JPS63178342U - - Google Patents
Info
- Publication number
- JPS63178342U JPS63178342U JP1987070466U JP7046687U JPS63178342U JP S63178342 U JPS63178342 U JP S63178342U JP 1987070466 U JP1987070466 U JP 1987070466U JP 7046687 U JP7046687 U JP 7046687U JP S63178342 U JPS63178342 U JP S63178342U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- die pad
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
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- H10W72/07353—
-
- H10W72/334—
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- H10W72/884—
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- H10W72/931—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987070466U JPS63178342U (index.php) | 1987-05-12 | 1987-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987070466U JPS63178342U (index.php) | 1987-05-12 | 1987-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63178342U true JPS63178342U (index.php) | 1988-11-18 |
Family
ID=30912127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987070466U Pending JPS63178342U (index.php) | 1987-05-12 | 1987-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63178342U (index.php) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0710939U (ja) * | 1993-07-28 | 1995-02-14 | サンケン電気株式会社 | 回路基板を有する半導体装置 |
| JPH07201893A (ja) * | 1995-01-31 | 1995-08-04 | Sony Corp | 半導体装置 |
| JP2011171766A (ja) * | 2011-05-27 | 2011-09-01 | Seiko Instruments Inc | 半導体装置 |
| JP2011253972A (ja) * | 2010-06-03 | 2011-12-15 | Renesas Electronics Corp | 半導体装置及びその製造方法 |
| JP2014197634A (ja) * | 2013-03-29 | 2014-10-16 | 新電元工業株式会社 | リードフレーム、半導体装置及びその製造方法 |
| JP2015060916A (ja) * | 2013-09-18 | 2015-03-30 | セイコーインスツル株式会社 | 半導体装置 |
| JP2016213505A (ja) * | 2016-09-07 | 2016-12-15 | 日亜化学工業株式会社 | 発光装置用パッケージ成形体及びそれを用いた発光装置 |
| US9893255B2 (en) | 2012-01-20 | 2018-02-13 | Nichia Corporation | Molded package and light emitting device |
| US10163829B2 (en) | 2017-02-20 | 2018-12-25 | Murata Manufacturing Co., Ltd. | Compound semiconductor substrate and power amplifier module |
-
1987
- 1987-05-12 JP JP1987070466U patent/JPS63178342U/ja active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0710939U (ja) * | 1993-07-28 | 1995-02-14 | サンケン電気株式会社 | 回路基板を有する半導体装置 |
| JPH07201893A (ja) * | 1995-01-31 | 1995-08-04 | Sony Corp | 半導体装置 |
| JP2011253972A (ja) * | 2010-06-03 | 2011-12-15 | Renesas Electronics Corp | 半導体装置及びその製造方法 |
| JP2011171766A (ja) * | 2011-05-27 | 2011-09-01 | Seiko Instruments Inc | 半導体装置 |
| US9893255B2 (en) | 2012-01-20 | 2018-02-13 | Nichia Corporation | Molded package and light emitting device |
| US10050186B2 (en) | 2012-01-20 | 2018-08-14 | Nichia Corporation | Light emitting device |
| US10522731B2 (en) | 2012-01-20 | 2019-12-31 | Nichia Corporation | Method of manufacturing light emitting device and light emitting device |
| US11018286B2 (en) | 2012-01-20 | 2021-05-25 | Nichia Corporation | Method of manufacturing light emitting device and light emitting device |
| JP2014197634A (ja) * | 2013-03-29 | 2014-10-16 | 新電元工業株式会社 | リードフレーム、半導体装置及びその製造方法 |
| JP2015060916A (ja) * | 2013-09-18 | 2015-03-30 | セイコーインスツル株式会社 | 半導体装置 |
| JP2016213505A (ja) * | 2016-09-07 | 2016-12-15 | 日亜化学工業株式会社 | 発光装置用パッケージ成形体及びそれを用いた発光装置 |
| US10163829B2 (en) | 2017-02-20 | 2018-12-25 | Murata Manufacturing Co., Ltd. | Compound semiconductor substrate and power amplifier module |