JPS63161018A - 熱硬化性エポキシ樹脂組成物及びその製造方法 - Google Patents
熱硬化性エポキシ樹脂組成物及びその製造方法Info
- Publication number
- JPS63161018A JPS63161018A JP30772186A JP30772186A JPS63161018A JP S63161018 A JPS63161018 A JP S63161018A JP 30772186 A JP30772186 A JP 30772186A JP 30772186 A JP30772186 A JP 30772186A JP S63161018 A JPS63161018 A JP S63161018A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- zeolite
- curing
- curing accelerator
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 63
- 229920000647 polyepoxide Polymers 0.000 title claims description 63
- 239000000203 mixture Substances 0.000 title claims description 42
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000010457 zeolite Substances 0.000 claims description 49
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 46
- 229910021536 Zeolite Inorganic materials 0.000 claims description 45
- 239000003795 chemical substances by application Substances 0.000 claims description 28
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 17
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 238000001723 curing Methods 0.000 description 74
- 239000011148 porous material Substances 0.000 description 14
- 229920003986 novolac Polymers 0.000 description 11
- 230000009257 reactivity Effects 0.000 description 11
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- 238000004898 kneading Methods 0.000 description 9
- 238000001816 cooling Methods 0.000 description 7
- -1 tetraphenylphosphonium tetraphenylborate Chemical compound 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000001879 gelation Methods 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 238000010298 pulverizing process Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 2
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- UPKNKWDEBUCBDD-UHFFFAOYSA-N tris(1-methylcyclohexa-2,4-dien-1-yl)phosphane Chemical compound CC1(CC=CC=C1)P(C1(CC=CC=C1)C)C1(CC=CC=C1)C UPKNKWDEBUCBDD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30772186A JPS63161018A (ja) | 1986-12-25 | 1986-12-25 | 熱硬化性エポキシ樹脂組成物及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30772186A JPS63161018A (ja) | 1986-12-25 | 1986-12-25 | 熱硬化性エポキシ樹脂組成物及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63161018A true JPS63161018A (ja) | 1988-07-04 |
| JPH0478648B2 JPH0478648B2 (enrdf_load_stackoverflow) | 1992-12-11 |
Family
ID=17972448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30772186A Granted JPS63161018A (ja) | 1986-12-25 | 1986-12-25 | 熱硬化性エポキシ樹脂組成物及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63161018A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02133423A (ja) * | 1988-11-15 | 1990-05-22 | Ube Ind Ltd | エポキシ樹脂組成物 |
| US5244939A (en) * | 1989-10-06 | 1993-09-14 | Somar Corporation | Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition |
| EP0599600A3 (en) * | 1992-11-27 | 1995-02-01 | Ciba Geigy Ag | Molding process using a one-component epoxy resin composition. |
| JPH115890A (ja) * | 1997-06-18 | 1999-01-12 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| EP0899289A1 (de) * | 1997-08-29 | 1999-03-03 | Bakelite AG | Verfahren zur Herstellung von duroplastischen Formmassen |
-
1986
- 1986-12-25 JP JP30772186A patent/JPS63161018A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02133423A (ja) * | 1988-11-15 | 1990-05-22 | Ube Ind Ltd | エポキシ樹脂組成物 |
| US5244939A (en) * | 1989-10-06 | 1993-09-14 | Somar Corporation | Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition |
| EP0599600A3 (en) * | 1992-11-27 | 1995-02-01 | Ciba Geigy Ag | Molding process using a one-component epoxy resin composition. |
| JPH115890A (ja) * | 1997-06-18 | 1999-01-12 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| EP0899289A1 (de) * | 1997-08-29 | 1999-03-03 | Bakelite AG | Verfahren zur Herstellung von duroplastischen Formmassen |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0478648B2 (enrdf_load_stackoverflow) | 1992-12-11 |
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