JPS645448U - - Google Patents
Info
- Publication number
- JPS645448U JPS645448U JP1987099969U JP9996987U JPS645448U JP S645448 U JPS645448 U JP S645448U JP 1987099969 U JP1987099969 U JP 1987099969U JP 9996987 U JP9996987 U JP 9996987U JP S645448 U JPS645448 U JP S645448U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- recess
- chip mounting
- wire bonding
- bonding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07178—
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- H10W72/075—
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- H10W72/07521—
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- H10W72/5449—
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- H10W72/932—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987099969U JPS645448U (index.php) | 1987-06-29 | 1987-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987099969U JPS645448U (index.php) | 1987-06-29 | 1987-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS645448U true JPS645448U (index.php) | 1989-01-12 |
Family
ID=31327615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987099969U Pending JPS645448U (index.php) | 1987-06-29 | 1987-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS645448U (index.php) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02116907U (index.php) * | 1989-03-09 | 1990-09-19 |
-
1987
- 1987-06-29 JP JP1987099969U patent/JPS645448U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02116907U (index.php) * | 1989-03-09 | 1990-09-19 |