JPS63164245U - - Google Patents
Info
- Publication number
- JPS63164245U JPS63164245U JP1987056960U JP5696087U JPS63164245U JP S63164245 U JPS63164245 U JP S63164245U JP 1987056960 U JP1987056960 U JP 1987056960U JP 5696087 U JP5696087 U JP 5696087U JP S63164245 U JPS63164245 U JP S63164245U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- support plates
- wiring conductor
- insulator
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987056960U JPH0451488Y2 (US06521211-20030218-C00004.png) | 1987-04-15 | 1987-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987056960U JPH0451488Y2 (US06521211-20030218-C00004.png) | 1987-04-15 | 1987-04-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63164245U true JPS63164245U (US06521211-20030218-C00004.png) | 1988-10-26 |
| JPH0451488Y2 JPH0451488Y2 (US06521211-20030218-C00004.png) | 1992-12-03 |
Family
ID=30886237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987056960U Expired JPH0451488Y2 (US06521211-20030218-C00004.png) | 1987-04-15 | 1987-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451488Y2 (US06521211-20030218-C00004.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160154A (ja) * | 1984-01-30 | 1985-08-21 | Nec Kansai Ltd | Ｈｉｃ |
-
1987
- 1987-04-15 JP JP1987056960U patent/JPH0451488Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160154A (ja) * | 1984-01-30 | 1985-08-21 | Nec Kansai Ltd | Ｈｉｃ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451488Y2 (US06521211-20030218-C00004.png) | 1992-12-03 |
