JPS63161387A - Heat exchanger - Google Patents
Heat exchangerInfo
- Publication number
- JPS63161387A JPS63161387A JP30772586A JP30772586A JPS63161387A JP S63161387 A JPS63161387 A JP S63161387A JP 30772586 A JP30772586 A JP 30772586A JP 30772586 A JP30772586 A JP 30772586A JP S63161387 A JPS63161387 A JP S63161387A
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- heat exchanger
- transfer body
- heat
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 238000005219 brazing Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003340 mental effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000029305 taxis Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、例えばヘリウム冷凍装置等の低温装置に用
いられる熱交換器に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a heat exchanger used in a low-temperature device such as a helium refrigeration device.
第1図は例えばクライオジエニツクス、 P5jl。 FIG. 1 shows, for example, cryogenics, P5jl.
/q7ヂ年9月発行(cayooENIcs 、 SE
PTEMBER/97q、P!夕2)に示された従来の
低温用熱交換器を示す一部切欠き断面図、第6図は第5
図の要部拡大図で、図において(1)は円板状で伝熱板
である銅製の金網(la)が積層されてなる伝熱体であ
シ、例えば低圧ヘリウムガス等の第1の冷媒Cs)が伝
熱体(1)の内部を図中矢印方向く流れる。(3)は伝
熱体(1)の外周壁面上にろう材であるハンダ(6)を
用いて螺旋状に接合された管(例えば銅製の伝熱管)で
あシ、この内部を例えば高圧ヘリウムガス等の第2の冷
媒(り)が図中矢印方向に流れる。Published in September /q7゜ (cayooENics, SE
PTEMBER/97q, P! Fig. 6 is a partially cutaway sectional view showing the conventional low temperature heat exchanger shown in Fig. 2).
This is an enlarged view of the main part of the figure. In the figure, (1) is a disk-shaped heat transfer body made of laminated copper wire mesh (LA) which is a heat transfer plate. Refrigerant Cs) flows inside the heat transfer body (1) in the direction of the arrow in the figure. (3) is a tube (for example, a copper heat exchanger tube) that is spirally joined to the outer peripheral wall surface of the heat transfer body (1) using solder (6), which is a brazing material, and the inside of this tube is filled with, for example, high-pressure helium. A second refrigerant such as gas flows in the direction of the arrow in the figure.
(り)はこれら伝熱体(1)および伝熱管(3)を収納
する容器である1
上記のように構成された低温用熱交換器は他の低温構成
要素とともに真空容器(図示せず)内に収納され、圧縮
機から供給される第一の冷媒昨)である高圧ガス(例え
ば5ooK、/batrn>は伝熱管(3)内に導入さ
れる。一方、低温側から帰還する第1の冷媒(コ)であ
る低圧ガス(例えばg。(ri) is a container that houses these heat transfer elements (1) and heat transfer tubes (3).1 The low temperature heat exchanger configured as above is housed in a vacuum container (not shown) together with other low temperature components. A high-pressure gas (e.g. 5ooK, /batrn>), which is the first refrigerant stored in the heat transfer tube (3) and supplied from the compressor, is introduced into the heat transfer tube (3). A low-pressure gas (e.g. g) that is a refrigerant (g).
K 、 / atm )は第一の冷媒(りと対向する方
向から金網C7a)内にl対/の流量比で流される。そ
して、伝熱体(1)の軸線方向に流れる第1の冷媒(,
2)は第6図に示すように伝熱板である金網(/a)に
よシ拡散され、金網(/a)との接触面積が増大する結
果、その冷熱が金網(/a)の素線、ハンダCA)を通
って伝熱管(3)の管壁に熱伝導され、第一の冷媒Cり
は冷却されて伝熱管(3)から流出される。K, /atm) is flowed into the first refrigerant (the wire mesh C7a from the direction opposite to the wire) at a flow rate ratio of 1 to /. The first refrigerant (,
2) is diffused through the wire mesh (/a), which is a heat transfer plate, as shown in Figure 6, and as a result of the increased contact area with the wire mesh (/a), the cold heat is transferred to the element of the wire mesh (/a). Heat is conducted to the tube wall of the heat exchanger tube (3) through the wire, solder CA), and the first refrigerant C is cooled and flows out from the heat exchanger tube (3).
〔発明が解決しようとする問題点〕
上記のように構成されている従来の熱交換器は、伝熱体
(1)の外周壁にハンダ(6)を用いて直接伝熱管(3
)が巻き付けられているので、第6図に示すように、金
網(/a)の素線の一部分だけが伝熱管(3)とハンダ
(6)で接触しているだけなので、伝熱管(3)と伝熱
体(1)との接触面積が小さく熱の移送効率が悪いとい
う問題点があった。[Problems to be Solved by the Invention] The conventional heat exchanger configured as described above uses solder (6) on the outer peripheral wall of the heat transfer body (1) to connect the heat transfer tubes (3) directly.
) is wrapped around the wire, as shown in Figure 6, only a part of the wire of the wire mesh (/a) is in contact with the heat exchanger tube (3) through the solder (6). ) and the heat transfer body (1) are small, resulting in poor heat transfer efficiency.
この発明は、上記のような問題点を解消するためになさ
れたもので、伝熱管と伝熱板との熱接触を完全にして熱
の移送効率の高い熱交換器を得ることを目的とする。This invention was made to solve the above-mentioned problems, and aims to obtain a heat exchanger with high heat transfer efficiency by perfecting thermal contact between heat exchanger tubes and heat exchanger plates. .
この発明に係る熱交換器は、伝熱体の外周壁面に面接触
した高熱伝導率のものからなる薄肉状の中間熱伝達体を
設け、この中間熱伝達体の外周壁面に高熱伝導率のもの
からなる伝熱管を螺旋状に接合したものである。The heat exchanger according to the present invention includes a thin-walled intermediate heat transfer body made of a material with high thermal conductivity that is in surface contact with the outer peripheral wall surface of the heat transfer body, and the outer peripheral wall surface of the intermediate heat transfer body is made of a material with high thermal conductivity. It is made by joining heat exchanger tubes in a spiral shape.
この発明の熱交換器においては、伝熱板の素線は中間熱
伝達体と接触し、かつ中間熱伝達体は伝熱管と接触して
いるので、伝熱管と伝熱体との間の接触面租は増大し、
熱の移動効率は向上する。In the heat exchanger of this invention, the wires of the heat transfer plate are in contact with the intermediate heat transfer body, and the intermediate heat transfer body is in contact with the heat transfer tube, so that the contact between the heat transfer tube and the heat transfer body is Taxes will increase;
Heat transfer efficiency is improved.
以下、この考案の実施例を図について説明する。 Hereinafter, embodiments of this invention will be described with reference to the drawings.
第1図はこの発明の一実施例を示す一部切欠き断面図、
第2図は第1図の要部拡大図であシ、第3図および第6
図と同一または相当部分は同一符号を付し、その説明は
省略する。FIG. 1 is a partially cutaway sectional view showing an embodiment of the present invention;
Figure 2 is an enlarged view of the main parts of Figure 1, Figures 3 and 6.
The same or corresponding parts as those in the figures are given the same reference numerals, and the explanation thereof will be omitted.
図において、(7)は伝熱体(1)の外周壁面に面接触
して巻き付けられている薄肉(例えば厚さ0./U)の
銅板からなる中間熱伝達体であシ、この中間熱伝達体(
り)の外周壁面には螺旋状にろう材であるハンダ(6)
を用いて伝熱管(3)が接合されている。In the figure, (7) is an intermediate heat transfer body made of a thin (for example, thickness 0./U) copper plate that is wound around the outer peripheral wall surface of the heat transfer body (1) in surface contact. Transmitter (
Solder (6), which is a brazing material, is spirally applied to the outer peripheral wall of the
The heat exchanger tubes (3) are joined using.
上記のように構成された熱交換器においては、金網(/
a)の素線は中間熱伝達体(7)と接触し、また中間熱
伝達体(り)には伝熱管(3)が容易に接触するので、
伝熱体(1)と伝熱管(3)との間の接触面積は増大し
、熱の移動効率は向上する。In the heat exchanger configured as above, wire mesh (/
The strands of a) contact the intermediate heat transfer body (7), and the heat exchanger tube (3) easily contacts the intermediate heat transfer body (ri), so
The contact area between the heat transfer body (1) and the heat transfer tube (3) increases, and heat transfer efficiency improves.
なお、上記実施例では一体の中間熱伝達体(り)を用い
た場合について説明したが、第3図に示すように中間熱
伝達体(7)を複数個に分割した中間熱伝達子(1)を
用いた場合には、中間熱伝達体(7)の軸線方向に%つ
て移動し伝熱管(3)内に侵入する熱は防止され、熱交
換器の熱交換効率はさらに向上する。また、第1図に示
すように伝熱管(3)に薄いテープ状の板をあらかじめ
ノ・ンダ(6)により接合したものを伝熱体(1)の外
周壁面に巻き付けて中間熱伝達体(7)を形成しても上
記実施例と同様の効果を奏する。さらに、伝熱板は金網
(/a)の代シにパンチメンタルを用いてもよい。さら
にまた、ろう材としてはハンダ(6)以外の例えば銀ろ
う、アルミニウムろうであってもよい。また、媒体とし
て第1の冷媒(コ)、第一の冷媒(ダ)を用いた低温熱
交換器について説明したが、高温の媒体を用いた高温用
熱交換器にもこの発明は適用できる。In addition, in the above embodiment, a case was explained in which an integrated intermediate heat transfer body (ri) was used, but as shown in FIG. ), the heat that moves in the axial direction of the intermediate heat transfer body (7) and enters the heat transfer tubes (3) is prevented, and the heat exchange efficiency of the heat exchanger is further improved. In addition, as shown in Fig. 1, a thin tape-shaped plate is bonded to the heat exchanger tube (3) in advance with a solder (6) and then wrapped around the outer peripheral wall of the heat exchanger (1) to form the intermediate heat exchanger ( Even if 7) is formed, the same effects as in the above embodiment can be obtained. Furthermore, a punch mental may be used for the heat transfer plate instead of the wire mesh (/a). Furthermore, the solder material may be other than solder (6), such as silver solder or aluminum solder. Further, although the description has been given of a low-temperature heat exchanger using the first refrigerant (co) and the first refrigerant (da) as the medium, the present invention can also be applied to a high-temperature heat exchanger using a high-temperature medium.
以上説明したように、この発明の熱交換器は、伝熱体と
伝熱管との間に中間熱伝達体を介在したことによシ、伝
熱体と伝熱管との間の接触面積は増大し、熱交換効率が
向上するという効果がある。As explained above, in the heat exchanger of the present invention, since the intermediate heat transfer body is interposed between the heat transfer body and the heat transfer tube, the contact area between the heat transfer body and the heat transfer tube is increased. However, it has the effect of improving heat exchange efficiency.
第1図はこの発明の一実施例による低温用熱交換器を示
す一部切欠き断面図、第2図は第1図の要部拡大図、第
3図はこの発明の他の実施例を示す一部切欠き断面図、
第y図はさらに他の実施例を示す要部斜視図、第5図は
従来の低温用熱交換器の一例を示す一部切欠き断面図、
第6図は第5図の要部拡大図である。
(1)・・伝熱体、(la)・・金網、Cs)・・第1
の冷媒、(3)・・伝熱管、(lI)・・第コの冷媒、
(6)・・ハンダ、(7)・・中間熱伝達体。
なお、各図中、同一符号は同−又は相当部分を示す。
兜1図
充2図
兇3図
4″−124
児40
売5図
%6図FIG. 1 is a partially cutaway sectional view showing a low temperature heat exchanger according to an embodiment of the present invention, FIG. 2 is an enlarged view of the main part of FIG. 1, and FIG. 3 is a diagram showing another embodiment of the present invention. A partially cutaway sectional view showing
Fig. y is a perspective view of a main part showing still another embodiment, Fig. 5 is a partially cutaway sectional view showing an example of a conventional low temperature heat exchanger,
FIG. 6 is an enlarged view of the main part of FIG. (1) Heat transfer body, (la) Wire mesh, Cs) First
refrigerant, (3)... heat exchanger tube, (lI)... refrigerant,
(6)...Solder, (7)...Intermediate heat transfer body. In each figure, the same reference numerals indicate the same or corresponding parts. Kabuto 1 figure 2 figures 3 figures 4''-124 children 40 sold 5 figures %6 figures
Claims (4)
る伝熱体と、この伝熱体の外周壁面に面接触して設けら
れている高熱伝導率のものからなる薄肉状の中間熱伝達
体と、この中間熱伝達体の外周壁面に螺旋状に接合され
ている高熱伝導率のものからなる伝熱管とを備え、前記
伝熱体の軸線方向に流れる媒体と前記伝熱管内を流れる
媒体との間で熱交換される熱交換器。(1) A heat transfer body made of laminated heat transfer plates made of materials with high thermal conductivity, and a thin-walled intermediate material made of materials with high thermal conductivity provided in surface contact with the outer peripheral wall surface of this heat transfer body. It comprises a heat transfer body and a heat transfer tube made of a material with high thermal conductivity that is helically joined to the outer peripheral wall surface of the intermediate heat transfer body, and a medium flowing in the axial direction of the heat transfer body and the inside of the heat transfer tube are connected. A heat exchanger that exchanges heat with a flowing medium.
記載の熱交換器。(2) The heat exchanger according to claim 1, wherein the heat exchanger plate is a copper wire mesh.
て配設されてなる複数個の中間熱伝達子から構成されて
いる特許請求の範囲第1項または第2項記載の熱交換器
。(3) The heat exchanger according to claim 1 or 2, wherein the intermediate heat transfer body is composed of a plurality of intermediate heat transfer elements arranged at regular intervals in the axial direction. vessel.
し第3項のいずれかに記載の熱交換器。(4) The heat exchanger according to any one of claims 1 to 3, wherein the brazing material is solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61307725A JPH0674954B2 (en) | 1986-12-25 | 1986-12-25 | Heat exchanger |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61307725A JPH0674954B2 (en) | 1986-12-25 | 1986-12-25 | Heat exchanger |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63161387A true JPS63161387A (en) | 1988-07-05 |
JPH0674954B2 JPH0674954B2 (en) | 1994-09-21 |
Family
ID=17972499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61307725A Expired - Lifetime JPH0674954B2 (en) | 1986-12-25 | 1986-12-25 | Heat exchanger |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0674954B2 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4825733U (en) * | 1971-07-29 | 1973-03-27 |
-
1986
- 1986-12-25 JP JP61307725A patent/JPH0674954B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4825733U (en) * | 1971-07-29 | 1973-03-27 |
Also Published As
Publication number | Publication date |
---|---|
JPH0674954B2 (en) | 1994-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |