JPS63162534U - - Google Patents

Info

Publication number
JPS63162534U
JPS63162534U JP1987054367U JP5436787U JPS63162534U JP S63162534 U JPS63162534 U JP S63162534U JP 1987054367 U JP1987054367 U JP 1987054367U JP 5436787 U JP5436787 U JP 5436787U JP S63162534 U JPS63162534 U JP S63162534U
Authority
JP
Japan
Prior art keywords
pad
bonding
insulating film
unit area
cover insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987054367U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0636578Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987054367U priority Critical patent/JPH0636578Y2/ja
Publication of JPS63162534U publication Critical patent/JPS63162534U/ja
Application granted granted Critical
Publication of JPH0636578Y2 publication Critical patent/JPH0636578Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/90
    • H10W72/07551
    • H10W72/50
    • H10W72/536
    • H10W72/5363
    • H10W72/5449
    • H10W72/5475
    • H10W72/59
    • H10W72/926
    • H10W72/932
    • H10W72/936
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987054367U 1987-04-10 1987-04-10 半導体集積回路 Expired - Lifetime JPH0636578Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987054367U JPH0636578Y2 (ja) 1987-04-10 1987-04-10 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987054367U JPH0636578Y2 (ja) 1987-04-10 1987-04-10 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS63162534U true JPS63162534U (index.php) 1988-10-24
JPH0636578Y2 JPH0636578Y2 (ja) 1994-09-21

Family

ID=30881295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987054367U Expired - Lifetime JPH0636578Y2 (ja) 1987-04-10 1987-04-10 半導体集積回路

Country Status (1)

Country Link
JP (1) JPH0636578Y2 (index.php)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5845313A (en) 1995-07-31 1998-12-01 Lexar Direct logical block addressing flash memory mass storage architecture
US6728851B1 (en) 1995-07-31 2004-04-27 Lexar Media, Inc. Increasing the memory performance of flash memory devices by writing sectors simultaneously to multiple flash memory devices
US7102671B1 (en) 2000-02-08 2006-09-05 Lexar Media, Inc. Enhanced compact flash memory card
GB0123415D0 (en) 2001-09-28 2001-11-21 Memquest Ltd Method of writing data to non-volatile memory
GB0123419D0 (en) 2001-09-28 2001-11-21 Memquest Ltd Data handling system
GB0123421D0 (en) 2001-09-28 2001-11-21 Memquest Ltd Power management system
US6950918B1 (en) 2002-01-18 2005-09-27 Lexar Media, Inc. File management of one-time-programmable nonvolatile memory devices
US6957295B1 (en) 2002-01-18 2005-10-18 Lexar Media, Inc. File management of one-time-programmable nonvolatile memory devices
US7231643B1 (en) 2002-02-22 2007-06-12 Lexar Media, Inc. Image rescue system including direct communication between an application program and a device driver
US6973519B1 (en) 2003-06-03 2005-12-06 Lexar Media, Inc. Card identification compatibility
US7370166B1 (en) 2004-04-30 2008-05-06 Lexar Media, Inc. Secure portable storage device
US7464306B1 (en) 2004-08-27 2008-12-09 Lexar Media, Inc. Status of overall health of nonvolatile memory

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101938A (ja) * 1983-11-07 1985-06-06 Nec Corp 半導体装置
JPS60113636U (ja) * 1984-01-06 1985-08-01 日本電気アイシーマイコンシステム株式会社 半導体集積回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101938A (ja) * 1983-11-07 1985-06-06 Nec Corp 半導体装置
JPS60113636U (ja) * 1984-01-06 1985-08-01 日本電気アイシーマイコンシステム株式会社 半導体集積回路装置

Also Published As

Publication number Publication date
JPH0636578Y2 (ja) 1994-09-21

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