JPS63162527U - - Google Patents
Info
- Publication number
- JPS63162527U JPS63162527U JP5434387U JP5434387U JPS63162527U JP S63162527 U JPS63162527 U JP S63162527U JP 5434387 U JP5434387 U JP 5434387U JP 5434387 U JP5434387 U JP 5434387U JP S63162527 U JPS63162527 U JP S63162527U
- Authority
- JP
- Japan
- Prior art keywords
- pedestals
- semiconductor wafers
- connecting body
- jig
- handles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Landscapes
- Weting (AREA)
Description
第１図ａ，ｂは本考案の第１の実施例の上面図
及びＡ―Ａ′線断面図、第２図ａ，ｂは本考案の
第２の実施例の上面図及びＢ―Ｂ′線断面図、第
３図ａ，ｂは従来のエツチング治具の正面図及び
側面図、第４図ａ，ｂは従来の他のエツチング治
具の上面図及び側面図である。
１，１Ａ……溝、２，２Ａ……開口部、３，３
Ａ……取手、４，４Ａ……連結体、５……穴、６
……仕切り板、８……溝、１０，１０Ａ……台座
、２０……バスケツト。
Figures 1a and b are a top view and a sectional view taken along the line A-A' of the first embodiment of the present invention, and Figures 2a and b are a top view and a sectional view taken along the line B-B' of the second embodiment of the present invention. 3A and 3B are a front view and a side view of a conventional etching jig, and FIGS. 4A and 4B are a top view and a side view of another conventional etching jig. 1,1A...Groove, 2,2A...Opening, 3,3
A...Handle, 4, 4A...Connection body, 5...Hole, 6
...Partition plate, 8...Groove, 10, 10A...Pedestal, 20...Basket.
Claims (1)
台座を取手に連結する連結体と、前記連結体に設
けられた反応生成物沈降用の開口部とを含むこと
を特徴とする半導体ウエーハ用のエツチング治具
。 Etching for semiconductor wafers, comprising a plurality of pedestals on which semiconductor wafers are placed, a connecting body connecting the pedestals with handles, and an opening provided in the connecting body for settling reaction products. jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5434387U JPS63162527U (en) | 1987-04-09 | 1987-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5434387U JPS63162527U (en) | 1987-04-09 | 1987-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63162527U true JPS63162527U (en) | 1988-10-24 |
Family
ID=30881249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5434387U Pending JPS63162527U (en) | 1987-04-09 | 1987-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63162527U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59179788A (en) * | 1983-03-31 | 1984-10-12 | Fujitsu Ltd | Chemical etching device |
-
1987
- 1987-04-09 JP JP5434387U patent/JPS63162527U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59179788A (en) * | 1983-03-31 | 1984-10-12 | Fujitsu Ltd | Chemical etching device |