JPS63161711U - - Google Patents
Info
- Publication number
- JPS63161711U JPS63161711U JP5148287U JP5148287U JPS63161711U JP S63161711 U JPS63161711 U JP S63161711U JP 5148287 U JP5148287 U JP 5148287U JP 5148287 U JP5148287 U JP 5148287U JP S63161711 U JPS63161711 U JP S63161711U
- Authority
- JP
- Japan
- Prior art keywords
- ejector pin
- resin
- sealed molded
- mold release
- sliding mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5148287U JPH0356341Y2 (en:Method) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5148287U JPH0356341Y2 (en:Method) | 1987-04-03 | 1987-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63161711U true JPS63161711U (en:Method) | 1988-10-21 |
| JPH0356341Y2 JPH0356341Y2 (en:Method) | 1991-12-18 |
Family
ID=30875785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5148287U Expired JPH0356341Y2 (en:Method) | 1987-04-03 | 1987-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356341Y2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH023809U (en:Method) * | 1988-06-13 | 1990-01-11 | ||
| JP2014067771A (ja) * | 2012-09-25 | 2014-04-17 | Mitsubishi Electric Corp | 半導体装置封止用金型及び半導体装置 |
-
1987
- 1987-04-03 JP JP5148287U patent/JPH0356341Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH023809U (en:Method) * | 1988-06-13 | 1990-01-11 | ||
| JP2014067771A (ja) * | 2012-09-25 | 2014-04-17 | Mitsubishi Electric Corp | 半導体装置封止用金型及び半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356341Y2 (en:Method) | 1991-12-18 |
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