な基板上の穴加工形状を示す平面図
、第３図は従来のリード線をクランプするための
クランプ成形品の断面図、第４図は成形品を基板
上に取付けた状態の斜視図である。
図において、３は印刷配線基板、４はリード線
、５は加工穴、６はスリツト部、７ははめ込み部
、８は穴である。なお、図中、同一符号は同一ま
たは相当部分を示す。
Fig. 1 is a perspective view showing a lead wire clamping structure according to an embodiment of this invention, Fig. 2 is a plan view showing the shape of holes formed on the board necessary for clamping, and Fig. 3 is a conventional lead wire clamping structure. FIG. 4 is a cross-sectional view of a clamp molded product for clamping the molded product, and FIG. 4 is a perspective view of the molded product mounted on a substrate. In the figure, 3 is a printed wiring board, 4 is a lead wire, 5 is a processed hole, 6 is a slit portion, 7 is a fitting portion, and 8 is a hole. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ランプするリード線のクランプ構造において、印
刷配線基板に穴加工を加える事により、印刷配線
基板のみで、リード線をクランプさせるようにし
たことを特徴とするリード線のクランプ構造。 The lead wire clamping structure for clamping a bundle of lead wires during lead wire wiring is characterized by adding holes to the printed wiring board so that the lead wires can be clamped only by the printed wiring board. Lead wire clamp structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5680587U JPS63164283U (en) | 1987-04-14 | 1987-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5680587U JPS63164283U (en) | 1987-04-14 | 1987-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63164283U true JPS63164283U (en) | 1988-10-26 |
Family
ID=30885947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5680587U Pending JPS63164283U (en) | 1987-04-14 | 1987-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164283U (en) |
-
1987
- 1987-04-14 JP JP5680587U patent/JPS63164283U/ja active Pending